[8/30 Nagoya] Advantech Design-In Forum 2018

Delivering everything needed for industrial IoT in one package. Start IoT immediately.

A one-package solution that includes the necessary edge systems for IoT, IoT software platform services (WISE-PaaS), wireless I/O modules, sensors, and pre-configured Microsoft Azure services. Suitable for creating POCs for IoT application development, such as predictive maintenance applications for factories.

• server

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer ● Supports Intel 6th Generation Core U Series (i7/i5/i3/Celeron), 2 x DDR3L-1600/1333 SODIMM with a maximum of 16 GB ● DirectX 11.3, OpenGL 4.4, OpenCL 2.1, supports independent display of 3 screens: VGA + LVDS + HDMI ● Flexible design using integrated multiple I/O: MIOe expansion allows for designs suitable for specific market applications and retention of proprietary know-how ● 2x Gigabit Ethernet, HD Audio, rich I/O interfaces (2 COM, 2 SATA, SMBus/I2C, GPIO, 2 Full-size Mini PCIe (one with mSATA), 4 USB 2.0, 2 USB 3.0, and TPM 2.0) ● Intel AMT 11.0, WISE-PaaS/RMM, and embedded software API

• Industrial PCs

"Fanless | Rugged | Abundant I/O" 3 independent screen displays | Wide range: 9~36V | -40 to 85℃ | VGA/HDMI

Advantech's ARK series adopts a modular design that can meet various customer requirements for industrial embedded IoT applications, offering not only I/O customization but also innovative software packages that include cloud and AI analytics suites. 【Key Features of This Product】 ◆ Equipped with 6th generation Intel Core i3/i5/i7 processors ◆ Three independent display outputs: VGA + HDMI + optional display ◆ DDR4 SO-DIMM memory (up to 32 GB) ◆ Flexible expandability via PCI/PCIe x 4 ◆ Wide range input power supply of 9-36V ◆ Diverse I/O with 6x high-speed USB 3.0 and 8x COM ports ◆ 2x removable 2.5-inch HDD drive bays ◆ Compatible with Advantech iDoor modules

• Industrial PCs
• Embedded Board Computers

Fanless | Ultra-compact | Rugged | Abundant I/O Mini-PCIe | 4 COM | 12~24V | -20 to 60°C | VGA

Advantech's fanless embedded computer ARK series features a highly durable chassis with IP40 dust protection, 5G vibration resistance, and 50G shock resistance, along with an extended MTBF (Mean Time Between Failures). This series has obtained various safety certifications, including CE, FCC, CCC, UL, BSMI, and CB, allowing it to be sold in countries that enforce strict safety standards. 【Main Features of the Product】 ◆ Intel Celeron N3350 Dual-Core SoC ◆ VGA display, 4x RS-232/422/485, 2 x USB3.0 ◆ 1x full-size mini PCIe for communication modules ◆ 1 x 2.5-inch SATA III SSD/HDD, 1 x half-size mSATA ◆ Wide temperature range: -20 to 60℃ ◆ Lockable 12V DC input power supply ◆ 12-24V power module (optional) ◆ Advantech iDoor compatible two-layer module ◆ Compatible with Advantech WISE-PaaS/RMM

• Industrial PCs
• Embedded Board Computers

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151.

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151 ● OS: Compatible with WindowsR 10 IoT ● Equipped with Intel Q170 / H110 chipset, supports 7th & 6th generation IntelR Core i processors (LGA1151) ● 260-pin SO-DIMM x2, maximum 32GB DDR4 2133 MHz SDRAM ● Supports triple display via VGA / DP / HDMI / LVDS (eDP) ● Supports PCIe x16 (3rd generation), 1 F/S miniPCIe, 1 M.2 (NGFF), 6 USB 3.0, and 3 SATA III ● Compatible with a wide range of 12V-24V DC input ● Supports Intel vPro, AMT 11.0, PECI 3.0, software RAID 0,1,5,10, TPM 1.2 / 2.0 (optional) ● Supports WISE-PaaS/RMMlR and embedded software API

• Industrial PCs

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System - Intel Atom N3350 Dual-Core SoC - Semi-industrial fanless slim system, DIN rail or wall mount design - VGA display, COM port, USB 3.0 x2, LAN x1 on the front - DIO port x1, COM port x1 on the side - Compatible with Advantech WISE-PaaS/RMM

• Industrial PCs

7th generation Intel Core mobile processors, i7, i5, i3 3.5-inch SBC in size 14cm x 10cm.

