□■□【MiniLab-080】Flexible Thin Film Experimental Device□■□ Can be configured flexibly according to requirements for processes such as deposition, sputtering, EB deposition, and organic deposition.

Flexible configuration available upon request for processes such as evaporation, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during evaporation.

The ML-080, composed of a D-type box chamber with a volume of 80 liters and dimensions of 400(W)x400(D)x570(H)mm, features a higher chamber compared to the 060 model, resulting in a longer TS distance adjustment range and improved film uniformity during deposition on large-diameter substrates. It is an optimal model for vacuum deposition and is a higher-end version of the ML-060, which can also accommodate a load lock mechanism. Like the 060, it is compact yet supports a wide range of applications including resistance heating deposition (for metals, insulators, and organic materials), EB deposition, RF/DC/Pulse DC compatible magnetron sputtering, RIE plasma etching, and annealing. - Maximum substrate size: Φ10 inch - Resistance heating deposition sources: up to 4 sources - Organic deposition sources: up to 4 sources - Magnetron sputtering cathodes: 4 sources - Electron beam deposition - Substrate heating stage (standard 500℃, max 1000℃) - *Plasma etching / <30W soft etching *Plasma etching can be installed in both the main chamber and the load lock chamber.

• Evaporation Equipment

Compact and space-saving! Ideal for research and development, flexible configuration for purposes such as deposition, sputtering, and annealing.

This is a flexible thin film experimental device for R&D that achieves minimal waste, compact size, simple operation, and high cost performance by integrating the necessary minimum modules and controllers into a 19" compact rack with a Plug&Play feel. It supports magnetron sputtering (up to 3 sources) or resistance heating evaporation (metal sources up to 4, organic materials x4), and can be equipped with a substrate heating stage, allowing for the production of annealing devices and plasma etching. There is also a glove box storage type available (specifications to be discussed). A wide range of optional components that can be flexibly customized is available. ◉ Maximum substrate size: Φ6 inch ◉ Resistance heating evaporation source filament, crucible, boat type (up to 4 sources) ◉ Organic evaporation source: 1cc or 5cc ◉ Φ2 inch magnetron cathode (up to 3 sources) ◉ Dry etching ◉ Glove box compatible (optional, specifications to be discussed) ◉ Other options: simultaneous deposition from 2 sources, HiPIMS, automatic thin film controller, custom substrate holders, substrate rotation/lifting, substrate heating, and many more options available. * Please first contact us with your required specifications, and we will configure the system according to your needs.

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.

Compact/Space-saving, High-spec Thin Film Experiment Device Combination possible from the following deposition sources: - Resistance heating deposition source x up to 4 - Organic deposition source x up to 4 - Electron beam deposition - 2-inch sputtering cathode x 4 (or 3-inch x 3, 4-inch x 2) - Plasma etching: Can be installed in either the main chamber or the load lock chamber 【Small Footprint/Space-saving】 - Dual rack type (MiniLab-060): 1200(W) x 590(D)mm 【Excellent Operability/Intuitive Operation Screen】 Windows PC or 7” touch panel. Easy operation regardless of skill level, with maximum safety considerations.

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

Flexible configuration available upon request for methods such as deposition, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during deposition.

The ML-080, with a volume of 80 liters and dimensions of 400(W)x400(D)x570(H)mm, is composed of a D-type box chamber. It has the same configuration as the 060 model but features a taller chamber, which extends the TS distance adjustment range and improves film uniformity during deposition on large-diameter substrates, making it an optimal model for vacuum deposition. It is a higher-end model than the ML-060, which can also accommodate a load lock mechanism. Like the 060, it is compact yet supports a wide range of applications including resistance heating deposition (for metals, insulators, and organic materials), EB deposition, RF/DC/PulseDC compatible magnetron sputtering, RIE plasma etching, CVD, and annealing. - Maximum substrate size: Φ10 inches - Resistance heating deposition sources x up to 4 sources - Organic deposition sources x up to 4 sources - Magnetron sputtering cathodes x 4 sources - Electron beam deposition - Substrate heating stage (standard 500°C, max 1000°C) - *Plasma etching / <30W soft etching - CVD (thermal CVD, PECVD) *Plasma etching can be installed in both the main chamber and the load lock chamber.

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.

