VOXIA compact X-ray CT imaging device

□◼️X-ray CT imaging device (medium) ◼️□ Voxia series medium size 6-axis CT imaging axis configuration Custom design available to suit applications

Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. ◉ VCap (Data Acquisition Program): A custom-made shooting stage tailored to the subject and purpose. ◉ VCT (CT Image Calculation Program): Customizable automatic measurement and analysis software specialized for the specified subject. ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were previously difficult with other software. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.

• X-ray inspection equipment
• X-ray Diffraction Equipment
• X-ray Inspection Machine

□◼️Desktop X-ray CT imaging device◼️□ Compact, space-saving, and high-level analysis at an affordable price!

Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. ◉ VCap (Data Acquisition Program): Custom-made shooting stage tailored to the subject and purpose. ◉ VCT (CT Image Calculation Program): Customizable automatic measurement and analysis software specialized for the specified subject. ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were previously difficult with other software. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.

• X-ray inspection equipment
• X-ray Inspection Machine

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

◉ Maximum operating temperature Max2000℃ ◉ Customizable heater structure: - Cylindrical heater: for sintering samples inside a crucible (for solid, powder, granule, and pellet-shaped samples) - Flat heater: for sintering Φ1" to Φ6" wafers and small chip samples ◉ PLC semi-auto control All operations except temperature adjustment are performed via a touch panel screen. No need for cumbersome valve opening/closing or pump activation; the "vacuum/purge" cycle before sintering and "vent" after sintering are automatically sequenced with one button. ◉ Up to 3 MFCs for automatic flow control (or manual adjustment) ◉ APC automatic pressure control ◉ Ensuring safety during operation Monitoring for cooling water abnormalities, chamber temperature abnormalities, and overpressure abnormalities. Made of SUS, the robust water-cooled chamber can be safely used even during continuous operation at maximum temperature. ◉ Compact and space-saving Width 603 x Depth 603 x Height 1,160mm (*installed inside rotary pump housing) Various sample heating experiments, such as ultra-high temperature heating of small samples in laboratories and new material research and development, can be easily conducted. The main unit is compact yet can be used for research and development in various fields.

• Annealing furnace
• Heating device
• Electric furnace

6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely accommodates various purposes from research and development to small-scale production.

◾️ Max 2000℃ ◾️ Effective heating range: Φ6 to Φ8 inch single leaf type, or batch type (multi-stage 5-sheet cassette) ◾️ Heater control: 1 zone or 2 zones (cascade control) ◾️ Heater materials: ・C/C composite: Φ6 to Φ8 inch ・PG coating high-purity graphite: Φ6 to Φ8 inch ◾️ Operating atmosphere: ・Vacuum (1x10-2Pa), inert gas (Ar, N2) ◾️ PLC semi-automatic operation ・Automatic sequence control for vacuum/purge cycle and venting ・Full automatic operation (optional) ・Touch panel operation, allowing centralized management without dispersed control. ◾️ Process pressure control ・APC control (MFC flow, or automatic opening adjustment valve PID loop control) ・Maximum 3 systems of MFC flow automatic control, or manual adjustment of float meter/needle valve ◾️ PLOT screen graph display, CSV data output

• Annealing furnace

Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.

◉ Tabletop size, space-saving: 328(W) x 220(D) x 250(H) mm (*Reference value for 2-inch chamber) ◉ Customizable heater structure: - Cylindrical heater: For sample sintering in crucibles (for solid, powder, granular, and pellet-shaped samples) - Flat heater: For sintering Φ1" to Φ6" wafers and small chips ◉ Fast heating time of approximately 15 minutes (up to 1500℃), cooling from 1500℃ to 100℃ takes about 40 minutes (in vacuum and gas replacement atmosphere) ◉ High specification & high cost performance ◉ Simple configuration, excellent operability Various sample heating experiments, such as ultra-high temperature heating experiments for small samples in laboratories and new material research and development, can be easily conducted with simple operations. The main unit is compact yet suitable for research and development in various fields.

• Annealing furnace
• Heating device
• Electric furnace

Compact, space-saving, energy-efficient! High-performance ultra-high temperature experimental furnace for R&D.

Max 2900℃ (carbon furnace), Max 2400℃ (metal furnace) - Effective heating area 70 x 70 x 100 mm Supports various applications in new material development and advanced basic technology development sectors such as semiconductors, electronic components, fuel cells, and solar cells.

• Annealing furnace

High-performance, cost-effective RF/DC magnetron sputtering system for research and development.

