VOXIA box X-ray CT imaging device

□◼️Desktop X-ray CT imaging device◼️□ Compact, space-saving, and high-level analysis at an affordable price!

Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. ◉ VCap (Data Acquisition Program): Custom-made shooting stage tailored to the subject and purpose. ◉ VCT (CT Image Calculation Program): Customizable automatic measurement and analysis software specialized for the specified subject. ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were previously difficult with other software. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.

• X-ray inspection equipment
• X-ray Inspection Machine

□◼️X-ray CT imaging device (medium) ◼️□ Voxia series medium size 6-axis CT imaging axis configuration Custom design available to suit applications

Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. ◉ VCap (Data Acquisition Program): A custom-made shooting stage tailored to the subject and purpose. ◉ VCT (CT Image Calculation Program): Customizable automatic measurement and analysis software specialized for the specified subject. ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were previously difficult with other software. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.

• X-ray inspection equipment
• X-ray Diffraction Equipment
• X-ray Inspection Machine

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

◉ Maximum operating temperature Max2000℃ ◉ Customizable heater structure: - Cylindrical heater: for sintering samples in a crucible (for solid, powder, granular, and pellet-shaped samples) - Flat heater: for sintering Φ1" to Φ6" wafers and small chip samples ◉ PLC semi-auto control All operations except for temperature adjustment are performed via a touch panel screen. No need for cumbersome valve opening/closing or pump activation; the "vacuum/purge" cycle before sintering and "vent" after sintering are performed automatically with one button. ◉ Up to 3 MFCs for automatic flow control (or manual adjustment) ◉ APC automatic pressure control ◉ Ensuring safety during operation Monitoring for cooling water abnormalities, chamber temperature abnormalities, and overpressure abnormalities. Constructed from robust SUS material, the water-cooled chamber can be safely used even during continuous operation at maximum temperature. ◉ Compact and space-saving Dimensions: Width 603 x Depth 603 x Height 1,160mm (*installed within the rotary pump housing) Various heating experiments for small samples in laboratories, such as ultra-high temperature heating experiments and new material research and development, can be easily conducted. The main unit is compact yet suitable for research and development in a wide range of fields.

• Heating device

6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely accommodates various purposes from research and development to small-scale production.

◾️ Max 2000℃ ◾️ Effective heating range: Φ6 to Φ8 inch single leaf type, or batch type (multi-stage 5-sheet cassette) ◾️ Heater control: 1 zone or 2 zones (cascade control) ◾️ Heater materials: ・C/C composite: Φ6 to Φ8 inch ・PG coating high-purity graphite: Φ6 to Φ8 inch ◾️ Operating atmosphere: ・Vacuum (1x10-2Pa), inert gas (Ar, N2) ◾️ PLC semi-automatic operation ・Automatic sequence control for vacuum/purge cycle and venting ・Full automatic operation (optional) ・Touch panel operation, allowing centralized management without dispersed control. ◾️ Process pressure control ・APC control (MFC flow, or automatic opening adjustment valve PID loop control) ・Maximum 3 systems of MFC flow automatic control, or manual adjustment of float meter/needle valve ◾️ PLOT screen graph display, CSV data output

• Annealing furnace

Tabletop small-sized experimental furnace - space-saving, with a maximum operating temperature of 2000°C! We also manufacture metal furnaces for reducing atmospheres.

◉ Tabletop size, space-saving: 328(W) x 220(D) x 250(H)mm (*Reference value for 2-inch chamber) ◉ Customizable heater structure: - Cylindrical heater: For sample sintering in crucibles (for solid, powder, granule, and pellet-shaped samples) - Flat heater: For sintering Φ1" to Φ6" wafers and small chips ◉ Fast heating time of approximately 15 minutes (to 1500℃), cooling from 1500℃ to 100℃ in about 40 minutes (in vacuum and gas replacement atmosphere) ◉ High specifications & high cost performance ◉ Simple structure, excellent operability Various high-temperature heating experiments for small samples in laboratories, as well as research and development of new materials, can be easily conducted with simple operations. The main unit is compact yet suitable for research and development in a wide range of fields.