MiniLab-080 glove box model with an 80ℓ large capacity chamber designed to be stored within a glove box bench. It features a slide-open and close chamber that maximizes the use of the workbench, and a rear-opening door designed with maintenance in mind. Samples processed can be consistently handled within a controlled environment inside the glove box without exposure to the atmosphere or moisture. For specifications of the GB gas purification unit, please refer to the GB model. ◉ Resistance heating evaporation source x up to 4 ◉ Organic evaporation source x up to 4 ◉ Magnetron sputtering cathode x 4 ◉ Electron beam evaporation ◉ Dry etching ◉ Annealing

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)

Continuous multilayer film, simultaneous film formation (2-6 elements simultaneous film formation: RF, DC can be freely switched from HMI) High-power RF, DC power supplies, and pulse DC power supplies can be flexibly configured for multi-cathode using our unique 'Plasma Switching Relay' module, allowing for various applications. High-temperature substrate heating stage (double jacket water-cooled) options: -1) Max 600℃ (lamp heating) -2) Max 1000℃ (C/C composite) -3) Max 1000℃ (SIC coating) Reverse sputtering stage inside the load lock: -1) 300W, or -2) Soft-Etching (<30W) System main control: 'IntelliDep' control system Windows PC (or TP HMI) interface All operations are centrally managed from a single HMI screen.

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load lock.

Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible.

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

Compact and space-saving! Ideal for organic thin film development, all processes such as deposition, sputtering, and annealing can be seamlessly performed within the glove box.

In the film formation process of 2D materials such as OLED (Organic EL), OPV (Organic Photovoltaic), OTFT (Organic Thin Film Transistor), graphene, and TMD (Transition Metal Dichalcogenides), it is necessary to handle samples in an inert gas atmosphere isolated from oxygen and moisture. The MiniLab-026/090-GB achieves a "oxygen and moisture-free" experimental environment for organic film applications by housing the PVD chamber within the GB, creating a compact and space-saving environment. 【Features】 ◉ A series of processes such as PVD film formation, spin coating, and hot plate baking can be performed seamlessly within the GB without exposing them to the outside air. ◉ Space-saving: The chamber does not protrude from the back, so it does not take up space. 【MiniLab Models】 ◉ MiniLab-026 (26ℓ volume): Metal/insulator/organic material deposition, sputtering, plasma etching, annealing ◉ MiniLab-090 (90ℓ volume): Metal/insulator/organic material deposition, EB deposition, sputtering, plasma etching, annealing * Please first contact us with your required specifications, and we will configure the system according to your needs.

• Evaporation Equipment

High-performance, cost-effective RF/DC magnetron sputtering device for research and development.

High-performance RF/DC magnetron sputtering system ● Achievable pressure: 5 x 10^-5 Pa (*1 x 10^-4 Pa in as fast as 30 minutes!) ● Sputter sources x 3: Continuous multilayer film control, simultaneous film deposition ● Film uniformity ±3% ● Various options: Up/down rotation, heater, cathode for magnetic materials, and more ◉ nanoPVD can be used for various purposes, including up to 3 sputter sources + 3 systems (MFC control), expansion of RF/DC PSU (up to 2 power supplies), continuous multilayer film, and simultaneous deposition from 2 sources (RF/DC or DC/DC only). - Insulating films - Conductive films - Compounds, and more 【Main Features】 ◉ Compatible substrates: 2" (1 to 3 sources) or 4" (1 source) ◉ 2" cathode x up to 3 sources ◉ 7" touch panel for easy operation with PLC automatic process control ◉ High-precision process control with MFC ◉ 1 Ar gas system (standard) + up to 3 additional systems for N2, O2 ◉ Connect to a Windows PC via USB port to create and save recipes for up to 1000 layers and 50 films. Data logging on PC. ◉ Other various options available.

• Sputtering Equipment
• Other semiconductor manufacturing equipment

<30W Low power - Etching control precision 10mW Achieving damage-free and delicate etching processing.

【nanoETCH】Model. ETCH5A Achieves fine and damage-free etching processing with low output RF etching at <30W (control accuracy 10mA). A jointly developed product with the graphene research group at the University of Manchester, led by Nobel Prize winners who discovered graphene in 2010.

• Etching Equipment

◉ Short time: Easily conduct graphene synthesis experiments in just 30 minutes per batch. ◉ High-precision temperature and pressure control. ◉ Sophisticated software.

