6/2 Webinar "AI Data Center Heat Dissipation/Cooling Technology"
■ Title: "Heat Dissipation/Cooling Technologies for AI Data Centers"
―― The rapid increase in data center power due to the expansion of generative AI. How to address PUE targets and high-heat GPUs. A practical overview from air cooling to liquid cooling, cold aisle, water cooling in-row, and immersion cooling. A strategic course to master thermal issues.
■ Date and Time: June 2, 2026 (Tuesday) 10:30 AM - 4:30 PM
■ Zoom Streaming (Archive available for missed sessions with materials)
【Knowledge Gained from the Seminar】
- Basic knowledge of heat transfer
- Heat dissipation knowledge in component and circuit board design
- Common thermal design methods for forced air cooling and natural air cooling equipment
- Thermal design methods for heat sinks, etc.
【Target Audience for the Seminar】
Electronic device designers (assembly design, mechanical design, circuit design, circuit board design), heat dissipation device/material developers, quality assurance, and quality control departments.

| Date and time | Tuesday, Jun 02, 2026 10:30 AM ~ 04:30 PM |
|---|---|
| Entry fee | Charge - General: 55,000 yen (tax included) - Newsletter members: 49,500 yen (tax included) |
Inquiry about this news
Contact Us OnlineMore Details & Registration
Details & Registration





