June 7-9, 2017 [Notice of Participation in JPCA Show 2017]

Essential measurement of additive concentration for plating solution analysis! Supports two-component and three-component additives (inhibitors, accelerators, leveling agents). Compatible with major additive manufacturers!

PWB, wafer, and other electronic component plating solutions, as well as various types of plating such as wiring plating, Viafill, Damacine, and bump plating are supported. By expanding the range of rotation speeds, more new additives can be analyzed. Additionally, the "Get Me Expert" feature allows for immediate contact with on-site support. It is compatible with additives sold by chemical manufacturers worldwide. 【Features】 ■ Compatible with PWB, wafer, and other electronic component plating solutions ■ Supports various types of plating such as wiring plating, TSV plating, Viafill, Damacine, and bump plating ■ Up to four syringes for diverse sample analysis ■ Automatic analysis of up to 42 samples (V30 model) ■ Automation of SE solution and calibration standard solution preparation ■ Multilingual support ■ Built-in galvanostat ■ Improved maintenance of reference electrodes ■ Compatible with additives from the following chemical manufacturers: Atotech, Ishihara Chemical, Kamimura Industry, Okuno Pharmaceutical Industry, Dow Chemical, McDermid, Mertex, ADEKA, EEJA, JCU, etc. *For more details, please refer to the catalog or feel free to contact us.

• Analytical Equipment and Devices

Improves resolution and alignment accuracy, compatible with mass production processes. Adopts UV-LED light sources to reduce running costs.

The "CMS (Cerma Micro Stepper) - Ck" is a projection exposure device capable of fine pattern exposure, compatible with full-size substrates of 650×550mm. It uses a UV-LED light source as the standard light source. It is suitable for applications that require high precision, high resolution (L/S) of 2μm, and high productivity, starting with interposers. 【Features】 ■ Supports mass production processes from L/S = 1.4/1.4μm ■ Die-by-die alignment & global alignment methods ■ Capable of chip-first processes ■ Equipped with a tilt mechanism for each shot to improve yield *For more details, please refer to the documentation. Additionally, we have a clean room where our products can be evaluated. If you would like a demo, please feel free to contact us. (We can accommodate surrounding processes including lamination, coating, and development.)

• others

We introduce a lineup of various substrate warpage measurement devices manufactured by Akrometrix! There are a total of four types.

◆TherMoiré PS200S 【Features】 - Lower heating specification - Measurement field 200mm×200mm - Warpage data acquisition time approximately 2 seconds - Option to equip with DIC2.0 ◆TherMoiré PS600S 【Features】 - Compatible with large substrates - Measurement field 600mm×600mm - Warpage data acquisition time approximately 2 seconds - Option to equip with DFP2, DIC2.0 ◆Table Top Shadow Moiré 【Features】 - Tabletop type room temperature inspection device - Measurement field 300mm×300mm - Warpage data acquisition time approximately 2 seconds ◆Table Top DFP 【Features】 - Inspection device for mounted products at room temperature - Measurement field 192mm×240mm - Warpage data acquisition time approximately 1 second ● For more details, please contact us or download the catalog.

• Other measurement, recording and measuring instruments

You can select a measurement method that suits your measurement application (sample). Measurements can be taken under various conditions such as implemented products, strain, and when cooled!

The DFP module (AXP) can measure non-continuous flat surfaces (island-like) such as products with steps, packages with solder balls, and boards with recesses that could not be measured with shadow moire. The gantry fixture allows for movable measurement positions (capable of moving to specific locations on large samples). It is also possible to measure small structures such as connector holes with high-resolution XY (over 1.9 million pixels) and automatic mask processing. 【Features of Other Options】 - DFP2: Capable of measuring mounted items (steps, solder balls, unevenness, etc.) - DIC2.0: Capable of measuring strain (expansion, contraction, etc.) - SRT: Capable of heating/cooling from -55°C to 300°C - Visualization of both-sided behavior during mounting (reflow) is possible. 【Specifications】 ○ Compatible models – AXP ○ Maximum FOV (Field of View) – 100mm x 100mm ○ Maximum sample size – 400mm x 400mm For more details, please contact us or download the catalog.

• Other measurement, recording and measuring instruments

Introducing a high-performance film thickness measurement device that allows for the "easy" and "quick" measurement of various metal oxide films and metal films using the continuous electrochemical reduction method!

