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  3. S&T出版
  4. Si・SiC・GaN・Current Status, Challenges, and Prospects of Next-Generation Power Device Technology and Application Areas [Web Seminar]
SEMINAR_EVENT NEW
  • Sep 16, 2026
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Sep 16, 2026

Si・SiC・GaN・Current Status, Challenges, and Prospects of Next-Generation Power Device Technology and Application Areas [Web Seminar]

S&T出版 S&T出版
In order to achieve a decarbonized society, power semiconductor technology that enhances power conversion efficiency is gaining attention. This seminar will focus on the latest trends of GaN devices that contribute to high power density and power efficiency in AI data centers, as well as the technological innovations of SiC devices expected in the EV market. In particular, GaN excels in high-frequency and high-efficiency operation, making it an essential element for next-generation power design. On the other hand, SiC for EVs is advancing in adoption for applications such as onboard inverters due to its high voltage resistance and low loss characteristics, even as the market is at a standstill. However, silicon power devices still reign supreme at present. This is primarily because the performance, reliability, and pricing of next-generation power devices represented by SiC/GaN are not yet sufficiently meeting market demands. The current status and future trends of new material power device development technologies, including SiC/GaN, in competition with the strongest rival, silicon power devices, will be explained clearly and thoroughly, covering semiconductor elements, mounting technologies, and market forecasts.
Date and time Wednesday, Nov 04, 2026
10:30 AM ~ 04:30 PM
Capital
Entry fee Charge 52,800 yen
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Challenges and Evaluation Techniques of Next-Generation Power Electronics

Detailed explanation of the latest evaluation technologies for next-generation power semiconductor devices and materials, as well as cutting-edge simulation technologies.

This book, "Challenges and Evaluation Technologies of Next-Generation Power Electronics," is edited around silicon power semiconductors, which are currently the main players, and next-generation power semiconductor devices based on wide bandgap materials, which will be at the center of next-generation power electronics. It provides detailed introductions not only to semiconductor crystals, device design, process equipment, and high-temperature mounting technologies, but also to the latest evaluation technologies regarding material properties and device characteristics, as well as cutting-edge simulation technologies. It thoroughly covers a wide range of topics, including applications in automotive and communication devices, which are expected to grow significantly in the future, as well as developments in industrial equipment, including home appliances and railways. I hope this book will be greatly helpful in expanding the adoption of next-generation power semiconductor devices towards the realization of a decarbonized society.

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Control of solid/solid interfaces and bonding/layering technology for semiconductors, magnetic materials, and batteries.

A book to control the interface and utilize phenomena and functions.

This is a book that summarizes the control of heterogeneous material interfaces for performance improvement, the phenomena and functions that manifest at the interfaces, and the technologies for their utilization, from basic principles to cutting-edge research trends. By having leading experts in each field and those who are at the forefront of interface research on new materials contribute to this work, the desired performance and functions, challenges, and research directions are clearly outlined. We hope that readers will gain new insights and discoveries that transcend their areas of expertise, research fields, and application targets.

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Future Research Group on People and Organizations

Future Research Group on People and Organizations to Enhance Management Skills in the AI Era | For Executives and Next-Generation Leaders

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  • SEMINAR_EVENT

An era where AI provides "answers." Is there someone in your company who can "ask questions" themselves? Simply introducing AI will not change a company. When people grow, organizations change. The "Future Research Group on People and Organizations" is a series of four practical workshops aimed at business owners, successors, executives, department heads, and next-generation leaders, focusing on the management skills necessary to "nurture people and drive organizations" in the coming era. Rather than passively "listening" to lectures, participants will bring their own management challenges and emphasize self-questioning through dialogue with experienced business leaders and fellow participants. Throughout the four sessions, we aim for participants to take home the following "four values": - A measure for judgment - An external sounding board - Their own management challenges - Their own reform concepts **Target Audience** Business owners / successors / executives / department heads / next-generation leaders **Locations** East Japan: Tokyo Transportation Hall (Yurakucho) West Japan: AP Osaka Station Front **Capacity** Limited to 10 companies and 20 participants from each region *Participation of two people from one company is recommended. **Participation Fee** 200,000 yen per company / 120,000 yen per person *For all four sessions Please join us for an opportunity to think about and discuss your company's challenges regarding management and human resource development in the AI era, and to connect these discussions to reform concepts.