• Heating device
• Other heaters
• Electric furnace

Compact, space-saving, energy-efficient! High-performance ultra-high temperature experimental furnace for R&D.

Max 2900℃ (carbon furnace), Max 2400℃ (metal furnace) - Effective heating area 70 x 70 x 100 mm Supports various applications in new material development and advanced basic technology development sectors such as semiconductors, electronic components, fuel cells, and solar cells.

• Annealing furnace

High-performance, cost-effective RF/DC magnetron sputtering system for research and development.

High-Performance RF/DC Magnetron Sputtering Equipment ● Achievable pressure: 5 x 10^-5 Pa (*1 x 10^-4 Pascal in the fastest 30 minutes!) ● 3 x Manetron cathodes: Sequential multi-layer film, 2 sources' co-deposition ● Film uniformity ±3% ● Various options: Substrate rotation and Z-shift, substrate heating (Max 500℃), cathodes for magnetic targets, and more ◉ nanoPVD can be used for various purposes, including up to 3 sputter sources + 3 gas flow control (MFC control), RF/DC PSU upgrade (up to 2 power supplies), sequential multi-layer film, and 2 sources' co-deposition (RF/DC or DC/DC only). - Insulating films - Conductive metal films - Compounds, etc. 【Main Features】 ◉ Substrate size: Up to Φ4 inch ◉ 2" cathodes x up to 3 sources ◉ 7" touch panel for easy operation with PLC automatic process control ◉ APC automatic pressure control ◉ High-precision process control with capacitance manometer ◉ 1 Ar gas system (standard) + N2, O2 expandable up to 3 systems ◉ USB port for connection to Windows PC, allowing the creation and storage of recipes for up to 1000 layers and 50 films. Data logging on PC ◉ Other various options available

• Sputtering Equipment
• Evaporation Equipment
• Other semiconductor manufacturing equipment

Max 1000℃, maximum 3 systems for MFC, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)

High-temperature processing up to 1000°C is possible with a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of three systems, allowing for firing operations at precisely adjusted process gas pressures (with the APC automatic process control system option). Additionally, there are many options available, including a front viewport, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature. - Halogen lamp heater: Max 500°C - C/C composite heater: Max 1000°C (only in vacuum or inert gas) - SiC coating heater: Max 1000°C (in vacuum, inert gas, O2)

• Annealing furnace

<30W Low power - Etching control precision 10mW Achieving damage-free and delicate etching processing.

【nanoETCH】Model. ETCH5A Achieves fine and damage-free etching processing with low output RF etching at <30W (control accuracy 10mA). A jointly developed product with the graphene research group at the University of Manchester, led by Nobel Prize winners who discovered graphene in 2010.

• Etching Equipment

Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.

The nanoPVD-ST15A is a composite thin film experimental device that can simultaneously install a resistance heating deposition source, an organic deposition source, and a Φ2 inch magnetron sputtering cathode. It is bench-top sized and space-saving, making effective use of limited lab space. It is not a coater for microscope sample preparation; it can create high-quality thin films required for research and development applications such as electronic circuit boards, batteries, MEMS, and new material development. It is equipped with a maximum of three gas systems (process pressure APC automatic control), continuous automatic film formation (up to 20 layers), and simultaneous deposition from two sources, along with a variety of other features. Additionally, it offers options such as a substrate heating heater (up to 500°C) and a dry scroll pump. Vacuum pumping, film formation control, venting, recipe creation, as well as failure analysis and logging can all be operated via a 7" touch panel on the front, allowing for centralized management of operations. The IntelliLink software is included: it connects to a Windows PC via USB cable for remote monitoring, offline recipe creation, downloading and uploading, and log saving. It supports various applications in the development of new materials and new material development, as well as in advanced fundamental technology development sectors such as semiconductors, electronic components, fuel cells, and solar cells.

• Sputtering Equipment
• Evaporation Equipment

Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.

