Selection Method for Thermal Conductive Materials (TIM) and Usage Trends in AI Data Centers and Automotive Equipment [Web Seminar]

The "International Fermentation and Brewing Food Industry Exhibition" is Japan's only specialized exhibition that brings together ingredients, materials, research equipment, manufacturing facilities, testing equipment, and packaged products related to fermentation and brewing. In 2013, "Washoku" (Japanese cuisine) and in 2024, "Traditional Sake Brewing" were registered as UNESCO Intangible Cultural Heritage, increasing interest in Japan's fermentation and brewing industry. This exhibition will be grandly held at Tokyo Big Sight as a platform to promote the development of the industry and the richness of food culture to the world, and to spread Japan's proud fermented and brewed foods.

Gathering the wisdom of the DOWA Group towards the realization of a decarbonized society! We would like to introduce the initiatives of each DOWA Group company. We look forward to seeing you at our booth!

Heat pipes are passive heat transfer devices that utilize latent heat of vaporization in a two-phase system and do not require driving energy. Heat pipes have very high thermal conductance, with their equivalent thermal conductivity being several hundred times higher than that of a copper rod of the same size. The primary application of heat pipes is in the cooling of computers and electronic products. Recently, AI servers and data centers have gained attention; for example, nVidia's GPUs can reach heat generation of up to 1 kW, employing water-cooled cold plates and 3D vapor chambers. Air cooling is limited to 800 W, while nVidia's Ruben GPU can reach 2 kW, utilizing water-cooled microchannel cold plates, among others. In response to further increases in heat generation, vapor chamber composite cold plates, two-phase pump loop cooling, and impingement cooling have been developed. Additionally, recent cooling cases for batteries, motors, and IGBTs in electric vehicles will be discussed.

In the past, thermal design primarily focused on complex heat transfer through convection and radiation to the atmosphere. However, with the increase in surface-mounted components and power density, the heat dissipation pathways are gradually shifting to thermal conduction through substrates and enclosures. One of the key heat dissipation devices to promote heat transfer in limited spaces is TIM (Thermal Interface Material). A wide variety of TIMs have been developed in the market, and in recent years, key areas where TIMs are widely used include AI data centers and automotive equipment centered around electric vehicles (EVs). In this course, we will first explain the overview of heat dissipation design in AI data centers and automotive equipment, and in the latter half, we will provide a detailed explanation of the thermal and mechanical properties of TIMs in these two fields, as well as important considerations when selecting TIMs.

An explanation of the economic viability, technology, projects, and industry trends and outlook for thermal energy storage and thermoelectric batteries, which are attracting attention for their use in unused heat utilization, energy storage, and renewable energy load leveling. Part 1 Technological and business outlook for thermal energy storage and thermoelectric batteries both domestically and internationally Part 2 Fundamentals, components, technology, and application outlook of thermophotovoltaic (TPV) power generation systems