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  6. □■□【MiniLab-080】Flexible Thin Film Experiment Device□■□

□■□【MiniLab-080】Flexible Thin Film Experiment Device□■□

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MiniLab-080

last updated:Aug 26, 2026

テルモセラ・ジャパン 本社
テルモセラ・ジャパン 本社
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Flexible configuration available upon request for processes such as evaporation, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during evaporation.

The ML-080, composed of a D-type box chamber with a volume of 80 liters and dimensions of 400(W)x400(D)x570(H)mm, features a higher chamber compared to the 060 model, resulting in a longer TS distance adjustment range and improved film uniformity during deposition on large-diameter substrates. It is an optimal model for vacuum deposition and is a higher-end version of the ML-060, which can also accommodate a load lock mechanism. Like the 060, it is compact yet supports a wide range of applications including resistance heating deposition (for metals, insulators, and organic materials), EB deposition, RF/DC/Pulse DC compatible magnetron sputtering, RIE plasma etching, and annealing. - Maximum substrate size: Φ10 inch - Resistance heating deposition sources: up to 4 sources - Organic deposition sources: up to 4 sources - Magnetron sputtering cathodes: 4 sources - Electron beam deposition - Substrate heating stage (standard 500℃, max 1000℃) - *Plasma etching / <30W soft etching *Plasma etching can be installed in both the main chamber and the load lock chamber.

    Evaporation Equipment
MiniLab-080-550_2020.jpg

□■□【MiniLab-080】Flexible Thin Film Experiment Device□■□

MiniLab-080-550_2020.jpg
MiniLab-080-550_2020.jpg MiniLab-080-550_2020.jpg 1.jpg 2.jpg 5.jpg LTE-Feature-1.png MiniLab080.1057.jpg MiniLab080.1060.jpg 9.jpg LL-etching-stage.png
  • Thermosera Japan_MiniLab-080 publication page
  • Special site - Product/service details - https://pr.mono.ipros.com/thermocera/product/

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basic information

【Main Specifications】 - SUS304 80ℓ volume 400x400x570mm front-loading chamber - Pump: Turbo molecular pump, rotary pump (dry pump also available) - Vacuum exhaust: Automatic control of vacuum/vent - Resistance heating deposition: Up to 4 source points (Model TE1 to TE4 deposition sources) - Organic deposition: Up to 4 sources (Model LTEC-1cc/5cc) - EB electron beam deposition source: 7cc crucible x 6 (or 4cc crucible x 8) - Φ2 to 4 inch magnetron sputtering cathode x up to 4 sources - Process control: Manual or automatic multilayer continuous film deposition/multiple simultaneous film deposition, APC automatic control - Film thickness monitor: Quartz crystal oscillator sensor head x 4 - Film thickness control: Inficon SQM-160 (or SQC-310) multi-channel film deposition controller - Utilities: Power supply 200V three-phase 15A, water cooling 3ℓ/min, N2 vent 0.1Mkpa - Other options: Substrate heating, cooling, substrate elevation/rotation, dry etching, dry scroll pump, load lock mechanism

Price information

This device is a customized product and will vary depending on the configuration, so please contact us for inquiries.

Delivery Time

Please contact us for details

※This device is a customized product and will vary based on the configuration, so please contact us for inquiries.

Applications/Examples of results

Various basic experimental applications in university and corporate research laboratories - Optical thin films - Electrode films, semiconductor films, wiring films, insulating films Others

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◆nanoPVD-T15A◆ High-performance organic and metal film deposition device

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VOXIA compact

VOXIA compact X-ray CT imaging device

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Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.

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MiniLab series

The catalog for the MiniLab Flexible Thin Film Experimental Device has been renewed!

  • UPDATE
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We have completely renewed the catalog for the MiniLab series thin film experimental equipment. 【Features of the MiniLab Series】 ◉ Supports sputtering, evaporation (resistive heating, organic, EB), annealing, plasma etching, etc. ◉ Modular design allows for flexible combinations of components (source hybrid types and multi-chamber configurations are possible) ◉ Compact, space-saving design (width 1,200 x depth 560 mm) ◉ Excellent operability: intuitive interface allows for centralized management of all operations via a touch panel without dispersion. We are confident that this will be of great assistance in research and development settings. Please consider it.

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Product image of the Mini-BENCH tabletop experimental furnace.

□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■

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Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sample sintering inside the crucible (for solid, powder, granular, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others

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Companynews list (64)

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テルモセラ・ジャパン

テルモセラ・ジャパン 本社

Industrial Electrical Equipment

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【Endless possibility_thermal engineering...】 Our company sells vacuum thin film devices for semiconductor and electronic device fundamental research, ultra-high temperature heaters for CVD substrate heating, experimental furnaces, temperature measurement equipment, and more. To meet the endless demand for "heat," which is indispensable in any era, and to respond to various requests in the field of fundamental technology development, we aim to introduce the latest equipment and contribute to research and development in Japan.

Product/Service List (58)

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