High-Performance RF/DC Magnetron Sputtering Equipment ● Achievable pressure: 5 x 10^-5 Pa (*1 x 10^-4 Pascal in the fastest 30 minutes!) ● 3 x Manetron cathodes: Sequential multi-layer film, 2 sources' co-deposition ● Film uniformity ±3% ● Various options: Substrate rotation and Z-shift, substrate heating (Max 500℃), cathodes for magnetic targets, and more ◉ nanoPVD can be used for various purposes, including up to 3 sputter sources + 3 gas flow control (MFC control), RF/DC PSU upgrade (up to 2 power supplies), sequential multi-layer film, and 2 sources' co-deposition (RF/DC or DC/DC only). - Insulating films - Conductive metal films - Compounds, etc. 【Main Features】 ◉ Substrate size: Up to Φ4 inch ◉ 2" cathodes x up to 3 sources ◉ 7" touch panel for easy operation with PLC automatic process control ◉ APC automatic pressure control ◉ High-precision process control with capacitance manometer ◉ 1 Ar gas system (standard) + N2, O2 expandable up to 3 systems ◉ USB port for connection to Windows PC, allowing the creation and storage of recipes for up to 1000 layers and 50 films. Data logging on PC ◉ Other various options available

• Sputtering Equipment
• Evaporation Equipment
• Other semiconductor manufacturing equipment

Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)

High-temperature processing up to 1000°C is possible with the heating stage installed in the high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of three systems, allowing for firing operations at precisely adjusted process gas pressures (with the APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500°C - C/C composite heater: Max 1000°C (only in vacuum or inert gas) - SiC coating heater: Max 1000°C (in vacuum, inert gas, O2)

• Annealing furnace
• Heating device
• Electric furnace

<30W Low power - Etching control precision 10mW Achieving damage-free and delicate etching processing.

【nanoETCH】Model. ETCH5A Achieves fine and damage-free etching processing with low output RF etching at <30W (control accuracy 10mA). A jointly developed product with the graphene research group at the University of Manchester, led by Nobel Prize winners who discovered graphene in 2010.

• Etching Equipment

Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.

The nanoPVD-ST15A is a composite thin film experimental device that can simultaneously install a resistance heating deposition source, an organic deposition source, and a Φ2 inch magnetron sputtering cathode. It is bench-top sized and space-saving, making effective use of limited lab space. It is not a coater for microscope sample preparation; it can create high-quality thin films required for research and development applications such as electronic circuit boards, batteries, MEMS, and new material development. It is equipped with a maximum of three gas systems (process pressure APC automatic control), continuous automatic film formation (up to 20 layers), and simultaneous deposition from two sources, along with a variety of other features. Additionally, it offers options such as a substrate heating heater (up to 500°C) and a dry scroll pump. Vacuum pumping, film formation control, venting, recipe creation, as well as failure analysis and logging can all be operated via a 7" touch panel on the front, allowing for centralized management of operations. The IntelliLink software is included: it connects to a Windows PC via USB cable for remote monitoring, offline recipe creation, downloading and uploading, and log saving. It supports various applications in the development of new materials and new material development, as well as in advanced fundamental technology development sectors such as semiconductors, electronic components, fuel cells, and solar cells.

• Sputtering Equipment
• Evaporation Equipment

We have incorporated all the latest vacuum deposition technology into a compact benchtop-sized device that can effectively utilize limited lab space.

High-performance organic source LTE (up to 4 sources) with excellent temperature responsiveness/stability for organic materials such as OLED, OPV, and OTFT, and a metal deposition source TE (up to 2 sources) that allows for easy exchange and maintenance. It can operate in manual mode, as well as in automatic modes for continuous multilayer film deposition and simultaneous film deposition. Despite its compact size, it achieves performance similar to that of standalone large machines without sacrificing basic performance, film quality, uniformity, or operability. Additionally, it features fully automated control via a simple touch panel with PLC. The user-friendly HMI allows anyone to operate it intuitively without requiring complicated operating procedures. It comes with remote software "IntelliLink," which connects to a Windows PC via USB cable, enabling monitoring of the device's operating status, log saving, online/offline recipe creation and saving, and fault analysis. This compact vacuum deposition system is designed to maximize the effective use of limited development and lab space while also excelling in maintenance.

• Evaporation Equipment

◉ Short time: Easily conduct graphene synthesis experiments in just 30 minutes per batch. ◉ High-precision temperature and pressure control. ◉ Sophisticated software.

◉ High efficiency and high precision process control using cold wall method ◉ Rapid heating: 1100℃ in approximately 3 minutes ◉ High precision temperature control: ±1℃ ◉ High precision APC automatic pressure control system: 3 gas lines (Ar, H2, CH4) ◉ Standard recipe included for graphene production ◉ Compact size: 405(W) x 415(D) x 280(H)mm

• CVD Equipment

Due to its modular embedded design, it is possible to flexibly assemble dedicated equipment according to the required film formation method. A compact thin-film experimental device that can accommodate various research applications.

**Flexible System** The MiniLab thin film experimental device series allows for easy construction of a compact device configuration without waste, even as a customized product, by incorporating suitable components (such as deposition sources and stages) and control modules according to the required deposition methods and materials from a wide range of options. By configuring the device with a modular control unit in a Plug&Play manner, the application range expands, enabling various thin film process experiments. The MiniLab series is a high cost-performance system that caters to a wide range of applications from research and development to small-scale production. **Small Footprint & Space Saving** - Single Rack Type (MiniLab-026): 590(W) x 590(D)mm - Dual Rack Type (MiniLab-060): 1200(W) x 590(D)mm - Triple Rack Type (MiniLab-125): 1770(W) x 755(D)mm **Excellent Operability & Intuitive Operation Screen** Windows PC or 7” touch panel. Easy operation that does not require advanced skills, while ensuring maximum safety.

