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  4. [8/30 Nagoya] Advantech Design-In Forum 2018
SEMINAR_EVENT
  • Aug 07, 2018
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Aug 07, 2018

[8/30 Nagoya] Advantech Design-In Forum 2018

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This year's forum will feature key players in the IoT field, such as Microsoft Japan and Arm, as solution partners of Advantech, who will give presentations centered around the theme of edge x cloud. Additionally, the program will include a more luxurious lineup than in previous years, showcasing various solution-ready packages (SRP) utilizing Advantech's latest edge computing solutions across different verticals. Advantech Design-In Forum (ADF) 2018 Event Overview [Nagoya Venue] Date and Time: August 30, 2018 (Thursday) 13:15 - 19:00 (Registration and Exhibition: 12:00 -) Venue: Nagoya International Center 5F http://www.nic-nagoya.or.jp/japanese/nicnews/aramashi/nicaccess Capacity: 80 people Participation Fee: Free Contact: Advantech ADF Secretariat Phone: 0800-500-1055 (Toll-Free) Email: ajp_marcom@advantech.com
Date and time Thursday, Aug 30, 2018
01:00 PM ~ 07:00 PM
Capital Venue: Nagoya International Center 5F http://www.nic-nagoya.or.jp/japanese/nicnews/aramashi/nicaccess
Entry fee Free
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EIS-DK10 1 20161201153212.jpg

Edge Intelligence Starter Kit【EIS-DK10】

Delivering everything needed for industrial IoT in one package. Start IoT immediately.

A one-package solution that includes the necessary edge systems for IoT, IoT software platform services (WISE-PaaS), wireless I/O modules, sensors, and pre-configured Microsoft Azure services. Suitable for creating POCs for IoT application development, such as predictive maintenance applications for factories.

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MIO-5272.jpg

3.5-inch Single Board Computer SBC [MIO-5272]

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer ● Supports Intel 6th Generation Core U Series (i7/i5/i3/Celeron), 2 x DDR3L-1600/1333 SODIMM with a maximum of 16 GB ● DirectX 11.3, OpenGL 4.4, OpenCL 2.1, supports independent display of 3 screens: VGA + LVDS + HDMI ● Flexible design using integrated multiple I/O: MIOe expansion allows for designs suitable for specific market applications and retention of proprietary know-how ● 2x Gigabit Ethernet, HD Audio, rich I/O interfaces (2 COM, 2 SATA, SMBus/I2C, GPIO, 2 Full-size Mini PCIe (one with mSATA), 4 USB 2.0, 2 USB 3.0, and TPM 2.0) ● Intel AMT 11.0, WISE-PaaS/RMM, and embedded software API

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ARK-3520P.jpg

6th Generation Intel Core Industrial Embedded PC ARK-3520P

"Fanless | Rugged | Abundant I/O" 3 independent screen displays | Wide range: 9~36V | -40 to 85℃ | VGA/HDMI

Advantech's ARK series adopts a modular design that can meet various customer requirements for industrial embedded IoT applications, offering not only I/O customization but also innovative software packages that include cloud and AI analytics suites. 【Key Features of This Product】 ◆ Equipped with 6th generation Intel Core i3/i5/i7 processors ◆ Three independent display outputs: VGA + HDMI + optional display ◆ DDR4 SO-DIMM memory (up to 32 GB) ◆ Flexible expandability via PCI/PCIe x 4 ◆ Wide range input power supply of 9-36V ◆ Diverse I/O with 6x high-speed USB 3.0 and 8x COM ports ◆ 2x removable 2.5-inch HDD drive bays ◆ Compatible with Advantech iDoor modules

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  • Embedded Board Computers

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ARK-1124C%20Double_Front%20left%20_S2017112715343220180110101043.jpg

Intel Celeron Small Industrial Embedded PC ARK-1124C

Fanless | Ultra-compact | Rugged | Abundant I/O Mini-PCIe | 4 COM | 12~24V | -20 to 60°C | VGA

Advantech's fanless embedded computer ARK series features a highly durable chassis with IP40 dust protection, 5G vibration resistance, and 50G shock resistance, along with an extended MTBF (Mean Time Between Failures). This series has obtained various safety certifications, including CE, FCC, CCC, UL, BSMI, and CB, allowing it to be sold in countries that enforce strict safety standards. 【Main Features of the Product】 ◆ Intel Celeron N3350 Dual-Core SoC ◆ VGA display, 4x RS-232/422/485, 2 x USB3.0 ◆ 1x full-size mini PCIe for communication modules ◆ 1 x 2.5-inch SATA III SSD/HDD, 1 x half-size mSATA ◆ Wide temperature range: -20 to 60℃ ◆ Lockable 12V DC input power supply ◆ 12-24V power module (optional) ◆ Advantech iDoor compatible two-layer module ◆ Compatible with Advantech WISE-PaaS/RMM

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  • Embedded Board Computers

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AIMB-275.jpg

Mini-ITX Motherboard [AIMB-275]

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151.