Three types of film formation components are installed in the chamber: resistance heating evaporation source (metal evaporation), organic evaporation source (organic materials), and magnetron sputtering (metal and insulating materials), allowing for various thin film experimental setups to be accommodated within a single chamber. ◉ Three combinations are available: 1. Sputter cathode + resistance heating evaporation source x2 2. Sputter cathode + organic evaporation source x2 3. Sputter cathode + resistance heating source x1 + organic evaporation source x1 (*DC sputtering only) - Evaporation range: Φ4 inch / Φ100 mm - Vacuum exhaust system: Turbo molecular pump + auxiliary pump (rotary or dry scroll pump) - Substrate rotation and vertical lifting stage - Max 500℃ substrate heating heater - Quartz oscillator film thickness sensor - 7” touch panel HMI operation (includes 'IntelliLink' Windows PC remote monitoring software)

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

◉ Short time: Easily conduct graphene synthesis experiments in just 30 minutes per batch. ◉ High-precision temperature and pressure control. ◉ Sophisticated software.

◉ High efficiency and high precision process control using cold wall method ◉ Rapid heating: 1100℃ in approximately 3 minutes ◉ High precision temperature control: ±1℃ ◉ High precision APC automatic pressure control system: 3 gas lines (Ar, H2, CH4) ◉ Standard recipe included for graphene production ◉ Compact size: 405(W) x 415(D) x 280(H)mm

• CVD Equipment

Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film formation method. A compact thin-film experimental device that can accommodate various research applications.

**Flexible System** The MiniLab thin film experimental device series allows for easy construction of a compact device configuration without waste, even as a customized product, by incorporating suitable components (such as deposition sources and stages) and control modules according to the required deposition methods and materials from a wide range of options. By configuring the device with a modular control unit in a Plug&Play manner, the application range expands, enabling various thin film process experiments. The MiniLab series is a high cost-performance system that caters to a wide range of applications from research and development to small-scale production. **Small Footprint & Space Saving** - Single Rack Type (MiniLab-026): 590(W) x 590(D)mm - Dual Rack Type (MiniLab-060): 1200(W) x 590(D)mm - Triple Rack Type (MiniLab-125): 1770(W) x 755(D)mm **Excellent Operability & Intuitive Operation Screen** Windows PC or 7” touch panel. Easy operation that does not require advanced skills, while ensuring maximum safety.

• Sputtering Equipment

Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.

This is a flexible R&D thin film experimental device that achieves minimal waste, compact size, simple operation, and high cost performance by integrating the necessary minimum modules and controllers into a 19" compact rack with a Plug&Play feel. It supports magnetron sputtering (up to 3 sources) or resistance heating evaporation (metal sources up to 4, organic materials x4), and it can also be equipped with a substrate heating stage for annealing and plasma etching. A glove box storage type is also available (*specifications to be discussed). We offer a wide range of optional components that can be flexibly customized. ◉ Maximum substrate size: Φ6 inch ◉ Resistance heating evaporation source filament, crucible, boat type (up to 4 sources) ◉ Organic evaporation source: 1cc or 5cc ◉ Φ2 inch magnetron cathode (up to 3 sources) ◉ Dry etching ◉ Glove box compatible (optional, specifications to be discussed) ◉ Other options: simultaneous deposition from 2 sources, HiPIMS, automatic thin film controller, custom substrate holder, substrate rotation/lifting, substrate heating, and many other options available. *Please first contact us with your required specifications, and we will configure the system to meet your needs.

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.

Compact/Space-saving, High-spec Thin Film Experiment Equipment Can be combined with the following deposition sources: - Resistance heating deposition source x up to 4 - Organic deposition source x up to 4 - Electron beam deposition - 2-inch magnetron sputtering cathode x 4 - Plasma etching: Can be installed in either the main chamber or the load lock chamber 【Small Footprint & Space-saving】 - Dual rack type (MiniLab-060): 1200(W) x 590(D)mm 【Excellent Operability & Intuitive Operation Screen】 Windows PC or 7” touch panel. Easy operation regardless of skill level, with maximum safety considerations.