• Sputtering Equipment

Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.

This is a flexible R&D thin film experimental device that achieves minimal waste, compact size, simple operation, and high cost performance by integrating the necessary minimum modules and controllers into a 19" compact rack with a Plug&Play feel. It supports magnetron sputtering (up to 3 sources) or resistance heating evaporation (metal sources up to 4, organic materials x4), and it can also be equipped with a substrate heating stage for annealing and plasma etching. A glove box storage type is also available (*specifications to be discussed). We offer a wide range of optional components that can be flexibly customized. ◉ Maximum substrate size: Φ6 inch ◉ Resistance heating evaporation source filament, crucible, boat type (up to 4 sources) ◉ Organic evaporation source: 1cc or 5cc ◉ Φ2 inch magnetron cathode (up to 3 sources) ◉ Dry etching ◉ Glove box compatible (optional, specifications to be discussed) ◉ Other options: simultaneous deposition from 2 sources, HiPIMS, automatic thin film controller, custom substrate holder, substrate rotation/lifting, substrate heating, and many other options available. *Please first contact us with your required specifications, and we will configure the system to meet your needs.

• Sputtering Equipment
• Annealing furnace
• Evaporation Equipment

A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.

Compact/Space-saving, High-spec Thin Film Experiment Equipment Can be combined with the following deposition sources: - Resistance heating deposition source x up to 4 - Organic deposition source x up to 4 - Electron beam deposition - 2-inch magnetron sputtering cathode x 4 - Plasma etching: Can be installed in either the main chamber or the load lock chamber 【Small Footprint & Space-saving】 - Dual rack type (MiniLab-060): 1200(W) x 590(D)mm 【Excellent Operability & Intuitive Operation Screen】 Windows PC or 7” touch panel. Easy operation regardless of skill level, with maximum safety considerations.

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

Flexible configuration available upon request for processes such as evaporation, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during evaporation.

The ML-080, composed of a D-type box chamber with a volume of 80 liters and dimensions of 400(W)x400(D)x570(H)mm, features a higher chamber compared to the 060 model, resulting in a longer TS distance adjustment range and improved film uniformity during deposition on large-diameter substrates. It is an optimal model for vacuum deposition and is a higher-end version of the ML-060, which can also accommodate a load lock mechanism. Like the 060, it is compact yet supports a wide range of applications including resistance heating deposition (for metals, insulators, and organic materials), EB deposition, RF/DC/Pulse DC compatible magnetron sputtering, RIE plasma etching, and annealing. - Maximum substrate size: Φ10 inch - Resistance heating deposition sources: up to 4 sources - Organic deposition sources: up to 4 sources - Magnetron sputtering cathodes: 4 sources - Electron beam deposition - Substrate heating stage (standard 500℃, max 1000℃) - *Plasma etching / <30W soft etching *Plasma etching can be installed in both the main chamber and the load lock chamber.

• Evaporation Equipment

Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.

MiniLab-080 is a glove box model designed to accommodate an 80ℓ large volume chamber within a glove box bench. It features a slide-open and close chamber that maximizes the use of the workbench, and a rear-opening door designed with maintenance in mind. Samples processed can be consistently handled in a controlled environment inside the glove box without exposure to the atmosphere or moisture. For specifications of the GB model, please refer to the gas purification unit. - Maximum substrate size: Φ10 inch - Resistance heating evaporation source x up to 4 sources - Organic evaporation source x up to 4 sources - Magnetron sputtering cathode x 4 sources - Electron beam evaporation - Substrate heating stage (standard 500℃, Max 1000℃) - Plasma etching / <30W soft etching

• Sputtering Equipment
• Etching Equipment
• Evaporation Equipment

Fukuda Corporation has been pursuing leak detection for 60 years and is dedicated to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing performance. We will propose suitable testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

This is a collection of links to Fukuda's technical columns. It covers various topics related to leak tests and more... Please check the related links for more information.

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding repair methods can change the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or variations in dimensions, can be molded at the same time in one molding process. This allows for the verification of multiple types in a short period.

The pinhole inspection for packaging engineering is fully automated, eliminating packaging defects based on certain quality standards. The judgment results and operational status can be managed via a monitor screen. - Quantitative management of quality standards for the pinhole inspection process - Ensuring the quality of the product's shelf life - Establishing evaluation criteria for the manufacturing process, achieving quantitative quality assurance - Slim and space-saving design that can be connected to existing production lines - Quick changeover for product variety switching can be handled in a short time by exchanging chambers - Fully domestically produced, allowing for rapid maintenance and troubleshooting - Example target works: pillow packaging, packaged rice (packaged cooked rice), etc. *Please consult us regarding the use of this product for pharmaceuticals.