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151 ● OS: Compatible with WindowsR 10 IoT ● Equipped with Intel Q170 / H110 chipset, supports 7th & 6th generation IntelR Core i processors (LGA1151) ● 260-pin SO-DIMM x2, maximum 32GB DDR4 2133 MHz SDRAM ● Supports triple display via VGA / DP / HDMI / LVDS (eDP) ● Supports PCIe x16 (3rd generation), 1 F/S miniPCIe, 1 M.2 (NGFF), 6 USB 3.0, and 3 SATA III ● Compatible with a wide range of 12V-24V DC input ● Supports Intel vPro, AMT 11.0, PECI 3.0, software RAID 0,1,5,10, TPM 1.2 / 2.0 (optional) ● Supports WISE-PaaS/RMMlR and embedded software API

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EPC-S201_Front IO _S20180521175110.jpg

Fanless Embedded Single Board Computer [EPC-S201]

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System - Intel Atom N3350 Dual-Core SoC - Semi-industrial fanless slim system, DIN rail or wall mount design - VGA display, COM port, USB 3.0 x2, LAN x1 on the front - DIO port x1, COM port x1 on the side - Compatible with Advantech WISE-PaaS/RMM

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MIO-5391.jpg

3.5-inch Single Board Computer SBC [MIO-5391]

7th generation Intel Core mobile processors, i7, i5, i3 3.5-inch SBC in size 14cm x 10cm.

- 7th generation Intel Core i7 / i5 / i3 + PCH QM175 - Dual channel DDR4 2400, up to 32GB (ECC option) - 1 Intel i210 GbE & 1 Intel i219 GbE with iAMT support - Rich I/O: 2 COM, SATA, USB 3.0, SMBus / I2C, 16-bit GPIO - Full-size mini PCIe or mSATA / M.2 E-key supporting NVME - 12V power input - Full-size mini PCIe or mSATA / M.2 E-key - NVME compatible (optional) - iManager, WISE-PaaS/RMM, emb. SW API support

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  • Embedded Board Computers

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Industrial Electrical Equipment
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[Notice of Exhibition Participation by Fukuda Co., Ltd.] __th Measurement and Measurement Exhibition INTERMEASURE 202_

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  • SEMINAR_EVENT

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 31st Measurement and Measurement Exhibition INTERMEASURE 2024 Official Website: https://intermeasure.org/itms2024/ 【 Dates 】 From __ (Wednesday) to __ (Friday), 202_ 【 Venue 】 Tokyo Big Sight (Tokyo International Conference Center) East Hall (Booth Number: ___) 【 Exhibited Products 】 - Air Leak Tester - Hydrogen Leak Detector - Pin Hole (Reference Test Piece) and more. For more details, please refer to the "Related Materials" (PDF file) below.

Aug 19, 2026

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[Seminar] New Ways to Delegate Work to Generation Z and Young Employees

  • NEW
  • SEMINAR_EVENT

[Instructor] Paulstar Communications Inc. Representative Director Koji Kita [Key Lecture Content] Have you ever felt that, despite entrusting work to Generation Z and young employees, they "don't seem to get started," "don't lead to the expected results," or "it's ultimately faster to do it myself"? Behind these situations are various factors, including the recognition gap between supervisors and young employees regarding "entrusting and being entrusted," how to communicate the purpose of the work, the approach, and the scope of discretion, as well as how to follow up after delegating tasks. In this seminar, we will practically explain "how to delegate work" to elicit proactive behavior, taking into account the perspectives and behavioral characteristics of Generation Z and young employees. We will share specific management techniques to help supervisors break free from the burden of work, encourage the autonomy and growth of young employees, and steadily lead to results.

Aug 18, 2026

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[Seminar] Latest Developments in China's Robo-Taxi Industry

  • NEW
  • SEMINAR_EVENT

[Speaker] Yoichiro Okuyama, Senior Researcher, Research Department, Hamagin Research Institute, Inc. [Key Lecture Content] In China, the operation of autonomous taxis began in 2021, and now fully unmanned robo-taxis are running in cities like Beijing and Shenzhen. Experiencing a ride reveals the evolution of technology through natural acceleration, smooth steering, and seamless deceleration. Currently, there are several thousand vehicles in operation, but projections suggest that by 2030, this number could exceed one million, accounting for 70% of the global total. What are the underlying factors driving the social implementation of robo-taxis in China? By incorporating local test ride experiences, we will analyze the revenue situation of robo-taxi operating companies and the outlook for market expansion based on data, exploring their future potential. [Lecture Items] 1. Personal experiences of test riding robo-taxis in China 2. Trends in the market size of robo-taxis in China and globally 3. Background of the advancing social implementation of robo-taxis in China 4. Public acceptance and actual usage 5. Performance and challenges of major robo-taxi companies 6. Will robo-taxis become widespread in Japan as well? 7. Q&A / Business card exchange

Aug 18, 2026

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102nd Tokyo International Gift Show Autumn 2026

Notice of Participation in the 102nd Tokyo International Gift Show Autumn 2026

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  • SEMINAR_EVENT

Daitō Shikō Co., Ltd. will exhibit at the "102nd Tokyo International Gift Show Autumn 2026," which will be held at Tokyo Big Sight from September 2 (Wednesday). At the exhibition venue, we plan to showcase new products including the A7 binder, popular foil-stamped goods, stationery, clear files, and more. If you are looking for SP tools, promotional items, or novelties, please be sure to visit our booth.

Aug 18, 2026

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Exhibition at the 1st High-Performance Materials Exhibition

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Our company will participate in the 1st High-Performance Materials Exhibition (within High-Performance Materials Week) as a member of the MGC Group. We will be showcasing various functional polycarbonate resins that can serve as alternatives to metals and ceramics, so please be sure to visit our booth.

Aug 18, 2026

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