◉ High efficiency and high precision process control using cold wall method ◉ Rapid heating: 1100℃ in approximately 3 minutes ◉ High precision temperature control: ±1℃ ◉ High precision APC automatic pressure control system: 3 gas lines (Ar, H2, CH4) ◉ Standard recipe included for graphene production ◉ Compact size: 405(W) x 415(D) x 280(H)mm

• CVD Equipment

We have incorporated all the latest vacuum deposition technology into a compact benchtop-sized device that can effectively utilize limited lab space.

High-performance organic source LTE (up to 4 sources) with excellent temperature responsiveness/stability for organic materials such as OLED, OPV, and OTFT, and a metal deposition source TE (up to 2 sources) that allows for easy exchange and maintenance. It can operate in manual mode, as well as in automatic mode for continuous multilayer film deposition and simultaneous film formation. Despite its compact size, it achieves performance comparable to that of large standalone machines without sacrificing basic performance, film quality, uniformity, or operability. Additionally, it features fully automatic control via a simple touch panel with PLC. The user-friendly HMI allows anyone to operate it intuitively without requiring complicated operating procedures. It comes with remote software "IntelliLink," which connects to a Windows PC via USB cable, enabling monitoring of the device's operating status, log saving, online/offline recipe creation and storage, and fault analysis. This compact vacuum deposition system is designed to maximize the effective use of limited development and lab space while also excelling in maintenance.

• Evaporation Equipment

Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.

Three types of film formation components are installed in the chamber: resistance heating evaporation source (metal evaporation), organic evaporation source (organic materials), and magnetron sputtering (metal and insulating materials), allowing for various thin film experimental setups to be accommodated within a single chamber. ◉ Three combinations are available: 1. Sputter cathode + resistance heating evaporation source x2 2. Sputter cathode + organic evaporation source x2 3. Sputter cathode + resistance heating source x1 + organic evaporation source x1 (*DC sputtering only) - Evaporation range: Φ4 inch / Φ100 mm - Vacuum exhaust system: Turbo molecular pump + auxiliary pump (rotary or dry scroll pump) - Substrate rotation and vertical lifting stage - Max 500℃ substrate heating heater - Quartz oscillator film thickness sensor - 7” touch panel HMI operation (includes 'IntelliLink' Windows PC remote monitoring software)

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

□◼️Desktop X-ray CT imaging device◼️□ Compact, space-saving, and high-level analysis at an affordable price!

Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. ◉ VCap (Data Acquisition Program): Custom-made shooting stage tailored to the subject and purpose. ◉ VCT (CT Image Calculation Program): Customizable automatic measurement and analysis software specialized for the specified subject. ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were previously difficult with other software. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.

• X-ray inspection equipment
• X-ray Inspection Machine

□◼️X-ray CT imaging device (medium) ◼️□ Voxia series medium size 6-axis CT imaging axis configuration Custom design available to suit applications

Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. ◉ VCap (Data Acquisition Program): A custom-made shooting stage tailored to the subject and purpose. ◉ VCT (CT Image Calculation Program): Customizable automatic measurement and analysis software specialized for the specified subject. ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were previously difficult with other software. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.

• X-ray inspection equipment
• X-ray Diffraction Equipment
• X-ray Inspection Machine

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

◉ Maximum operating temperature Max2000℃ ◉ Customizable heater structure: - Cylindrical heater: for sintering samples inside a crucible (for solid, powder, granule, and pellet-shaped samples) - Flat heater: for sintering Φ1" to Φ6" wafers and small chip samples ◉ PLC semi-auto control All operations except for temperature adjustment are performed on a touch panel screen. No need for cumbersome valve opening/closing or pump activation; the "vacuum/purge" cycle before sintering and "vent" after sintering are automatically sequenced with one button. ◉ Up to 3 MFCs for automatic flow control (or manual adjustment) ◉ APC automatic pressure control ◉ Ensuring safety during operation Monitoring for cooling water abnormalities, chamber temperature abnormalities, and overpressure abnormalities. Made of SUS, the robust water-cooled chamber can be safely used even during continuous operation at maximum temperature. ◉ Compact and space-saving Width 603 x Depth 603 x Height 1,160mm (*installed inside rotary pump housing) Various sample heating experiments, such as ultra-high temperature heating of small samples in laboratories and new material research and development, can be easily conducted. The main unit is compact yet suitable for research and development in a wide range of fields.

• Annealing furnace
• Heating device
• Electric furnace

Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.