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

Flexible configuration available upon request for processes such as evaporation, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during evaporation.

The ML-080, composed of a D-type box chamber with a volume of 80 liters and dimensions of 400(W)x400(D)x570(H)mm, features a higher chamber compared to the 060 model, resulting in a longer TS distance adjustment range and improved film uniformity during deposition on large-diameter substrates. It is an optimal model for vacuum deposition and is a higher-end version of the ML-060, which can also accommodate a load lock mechanism. Like the 060, it is compact yet supports a wide range of applications including resistance heating deposition (for metals, insulators, and organic materials), EB deposition, RF/DC/Pulse DC compatible magnetron sputtering, RIE plasma etching, and annealing. - Maximum substrate size: Φ10 inch - Resistance heating deposition sources: up to 4 sources - Organic deposition sources: up to 4 sources - Magnetron sputtering cathodes: 4 sources - Electron beam deposition - Substrate heating stage (standard 500℃, max 1000℃) - *Plasma etching / <30W soft etching *Plasma etching can be installed in both the main chamber and the load lock chamber.

• Evaporation Equipment

Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.

MiniLab-080 glove box model with an 80ℓ large capacity chamber designed to be stored within a glove box bench. It features a slide-open and close chamber that maximizes the use of the workbench, and a rear-opening door designed with maintenance in mind. Samples processed can be consistently handled within a controlled environment inside the glove box without exposure to the atmosphere or moisture. For specifications of the GB gas purification unit, please refer to the GB model. ◉ Resistance heating evaporation source x up to 4 ◉ Organic evaporation source x up to 4 ◉ Magnetron sputtering cathode x 4 ◉ Electron beam evaporation ◉ Dry etching ◉ Annealing

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

Compact and space-saving! Ideal for organic thin film development, all processes such as deposition, sputtering, and annealing can be seamlessly performed within the glove box.

In the film formation process of 2D materials such as OLED (Organic EL), OPV (Organic Photovoltaic), OTFT (Organic Thin Film Transistor), graphene, and TMD (Transition Metal Dichalcogenides), it is necessary to handle samples in an inert gas atmosphere isolated from oxygen and moisture. The MiniLab-026/090-GB achieves a "oxygen and moisture-free" experimental environment for organic film applications by housing the PVD chamber within the GB, creating a compact and space-saving environment. 【Features】 ◉ A series of processes such as PVD film formation, spin coating, and hot plate baking can be performed seamlessly within the GB without exposing them to the outside air. ◉ Space-saving: The chamber does not protrude from the back, so it does not take up space. 【MiniLab Models】 ◉ MiniLab-026 (26ℓ volume): Metal/insulator/organic material deposition, sputtering, plasma etching, annealing ◉ MiniLab-090 (90ℓ volume): Metal/insulator/organic material deposition, EB deposition, sputtering, plasma etching, annealing * Please first contact us with your required specifications, and we will configure the system according to your needs.

• Evaporation Equipment

It is a high-performance vacuum deposition source that can be used as a high-temperature heating cell for vacuum applications, with an organic deposition source up to 800°C and a metal deposition source up to 1500°C.

The OLED evaporation source is a high-temperature deposition source for vacuum deposition with a maximum operating temperature of 1500°C. By simply replacing the body without removing the fixed base, you can switch between cells for low-temperature organic deposition (up to 800°C) such as OLEDs and high-temperature heating (up to 1500°C) cells. If used as a source for vacuum film formation, a shutter actuator is also provided. When used as a high-temperature heater above 800°C, it features an internal shield structure designed with insulation and thermal shielding in mind. The shutter adopts a flip type. Even if multiple OLED sources are installed in the chamber, they will not interfere with other components. The crucible can be removed simply by taking off the upper cap, making the material filling and replenishment process hassle-free. The main body is available for 1cc crucibles (maximum filling amount 1.5cc) and 10cc crucibles (maximum filling amount 15cc), and can be exchanged by replacing the main body with the base without removing the fixed base from the chamber. Thermocouples can be specified as either K or C types. Crucibles can be selected from alumina (standard), quartz, PBN, and carbon.

