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  3. テルモセラ・ジャパン 本社
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テルモセラ・ジャパン 本社

addressTokyo/Chuo-ku/2nd floor, Shinmakicho Building Annex 1, 3-2-14 Nihonbashi
phone03-6214-3033
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last updated:Jan 14, 2025
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テルモセラ・ジャパン List of News Articles

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  • Publication year : 2026

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【PyroCV】Infrared Temperature Sensor for Construction Machinery and Work Vehicles

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PyroCV is suitable for temperature measurement of asphalt and non-reflective building materials. It can also be widely used for temperature measurement of non-ferrous metals, concrete, and painted surfaces that do not reflect. ● Stable high-speed response performance: 125 msec ● Two types of output options: voltage output (0-5V), CAN BUS communication output ● Durability: Robust body made of SUS316, protection rating IP67/IP65 ● Compliance standard: Conforms to EMC standards ISO 13766-1 for construction machinery ● Rugged design that can withstand the harsh environments of road paving work ● Equipped with M12 (5-pin) waterproof connector for easy wiring and disconnection PyroCV is suitable for tests that comply with the electrical load testing standard ISO 16750-2 for automotive equipment. Additionally, compliance with ISO 13766-1 provides load dump surge suppression while maintaining equivalent performance to the same electrical system. 【Main Applications】 ⚪︎ Asphalt paving ⚪︎ Road rollers ⚪︎ Concrete processing and curing, etc.

Sep 06, 2026

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テルモセラ・ジャパン

VOXIA box X-ray CT imaging device

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Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 0–150kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 49.5μm, 6.75 million pixels! * Sample size: Φ100mm ◉ Vcap (control software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (reconstruction software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with an image size of 992 x 992 pixels and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D display analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.

Sep 05, 2026

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テルモセラ・ジャパン

VOXIA compact X-ray CT imaging device

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Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.

Sep 05, 2026

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テルモセラ・ジャパン

Vacuum deposition device □■□【MiniLab-LT080A】□■□ Capable of various deposition applications such as resistance heating, organic deposition, and electron beam deposition.

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The ML-080, with a volume of 80 liters and dimensions of 400(W)x400(D)x570(H)mm, is composed of a D-type box chamber. It has the same configuration as the 070 model but features a taller chamber, resulting in a longer TS distance adjustment range and improved film uniformity during deposition on large-diameter substrates, making it an optimal model for vacuum deposition. It is a higher-end model than the ML-070, which can also accommodate a load lock mechanism. Like the 070, it is compact yet supports a wide range of applications including resistance heating deposition (for metals, insulators, and organic materials), electron beam deposition, RF/DC/PulseDC compatible magnetron sputtering, RIE plasma etching, and annealing. - Maximum substrate size: Φ11 inch - Resistance heating deposition source x up to 4 units - Organic deposition source x up to 4 units - Magnetron sputtering cathode x 4 units - Electron beam deposition - Substrate heating stage (standard 500℃, Max 1000℃) - *Plasma etching / <30W soft etching *Plasma etching can be installed in both the main chamber and the load lock chamber.

Jul 28, 2026

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MiniLab-080-550_2020.jpg

□■□【MiniLab-080】Flexible Thin Film Experimental Device□■□ Can be configured flexibly according to requirements for processes such as deposition, sputtering, EB deposition, and organic deposition.

  • Product news

The ML-080, with a volume of 80 liters and dimensions of 400(W)x400(D)x570(H)mm, is composed of a D-type box chamber. It has the same configuration as the 070 model but features a taller chamber, which extends the TS distance adjustment range and improves film uniformity during deposition on large-diameter substrates, making it an optimal model for vacuum deposition. It is a higher-end model than the ML-070, which can also add a load lock mechanism. Like the 070, it is compact yet supports a wide range of applications including resistance heating deposition (for metals, insulators, and organic materials), EB deposition, RF/DC/PulseDC compatible magnetron sputtering, RIE plasma etching, and annealing. - Maximum substrate size: Φ11 inch - Resistance heating deposition sources x up to 4 units - Organic deposition sources x up to 4 units - Magnetron sputtering cathodes x 4 units - Electron beam deposition - Substrate heating stage (standard 500℃, Max 1000℃) - *Plasma etching / <30W soft etching *Plasma etching can be installed in both the main chamber and the load lock chamber.

Jul 27, 2026

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