The heat-dissipating gap filler "TIA268GF" has been added to AD-Chemi.
We propose Momentive's SILCOOLTIA268GF as a material that meets the increasing "difficulty of thermal design" associated with the high performance and high density of electronic devices. TIA268GF is a thermally conductive gap filler that can be applied with high precision using liquid dispensing, addressing complex shapes and fine clearances that traditional sheet-type gap fillers cannot handle. With a high thermal conductivity of 6.8 W/m·K and silicone properties that maintain flexibility even after curing, it minimizes temperature rise in heat-generating components while reducing stress on substrates and components. Additionally, TIA268GF features excellent processability with a simple 1:1 mixing ratio, a working time of 1 hour at 23°C, and rapid curing in 1 hour at 70°C, enabling stable dispensing application on mass production lines. Its highly non-sagging paste form allows it to "stay in place" on vertical surfaces and wide gaps, making it suitable for thermal management in a wide range of fields such as automotive ECUs, communication devices, and industrial equipment. At Adachi New Industry, we provide comprehensive support for optimizing thermal design, examining application conditions, and prototype assistance using TIA268GF.

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