• Evaporation Equipment
• Heating device
• Electric furnace

CVD, PVD (evaporation, sputtering, etc.) high vacuum, ultra-high temperature plate heater for wafer and small chip heating with excellent uniformity and reproducibility.

This is a film deposition device and high vacuum compatible hot plate for vacuum thin film experiments, featuring a heater plate made of Inconel or BN plate, with excellent thermal radiation efficiency and superior uniformity. 【Product Lineup】 ◎ SH-IN (Inconel Plate): φ1.0 to φ6.1 inch for vacuum, O2, and active gases ◎ SH-BN (BN Plate, Mo Cover): φ2.1 to φ6.1 inch for vacuum and inert gases 【Features】 ◎ Maximum temperature 1100℃ (SH-BN), 850℃ (SH-IN) ◎ Rapid heating ◎ In-plane temperature distribution within ±2% ◎ Control accuracy and reproducibility ±1℃ ◎ Low cost ◎ Short delivery time (standard about 2 weeks *excluding flanges, rotation and vertical mechanisms, mounting brackets, etc.)

• CVD Equipment
• Annealing furnace
• Other semiconductor manufacturing equipment

High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.

【Features】 - Compatible with high vacuum - Available in sizes Φ2 inch, Φ3 inch, Φ4 inch - Adopts a clamp ring type, no bonding required - Excellent maintainability, easy target replacement - Rich options including shutters, chimney ports, gas injection, high-strength magnets for magnetic materials, etc. - Compatible with various flange sizes for connection

• Sputtering Equipment

This is a heater for thin film experiments such as PVD and CVD, featuring excellent uniformity, heating characteristics, and controllability. RF/DC bias specifications are also available.

High vacuum compatible with a variety of heater material options. Applicable for various vacuum thin film experiments such as PVD (sputtering, evaporation, EB, etc.), CVD, high-temperature vacuum annealing, and high-temperature sample analysis substrate stages. Custom-made solutions are available to meet various specifications. 【Features】 ● Semi-custom product. Designed and manufactured according to your requirements. ● Easy replacement of spare heater wires. ● Easy installation and maintenance (M6 stud bolts, supports). ● Compatible with RF/DC bias and substrate rotation. 【Standard Accessories】 ● Thermocouple: wire type with alumina insulating sleeve. ● Mounting stud bolts. 【Options】 ● RF (150W)/DC (1KW) bias application. ● Non-standard heater wires (Nb, Mo, Pt/Re, WRe, etc.). ● Substrate holding clips. ● Mounting brackets. ● Substrate holders. ● Tapped holes for holder installation. ● Change of top plate material (PBN, quartz, carbon, Inconel, etc.). ● Additional thermocouples for overheating protection. ● Base flange, vacuum feedthrough.

• Heating device

Easy setup with a high-performance touch panel converter, data logging, and data storage on a microSD card. PM2.2 can also measure glossy metal surfaces.

**Overview** With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*There is also an option for a converter without a display.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurements in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving devices such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting measurements of high temperatures (Max 2000℃) and glossy metallic surfaces. **Features** ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, Repeatability ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm

• Temperature and humidity measuring instruments

Parameters such as temperature range, emissivity, and alarms can be set using a smartphone or tablet, allowing for easy configuration without the need for a display instrument or power supply for the instrument.

● You can use a smartphone or tablet to perform the settings. ● Download the dedicated app for free from Google Play (Android 4.1 to 5.1). ● Using Android's NFC communication, simply touch the sensor part to read and write data. ● Ultra-compact sensor (Φ31mm x t29mm) allows temperature measurement in narrow spaces. ● Fast response time of 125 msec, high accuracy of ±1.5%. ● Voltage output (0-5V or 0-10V), or K thermocouple output.

• Temperature and humidity measuring instruments

TIIS (Technical Institution of Industrial Safety) certification obtained for intrinsically safe explosion-proof radiation temperature sensors, suitable for use in hazardous locations (Zone 0, 1, & 2).

