[8/30 Nagoya] Advantech Design-In Forum 2018

Delivering everything needed for industrial IoT in one package. Start IoT immediately.

A one-package solution that includes the necessary edge systems for IoT, IoT software platform services (WISE-PaaS), wireless I/O modules, sensors, and pre-configured Microsoft Azure services. Suitable for creating POCs for IoT application development, such as predictive maintenance applications for factories.

• server

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer ● Supports Intel 6th Generation Core U Series (i7/i5/i3/Celeron), 2 x DDR3L-1600/1333 SODIMM with a maximum of 16 GB ● DirectX 11.3, OpenGL 4.4, OpenCL 2.1, supports independent display of 3 screens: VGA + LVDS + HDMI ● Flexible design using integrated multiple I/O: MIOe expansion allows for designs suitable for specific market applications and retention of proprietary know-how ● 2x Gigabit Ethernet, HD Audio, rich I/O interfaces (2 COM, 2 SATA, SMBus/I2C, GPIO, 2 Full-size Mini PCIe (one with mSATA), 4 USB 2.0, 2 USB 3.0, and TPM 2.0) ● Intel AMT 11.0, WISE-PaaS/RMM, and embedded software API

• Industrial PCs

"Fanless | Rugged | Abundant I/O" 3 independent screen displays | Wide range: 9~36V | -40 to 85℃ | VGA/HDMI

Advantech's ARK series adopts a modular design that can meet various customer requirements for industrial embedded IoT applications, offering not only I/O customization but also innovative software packages that include cloud and AI analytics suites. 【Key Features of This Product】 ◆ Equipped with 6th generation Intel Core i3/i5/i7 processors ◆ Three independent display outputs: VGA + HDMI + optional display ◆ DDR4 SO-DIMM memory (up to 32 GB) ◆ Flexible expandability via PCI/PCIe x 4 ◆ Wide range input power supply of 9-36V ◆ Diverse I/O with 6x high-speed USB 3.0 and 8x COM ports ◆ 2x removable 2.5-inch HDD drive bays ◆ Compatible with Advantech iDoor modules

• Industrial PCs
• Embedded Board Computers

Fanless | Ultra-compact | Rugged | Abundant I/O Mini-PCIe | 4 COM | 12~24V | -20 to 60°C | VGA

Advantech's fanless embedded computer ARK series features a highly durable chassis with IP40 dust protection, 5G vibration resistance, and 50G shock resistance, along with an extended MTBF (Mean Time Between Failures). This series has obtained various safety certifications, including CE, FCC, CCC, UL, BSMI, and CB, allowing it to be sold in countries that enforce strict safety standards. 【Main Features of the Product】 ◆ Intel Celeron N3350 Dual-Core SoC ◆ VGA display, 4x RS-232/422/485, 2 x USB3.0 ◆ 1x full-size mini PCIe for communication modules ◆ 1 x 2.5-inch SATA III SSD/HDD, 1 x half-size mSATA ◆ Wide temperature range: -20 to 60℃ ◆ Lockable 12V DC input power supply ◆ 12-24V power module (optional) ◆ Advantech iDoor compatible two-layer module ◆ Compatible with Advantech WISE-PaaS/RMM

• Industrial PCs
• Embedded Board Computers

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151.

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151 ● OS: Compatible with WindowsR 10 IoT ● Equipped with Intel Q170 / H110 chipset, supports 7th & 6th generation IntelR Core i processors (LGA1151) ● 260-pin SO-DIMM x2, maximum 32GB DDR4 2133 MHz SDRAM ● Supports triple display via VGA / DP / HDMI / LVDS (eDP) ● Supports PCIe x16 (3rd generation), 1 F/S miniPCIe, 1 M.2 (NGFF), 6 USB 3.0, and 3 SATA III ● Compatible with a wide range of 12V-24V DC input ● Supports Intel vPro, AMT 11.0, PECI 3.0, software RAID 0,1,5,10, TPM 1.2 / 2.0 (optional) ● Supports WISE-PaaS/RMMlR and embedded software API

• Industrial PCs

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System - Intel Atom N3350 Dual-Core SoC - Semi-industrial fanless slim system, DIN rail or wall mount design - VGA display, COM port, USB 3.0 x2, LAN x1 on the front - DIO port x1, COM port x1 on the side - Compatible with Advantech WISE-PaaS/RMM

• Industrial PCs

7th generation Intel Core mobile processors, i7, i5, i3 3.5-inch SBC in size 14cm x 10cm.

- 7th generation Intel Core i7 / i5 / i3 + PCH QM175 - Dual channel DDR4 2400, up to 32GB (ECC option) - 1 Intel i210 GbE & 1 Intel i219 GbE with iAMT support - Rich I/O: 2 COM, SATA, USB 3.0, SMBus / I2C, 16-bit GPIO - Full-size mini PCIe or mSATA / M.2 E-key supporting NVME - 12V power input - Full-size mini PCIe or mSATA / M.2 E-key - NVME compatible (optional) - iManager, WISE-PaaS/RMM, emb. SW API support

• Industrial PCs
• Embedded Board Computers

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

We will showcase our new product "BLFF," a palletizing foam gripper that weighs only 1.9 kg and measures 350mm×250mm, ideal for bulk picking. We will also introduce various products that cater to different work applications, including durable suction cups and solutions for bag handling. Additionally, we are implementing energy-saving proposals by replacing ejectors to reduce compressed air consumption, which has become a challenge in many industries. If you have any issues with adhesion or transport, please feel free to consult with us at the venue. ■ Lightweight Foam Gripper for Collaborative Robots "CVGC Series" Despite weighing only 1.9 kg, this gripper has a theoretical lifting force of 100 kg, maximizing the payload capacity of collaborative robots. ■ Gripper for Films This gripper is designed to transport thin films gently, minimizing marks left on the surface. By utilizing 3D printing, we can accommodate highly flexible shape designs tailored to specific workpieces and applications. ■ Energy Saving Comparison Panel "Why does a single ejector consume less compressed air compared to a multi-stage ejector?" You can actually verify the differences in compressed air consumption through a comparative display using a flow meter and actual equipment.

We will be exhibiting at Smart Factory JAPAN, held at Tokyo Big Sight from November 18 (Wednesday) to November 20 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that integrate with both products! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Smart Factory JAPAN 2026 Overview ■■ Dates: November 18 (Wednesday), 19 (Thursday), 20 (Friday), 2026 Opening Hours: 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Hall 1-3 Our Booth Number: F-20 Registration: Nikkan Kogyo Shimbun 6 Exhibition Joint Site When visiting, please register in advance from your My Page and bring a printed admission ticket. Business meeting requests are also possible, so please make use of this opportunity.

We will be exhibiting at the Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition, held at Marine Messe Fukuoka from December 2 (Wednesday) to December 4 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that help improve efficiency and reform in manufacturing sites! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Overview of the 4th Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition ■■ Dates: December 4 (Wednesday), 5 (Thursday), 6 (Friday), 2026 Opening hours: 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka Our booth number: 14-18 When visiting, please register in advance through the dedicated page and bring your printed visitor badge.

Announcement of participation in the "12th Robot and Aerospace Festival Fukushima 2026 / 5th Drone Summit." 【Date and Time】 　November 27, 2026 (Wednesday) 10:00 AM - 5:00 PM Business Exhibition 　November 28, 2026 (Thursday) 10:00 AM - 4:00 PM General Exhibition 【Venue】 　Big Palette Fukushima (52 Minami 2-chome, Koriyama City, Fukushima Prefecture) 【Exhibits】 　Cardboard Insulated Box 　Craft Cooler Cube