◉ Tabletop size, space-saving: 328(W) x 220(D) x 250(H) mm (*Reference value for 2-inch chamber) ◉ Customizable heater structure: - Cylindrical heater: For sample sintering in crucibles (for solid, powder, granular, and pellet-shaped samples) - Flat heater: For sintering Φ1" to Φ6" wafers and small chips ◉ Fast heating time of approximately 15 minutes (up to 1500℃), cooling from 1500℃ to 100℃ takes about 40 minutes (in vacuum and gas replacement atmosphere) ◉ High specification & high cost performance ◉ Simple configuration, excellent operability Various sample heating experiments, such as ultra-high temperature heating experiments for small samples in laboratories and new material research and development, can be easily conducted with simple operations. The main unit is compact yet suitable for research and development in various fields.

• Annealing furnace
• Heating device
• Electric furnace

6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.

◾️ Max 2000℃ ◾️ Effective heating range: Φ6 to Φ8 inch single leaf type, or batch type (multi-stage 5-sheet cassette) ◾️ Heater control: 1 zone or 2 zones (cascade control) ◾️ Heater material: ・C/C composite: Φ6 to Φ8 inch ・PG coated high purity graphite: Φ6 to Φ8 inch ◾️ Operating atmosphere: ・Vacuum (1x10-2 Pa), inert gas (Ar, N2) ◾️ PLC semi-automatic operation ・Automatic sequence control for vacuum/purge cycle and venting ・Fully automatic operation (optional) ・Touch panel operation, allowing centralized management without dispersed operations. ◾️ Process pressure control ・APC control (MFC flow, or automatic opening adjustment valve PID loop control) ・Maximum 3 systems of MFC flow automatic control, or manual adjustment of float meter/needle valve ◾️ PLOT screen graph display, CSV data output

• Annealing furnace
• Heating device
• Electric furnace

Compact measurement, robust body, high precision ±1%, 240msec fast response. It can be applied for industrial machine control, temperature monitoring in production sites, and various other purposes.

**Overview** The "PyroCouple" from Calex Electronics in the UK is a compact, lightweight, low-cost, and high-performance infrared temperature sensor that is unlike any other. It can measure the surface of objects that are "moving," "rotating," or "cannot be touched" non-contactly, allowing for fast and highly reproducible temperature control. **Features** ◎ Integrated amplifier and sensor ◎ 4-20mA output (standard), 0-50mV, thermocouple K, J, T output (optional) ◎ Accuracy: ±1% or ±1℃ (whichever is greater) ◎ Reproducibility: ±0.5% or ±0.5℃ (whichever is greater) ◎ Response time: 240 msec ◎ Protection rating: IP65

• Thermometer

For measuring the temperature of non-reflective, non-metallic materials such as asphalt, concrete, rubber, and painted surfaces.

For temperature measurement of non-reflective, non-metallic materials such as asphalt, concrete, rubber, and painted surfaces. ◉ Compliance Standard: Conforms to EMC standards for construction machinery (ISO 13766-1) ◉ Durability: Protection rating IP67/IP65 with a robust SUS316 body ◉ Measurement Range: -20℃ to +500℃ ◉ Output: 0-5VDC voltage output or CAN BUS communication

• Radiation thermometer
• Thermometer
• Thermo-hygrometer

Parameters such as temperature range, emissivity, and alarms can be set using a smartphone or tablet, allowing for easy configuration without the need for a display instrument or power supply for the instrument.

● You can use a smartphone or tablet to perform the settings. ● Download the dedicated app for free from Google Play (Android 4.1 to 5.1). ● Using Android's NFC communication, simply touch the sensor part to read and write data. ● Ultra-compact sensor (Φ31mm x t29mm) allows temperature measurement in narrow spaces. ● Fast response time of 125 msec, high accuracy of ±1.5%. ● Voltage output (0-5V or 0-10V), or K thermocouple output.

• Temperature and humidity measuring instruments

Easy setup with a high-performance touch panel converter, data logging, and data storage on a microSD card. PM2.2 can also measure glossy metal surfaces.

**Overview** With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*There is also an option for a converter without a display.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurements in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving devices such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting measurements of high temperatures (Max 2000℃) and glossy metallic surfaces. **Features** ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, Repeatability ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm

• Temperature and humidity measuring instruments

TIIS (Technical Institution of Industrial Safety) certification obtained for intrinsically safe explosion-proof radiation temperature sensors, suitable for use in hazardous locations (Zone 0, 1, & 2).