Sep 16, 2026

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You can do this too! RPA "WinActor" - Thoroughly Overcoming! Branching & Repetition [Includes 20 Basic and Advanced Problems] -

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Understanding "branching" and "looping" makes WinActor even more enjoyable! We will provide clear explanations from the basics to practical applications. ☆ Date ☆ Ongoing until November 30, 2026 (Monday)   https://www.nttd-bb.com/event/smn20261130.html?utm_source=ipros&utm_medium=other&utm_campaign=20260915_sales ☆ Venue ☆ Online seminar, free of charge ☆ Seminar Content ☆  Understanding "branching" and "looping" makes WinActor even more enjoyable!  "Branching" and "looping" greatly expand the possibilities of scenario creation.  These are essential functions for using WinActor, but many people may feel apprehensive about them.  This seminar will provide clear explanations from the basics to advanced applications.  You will also acquire practical thinking skills through 20 basic and advanced problems. Say goodbye to your apprehension about branching and looping today! Why not challenge yourself with problems and level up your scenario creation skills?

Sep 16, 2026

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[Free Webinar - Technical Verification] Explanation of Printing Accuracy in Screen Printing with Verification Data | 40μm Fine Patterns, RtoR Printing, FHE Multilayer Printing

  • NEW
  • SEMINAR_EVENT

◆Event Overview Date: September 30, 2026 (Wednesday) - October 1, 2026 (Thursday) 14:00 - 14:30 Format: Recorded distribution (Zoom) Duration: Approximately 30 minutes ◆Do you have any of these concerns? Not sure how to verify the printing process Want to test if our materials and pastes are suitable for printing Want to verify if fine wiring patterns can be formed Difficult to introduce printing equipment for prototyping ◆Topics for the Day Verification of fine patterns at the 40µm level using RtoR screen printing Technical verification combining screen plates, pastes, and printing conditions Verification of multilayer printing and alignment with FHE in mind Considerations for reproducibility and mass production of continuous printing Support for prototyping and verification to achieve wiring printing ◆Recommended for Those interested in screen printing and fine pattern formation Those involved in the development of printed electronics and FHE Engineers and researchers related to electronic components and semiconductors Those considering product development from prototyping to mass production ★How to Apply★ Pre-registration (free) is required. Click the "Details & Application Button" below!

Sep 16, 2026

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6th Oshi Katsu EXPO Autumn

Notice of Participation in the 6th Oshi Katsu EXPO Autumn

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  • SEMINAR_EVENT

Daitō Shikō Co., Ltd. will be exhibiting at the "6th Oshi Katsu EXPO Autumn" held at Tokyo Big Sight from Wednesday, October 7th. At the exhibition venue, we plan to showcase a variety of original goods, primarily focusing on foil stamping printing. If you are looking for SP tools, promotional items, or novelties, please be sure to visit our booth.

Sep 16, 2026

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Notice of Participation in MWE 2026 (2026 Microwave Workshops and Exhibition) from November 25 (Wednesday) to November 27 (Friday), 2026.

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  • SEMINAR_EVENT

Sakura Tech Co., Ltd. will be exhibiting at the "Microwave Exhibition 2026" at Pacifico Yokohama during MWE 2026. In addition to products from numerous microwave-related companies, some sessions of the microwave workshop (such as introductory courses) will be held. By discussing various aspects from the theory to applications of microwaves, participants will deepen their understanding of the latest technologies and gather valuable information useful for manufacturing. Additionally, we will hold a seminar on the applications of wide-area and small millimeter-wave radar at the workshop, so we invite everyone to attend. ■ Title: Development of a Small, High-Resolution 3D Millimeter-Wave FMCW Radar - 512 Virtual Array - ■ Date and Time: November 27 (Friday) 09:30-11:30 ■ Venue: Room 6 (Annex Hall F206)

Sep 16, 2026

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  • 排気熱風なく気温-4.1℃の冷風を 工事不要で暑さ対策 店舗・工場の安全対策に! 気化式スポットクーラー Pure Drive
  • 技術・製品展示会 新技術創出交流会2026 入場無料 来場登録受付中 開催日時10月22日木・23日金 会場東京たま未来メッセ
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