Thermal Jumper Chip "TMJC"

Electricity is insulated, only heat escapes! Smartly breaking through heat buildup in high-density substrates.

We respond to the needs of 'unable to eliminate localized heat buildup (hotspots) in high-density implementation of power electronics and high-frequency circuits' and 'wanting to create a heat dissipation path while maintaining electrical insulation for circuits that cannot be grounded.' With the recent miniaturization and high power output of devices, the difficulty of thermal design has risen sharply. Our product is currently attracting significant attention from many developers working on such 'next-generation designs,' leading to a rapid increase in inquiries. 【This product features】 • Complete electrical insulation with powerful thermal bypass: It uses aluminum nitride (AlN) substrate, boasting a high thermal conductivity of 170 W/m·K. As an electrically insulated thermal conductor, it exhibits excellent thermal conductance of up to 250 mW/°C. • Low capacitance for high-frequency reliability: The capacitance is extremely low, ranging from just 0.07 pF to 0.26 pF, ensuring that it does not compromise the characteristics of RF amplifiers and communication devices. It eliminates the need for large heat sinks or expensive multilayer heat dissipation substrates, strongly supporting the standardization of designs with a single solution through SMD (surface mount technology).

Resistors