ExTemp is an intrinsically safe explosion-proof radiation temperature sensor that can be used in hazardous material handling equipment and factories such as petrochemical plants, pharmaceutical factories, and chemical plants. (TIIS type certification number: 21097)

• Temperature and humidity measuring instruments
• Radiation thermometer
• Temperature and Humidity Control

USB connection type, parameter settings and data management with the included dedicated software. A wide range of wavelength options is available. Three models can be selected based on your purpose.

【Overview】 Connect to a Windows PC using the standard accessory "CalexConfig" and the included USB cable (1.8m), allowing for the configuration of sensor measurement parameters, analysis of measurement results, and CSV output on the PC. 1) 4-20mA output 2) USB output (operates on USB bus power) 3) Simultaneous use of 4-20mA/USB output These three usage methods are possible. 【Features】 ◎ Simultaneous use of USB data logging and 4-20mA analog output ◎ Excellent basic performance: accuracy ±1%, reproducibility ±0.5%, 200msec fast response ◉ PUA2: Covers short wavelengths from 2.0 to 2.4μm, capable of measuring metal surfaces ◉ PUA5: Suitable for measuring glass surfaces at a wavelength of 5μm ◉ PUA8: General-purpose, applicable to a wide range of materials such as paper, wood, plastic, and textiles at a wavelength of 8-14μm

• Temperature and humidity measuring instruments

USB-connected compact infrared temperature sensor, no power supply needed, powered by USB bus power from PC, parameter settings and data management with included dedicated software.

【Overview】 Install the standard accessory "Calexsoft," and then simply connect it to a Windows PC via USB cable. You can easily set measurement parameters, conduct measurements, and analyze/export results in CSV format on your PC with a Plug & Play feel. USB output operates solely on USB bus power when connected to a PC, requiring no external power supply. The application range expands in various industrial fields and research institution laboratories. 【Features】 ◎ USB data logging ◎ Wide range: -20℃ to +1000℃ ◎ Excellent basic performance: accuracy ±1%, reproducibility ±0.5%, 125msec fast response ◎ Emissivity adjustment range: 0.2 to 1.0 ◎ Measurement wavelength range: 8 to 14μm ◎ Compact size Φ18mm x 45mm

• Temperature and humidity measuring instruments

Compact measurement, robust body, high precision ±1%, 240msec fast response. It can be applied for industrial machine control, temperature monitoring in production sites, and various other purposes.

**Overview** The "PyroCouple" from Calex Electronics in the UK is a compact, lightweight, low-cost, and high-performance infrared temperature sensor that is unlike any other. It can measure the surface of objects that are "moving," "rotating," or "cannot be touched" non-contactly, allowing for fast and highly reproducible temperature control. **Features** ◎ Integrated amplifier and sensor ◎ 4-20mA output (standard), 0-50mV, thermocouple K, J, T output (optional) ◎ Accuracy: ±1% or ±1℃ (whichever is greater) ◎ Reproducibility: ±0.5% or ±0.5℃ (whichever is greater) ◎ Response time: 240 msec ◎ Protection rating: IP65

• Thermometer

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding repair methods can change the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or variations in dimensions, can be molded at the same time in one molding process. This allows for the verification of multiple types in a short period.

The pinhole inspection for packaging engineering is fully automated, eliminating packaging defects based on certain quality standards. The judgment results and operational status can be managed via a monitor screen. - Quantitative management of quality standards for the pinhole inspection process - Ensuring the quality of the product's shelf life - Establishing evaluation criteria for the manufacturing process, achieving quantitative quality assurance - Slim and space-saving design that can be connected to existing production lines - Quick changeover for product variety switching can be handled in a short time by exchanging chambers - Fully domestically produced, allowing for rapid maintenance and troubleshooting - Example target works: pillow packaging, packaged rice (packaged cooked rice), etc. *Please consult us regarding the use of this product for pharmaceuticals.

Fukuda Corporation has been pursuing leak detection for 60 years and is dedicated to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing performance. We will propose suitable testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

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