Notice of Participation in IFIA JAPAN 2026

In the automotive and aerospace industries, efforts are being energetically pursued to develop materials and manufacturing technologies aimed at further weight reduction for improved fuel efficiency and reduced carbon dioxide emissions. This seminar will provide an easy-to-understand explanation for beginners about the trends in new material development and various additive manufacturing (AM) and manufacturing technologies using lightweight materials such as carbon fiber, aluminum, and ceramics. It will cover complex shape integrated molding, lattice/honeycomb structure molding, porous structure molding, and 3D printing techniques that are impossible with conventional processing methods, as well as topology optimization, all aimed at achieving ultra-lightweight components. The lightweighting of parts that can significantly differentiate from conventional and competitor components is an urgent and critical issue, with intense technological development competition occurring both domestically and internationally. 3D printing, which is seen as the next generation of parts manufacturing, offers a completely new perspective on AM technology, enabling the creation of innovative and attractive lightweight components that are difficult to achieve with traditional processing methods, while also realizing short-term, low-cost, and high-quality molding. Development cannot be expected to continue along the lines of existing technologies. By merging lightweight materials with 3D printing and utilizing topology optimization, we can achieve astonishing weight reduction in components.

EAI (Enterprise Application Integration), an automation solution for inter-system collaboration, offers a variety of products. Inter-system collaboration is necessary for various requirements such as improving data integration business efficiency and utilizing data in AI/BI, but the functions required from the platform and the optimal cost structure vary depending on the application and scale. On the other hand, the EAI market has a vast number of products, making it quite challenging for companies to select the most suitable product and implementation vendor. In this seminar, we will not only introduce the domestic representative products from Asteria and Saison Technology but also discuss key points to consider when evaluating EAI products, compare various products, recommend features, and provide demonstrations, all explained by technical members specializing in data integration. We welcome those who are working on inter-system collaboration, those considering EAI products, and those who want to understand the differences between domestic representative products to join us.

Speed Roll Co., Ltd. (Headquarters: Chuo-ku, Tokyo; CEO: Yang Cai) will exhibit at the "International Logistics Comprehensive Exhibition 2026" to be held at Tokyo Big Sight from September 8 (Tuesday) to September 11 (Friday), 2026. At our booth, we will showcase three models of automatic packaging machines that innovate the bagging, sealing, and labeling processes for e-commerce logistics: ◆ Speed Roll Horizontal: A horizontal automatic bagging machine compatible with poly and paper bag packaging. ◆ Speed Roll Air: Suitable for bagging into cushioned envelopes. ◆ Speed Roll Carton: Achieves automatic sealing and labeling for random sizes from post-in size to cardboard heights of 360mm. In addition to sales, we also offer rental options starting from 100,000 yen per month. This rare rental plan in the industry has received positive feedback from many companies as it allows for increased operational efficiency while keeping initial investment costs low. We invite you to take this opportunity to see the actual machines and experience the implementation image on-site. We sincerely look forward to your visit.

We plan to exhibit at the following trade show. We will showcase our gear reducers, jacks, and various demonstration machines. We look forward to welcoming many visitors. Trade Show Name: International Frontier Industry Messe 2026 Dates: September 3 (Thursday) to September 4 (Friday), 2026 Venue: Kobe International Exhibition Hall

On July 29, 2026 (Wednesday), we will hold a free webinar themed "Installation Space Issues for AI Edge Servers and Edge PCs." As the use of AI expands in the manufacturing and infrastructure sectors, are you facing challenges when introducing AI edge servers and industrial PCs to the field, such as: - Inability to secure installation space - Difficulty balancing performance and size - Demand for high reliability In this webinar, we will discuss "Space-saving and High-reliability Design for Different Applications," incorporating actual case studies, and explain the key points for selecting the most suitable AI edge servers and industrial PCs for your site. We will present configuration examples that consider the balance of installation space, performance, reliability, and cost, ranging from fanless AI edge PCs equipped with Jetson Orin to short-length GPU servers with a depth of less than 500mm. We hope you will take this opportunity to participate!