Exhibited at the Microelectronics Show 2017 eX-tech.

From June 7 (Wednesday) to June 9 (Friday), we will be exhibiting at the Microelectronics Show 2017 eX-tech, held concurrently with the JPCA Show at Tokyo Big Sight.
Highlights of Shimada Appli LLC at the 2017 eX-tech:
We have developed a new spray application method that uses our already patented FSCC006 type select spray system, allowing for spray application of coating materials with a viscosity of up to 1500 CPS without dilution, eliminating stringing and liquid clogging. (Patent pending)
We will present and introduce various new methods and technologies, focusing on specific examples of applying this method to thin film coatings of various solvent-based insulating materials, adhesives, etc. We look forward to your visit.
New products and technologies to be announced:
- Birth of a new system that allows spray application of raw coating materials without stringing
- High-speed select spray for fine wires with a width of less than 1 mm
- Uniform dispersion and film formation of filler-containing coating materials
- New spray technology that resolves liquid clogging at the nozzle tip
- Sample display of moisture-proof coatings containing cockroach repellents and various applications


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