ExTemp is an intrinsically safe explosion-proof radiation temperature sensor that can be used in hazardous material handling equipment and factories such as petrochemical plants, pharmaceutical factories, and chemical plants. (TIIS type certification number: 21097)

• Temperature and humidity measuring instruments
• Radiation thermometer
• Temperature and Humidity Control

USB connection type, parameter settings and data management with the included dedicated software. A wide range of wavelength options is available. Three models can be selected based on your purpose.

【Overview】 Connect to a Windows PC using the standard accessory "CalexConfig" and the included USB cable (1.8m), allowing for the configuration of sensor measurement parameters, analysis of measurement results, and CSV output on the PC. 1) 4-20mA output 2) USB output (operates on USB bus power) 3) Simultaneous use of 4-20mA/USB output These three usage methods are possible. 【Features】 ◎ Simultaneous use of USB data logging and 4-20mA analog output ◎ Excellent basic performance: accuracy ±1%, reproducibility ±0.5%, 200msec fast response ◉ PUA2: Covers short wavelengths from 2.0 to 2.4μm, capable of measuring metal surfaces ◉ PUA5: Suitable for measuring glass surfaces at a wavelength of 5μm ◉ PUA8: General-purpose, applicable to a wide range of materials such as paper, wood, plastic, and textiles at a wavelength of 8-14μm

• Temperature and humidity measuring instruments

USB-connected compact infrared temperature sensor, no power supply needed, powered by USB bus power from PC, parameter settings and data management with included dedicated software.

【Overview】 Install the standard accessory "Calexsoft," and then simply connect it to a Windows PC via USB cable. You can easily set measurement parameters, conduct measurements, and analyze/export results in CSV format on your PC with a Plug & Play feel. USB output operates solely on USB bus power when connected to a PC, requiring no external power supply. The application range expands in various industrial fields and research institution laboratories. 【Features】 ◎ USB data logging ◎ Wide range: -20℃ to +1000℃ ◎ Excellent basic performance: accuracy ±1%, reproducibility ±0.5%, 125msec fast response ◎ Emissivity adjustment range: 0.2 to 1.0 ◎ Measurement wavelength range: 8 to 14μm ◎ Compact size Φ18mm x 45mm

• Temperature and humidity measuring instruments

In projects directly managed by the Ministry of Land, Infrastructure, Transport and Tourism, the use of new technologies is generally required. Therefore, in future civil engineering sites, it is important not only to consider "whether to use new technologies," but also how to select and utilize technologies that are suitable for the site. One of those options is the "Hyper CLT Board," a wooden lightweight mat that utilizes CLT. It can be used as a wooden mat for temporary roads, access routes, and heavy machinery work yards, and the 5×10 board weighs approximately 230 kg, making it relatively lightweight. In addition to ease of installation, removal, and relocation, it features suppression of glare and metallic sounds, as well as environmental considerations through the use of wood. Furthermore, it can be incorporated into proposals for the utilization of new technologies as a **NETIS registered technology by the Ministry of Land, Infrastructure, Transport and Tourism "TH-250021-A."** NETIS, new technologies, civil engineering, CLT. As public works change, the Hyper CLT Board offers a new option of wooden lightweight mats to the site.

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding methods for repairs can change the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Waterworks Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for metal crack repairs without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

Hotron, which manufactures and sells sensors, provides bed exit sensors for hospitals, nursing, and care facilities. Hotron offers easy-to-understand video guidance on how to use the bed exit sensors wirelessly and how to set up device connections! ▼ Video Manual (YouTube) https://www.youtube.com/playlist?list=PLNVA4mTrZDqtJa6MfFRZQxwtfCSnAfxVy 【Bed Exit Sensors】 ○ Non-contact infrared sensor, simply place it - Pole-kun HB-H1 ○ Mat sensor, foldable thin mat - Mat-kun HB-UST ○ Body movement call - Ugo-kun HB-TV3 ○ Body movement call for wheelchairs - Ayumi-chan HB-WTV3 【Options】 ○ Nurse call linked wireless set - Wireless set (transmitter/receiver) HB-RS/HB-RJ ◎ For more information about the products, please contact us or download the catalog.

Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily understandable at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

Features: ● Equipped with Intel N series processors (N250/N150) ● Fanless design ● Ultra-thin compact chassis (30mm thick) ● Supports DDR5 memory ● Dual display output ● Dual Gigabit LAN ● Abundant M.2 expansion slots ● Equipped with TPM 2.0 * This model comes without memory, storage, and OS.