【Product Page Renewal】'TMJC', which contributes to thermal management of power semiconductors and high-frequency circuits, significantly expands the necessary thermal resistance and specific application examples for evaluation and selection!
Thank you for always viewing our product information. We have renewed the product information for the aluminum nitride substrate thermal jumper chip "TMJC Series," which addresses the issue of "localized heating (hot spots)" around power semiconductors and optical devices on circuit boards. To facilitate smooth design considerations and product selection for our customers, we have newly expanded and published specific thermal and electrical characteristic data, such as high thermal conductivity (170W/m·K), electrical insulation with breakdown voltage (1.5k–5.0kVAC), and low capacitance (0.07–0.26pF) that does not affect high-frequency circuits. We also cover detailed specifications for all six sizes, including long edge electrodes that further reduce thermal resistance, as well as "specific thermal countermeasures and application examples" for power equipment, high-power amplifiers, and automotive ECUs.
■ Key points of this renewal:
• Excellent thermal conductivity: High heat dissipation effect with aluminum nitride substrate of 170W/m·K
• Reliable electrical insulation: Stability that meets insulation breakdown voltage and low capacitance characteristics
• Rich size variations: All six sizes including long edge electrode specifications that further reduce thermal resistance
• Application images: Examples of thermal countermeasures for power modules, laser diodes, automotive ECUs, etc.

Inquiry about this news
Contact Us Online