Therma Precision Co., Ltd. provides cutting-edge technology to electronic component manufacturers in Japan through the sale of manufacturing equipment and inspection and analysis equipment for major electronic components such as printed circuit boards, semiconductors, LCDs, and PDPs. 【About the Oxide and Metal Film Thickness Measurement Device】 The PC-M1 is a device that easily measures the thickness of thin film oxide and thin film metal using a continuous electrochemical reduction method. 【Metals for Oxide Measurement】 [About Oxide Measurement] ○ Copper: Cu2O, CuO, Cu2S ○ Tin: SnO, SnO2 ○ Silver: Ag2O, AgCl, Ag2SO4, Ag2S 〇 For other materials (such as aluminum), please consult us. Measurements are taken in various Å (angstrom) units. 【Comparison with Other Analyzers】 PC-M1 vs. Other Analyzers Measurement Time: Several hundred seconds vs. several hours Identification of Oxide Types: Possible vs. Difficult Measurement of Intermetallic Compounds: Possible vs. Difficult Equipment Cost: Within tens of millions vs. thousands to hundreds of millions Ease of Handling: Easy vs. Difficult Minimum Measurement Area: mm² vs. μm² For more details, please contact us or download the catalog.

• others

Measuring the warping of the substrate during heating using shadow moiré measurement! ◆Warping data obtained in about 2 seconds per point! ◆Achieving a resolution of 0.5 microns!

TherMoire AXP 3.0 utilizes shadow moiré measurement technology to enable surface analysis with a variety of optional modules. It visualizes the surface shape of samples in user-specified temperature profile environments. In addition to measuring warping during heating, optional features are available for analyzing surface behavior in sub-zero temperature environments and calculating CTE values. Furthermore, the design ensures high temperature uniformity due to the top and bottom heating. For more details, please contact us or download the catalog.

• Other measurement, recording and measuring instruments

Automation is possible at various points! Instant measurement of copper film thickness and the potential for increased production efficiency through advanced statistical processing is here!

How about fully automated measurement for the inspection of copper plating film thickness? The handheld copper plating thickness measurement device "Cabidarm" can automate various points such as the plating process, final inspection process, and incoming inspection. 【Features】 ○ Measurements are taken instantly ○ The dedicated probe does not scratch the substrate ○ It is possible to connect to a PC via USB cable for advanced statistical processing For more details, please contact us or download the catalog.

• Coating thickness gauge

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Sanei Hitec Co., Ltd. will exhibit at SENSOR EXPO JAPAN 2025, which will be held from September 10 (Wednesday) to September 12 (Friday), 2025. At this Sensor EXPO 2025, we will showcase our semiconductor design technology and high-performance IP (Intellectual Property) that support the evolution of sensors.

Sanei Hightex Co., Ltd. will exhibit at the "Student Formula Japan Championship 2025" at the Shizuoka Prefecture booth in Aichi Sky Expo Exhibition Halls E and F from September 11 to 13, 2025.

We would like to inform you that we will be exhibiting our products at the 63rd Annual Meeting of the Biophysical Society of Japan. If you are planning to attend, please be sure to stop by. ❚ Products to be Exhibited - Auto Patch Clamp System | Port-a-Patch mini This compact system eliminates the need for a microscope, vibration isolation table, manipulator, and Faraday cage, which are typically required for conventional patch clamp experiments. It does not require specialized skills or experience, allowing for easy data acquisition and verification. - Artificial Lipid Bilayer Experiment Device | Orbit mini This device allows for easy measurement of channel activity at the single-molecule level. It enables the formation of lipid membranes, reconstitution of membrane proteins, and single-channel measurements using only a micropipette in experiments utilizing artificial lipid bilayers, facilitating functional and structural analysis of target membrane proteins and evaluation of drug effects. - Liposome Preparation Device | Vesicle Prep Pro This is the world's first device capable of producing giant unilamellar vesicles (GUVs) with diameters ranging from 1 to 30 μm without the use of organic solvents, utilizing the electroporation method (vibrating hydrated lipid films in an alternating electric field).

The success or failure of an AI project depends on the quality and immediacy of the "data infrastructure." By combining no-code and low-code products, it is possible to achieve a seamless process from data collection to integration and AI utilization, efficiently building a data infrastructure that supplies high-quality data to AI. We will explain specific methods for flexibly and quickly constructing a data infrastructure, incorporating case studies and demos, and introduce key points of a data strategy to lead to successful AI utilization.