- 7th generation Intel Core i7 / i5 / i3 + PCH QM175 - Dual channel DDR4 2400, up to 32GB (ECC option) - 1 Intel i210 GbE & 1 Intel i219 GbE with iAMT support - Rich I/O: 2 COM, SATA, USB 3.0, SMBus / I2C, 16-bit GPIO - Full-size mini PCIe or mSATA / M.2 E-key supporting NVME - 12V power input - Full-size mini PCIe or mSATA / M.2 E-key - NVME compatible (optional) - iManager, WISE-PaaS/RMM, emb. SW API support

• Industrial PCs
• Embedded Board Computers

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 31st Measurement and Measurement Exhibition INTERMEASURE 2024 Official Website: https://intermeasure.org/itms2024/ 【 Dates 】 From __ (Wednesday) to __ (Friday), 202_ 【 Venue 】 Tokyo Big Sight (Tokyo International Conference Center) East Hall (Booth Number: ___) 【 Exhibited Products 】 - Air Leak Tester - Hydrogen Leak Detector - Pin Hole (Reference Test Piece) and more. For more details, please refer to the "Related Materials" (PDF file) below.

Nitto Kohki will exhibit at the "H₂ & FC EXPO Spring International Hydrogen and Fuel Cell Exhibition" held at Tokyo Big Sight, West Exhibition Hall 2, from February 28 (Wednesday) to March 1 (Friday), 2024. [Booth Number: W14-63] The quick fluid coupling "Coupler" is a product that allows for the rapid connection and disconnection of piping for various fluids such as air, water, oil, and chemical solutions. At this exhibition, we will primarily showcase the high-pressure hydrogen filling quick fluid coupling "HHV Coupler."

☆☆☆ Urgent Visit to Japan & Emergency Event Announcement ☆☆☆ Dr. Yuval Levy, CEO of ISCFDC and developer of EPPIC, who has been involved in CFD research at NASA Ames Research Center for about five years, is coming to Japan! He will demonstrate and explain advanced CFD technologies, application cases, and the latest features of EPPIC himself. □ Date and Time □ July 31, 2026 (Friday) 13:00-18:00 (Registration starts at 12:30) <Part 1: Post-Processor Session> 13:00-16:40 <Part 2: Pre-Processor Session> 16:50-17:50 <Networking Event> 18:10-19:40 □ For more details □ Visit the Hulinks page https://www.hulinks.co.jp/seminar/eppic/

[Viewer Benefits Available] Explaining Tips for LC in a Short Seminar Do you have concerns such as "I'm unsure about column selection," "I'm struggling to optimize analysis conditions," or "I have challenges analyzing compounds with weak retention" in LC analysis? Waters will hold a seminar titled "Must-Listen! Advanced LC Application Seminar" where you can learn practical LC analysis know-how in just 30 minutes. In this seminar, we will cover useful topics in a total of six sessions, including tips for choosing detectors, how to utilize reverse phase columns, scaling up to preparative LC, approaches for analyzing hydrophilic and highly polar compounds, case studies of low-adsorption HPLC, and improving purity through solid-phase extraction. Each session is scheduled to start at 15:00. Event Themes: • October 6 (Tuesday) - Session 1: Tips for Choosing Detectors • October 13 (Tuesday) - Session 2: Tips for Choosing Columns • October 21 (Wednesday) - Session 3: Tips for Preparative LC • October 27 (Tuesday) - Session 4: Approaches for Analyzing Hydrophilic and Highly Polar Compounds • November 5 (Tuesday) - Session 5: Case Studies of Low-Adsorption HPLC • November 10 (Tuesday) - Session 6: Tips for Solid-Phase Extraction

In liquid biopsy research, we will introduce a technical evaluation of proteome analysis to obtain reliable data from trace plasma, as well as case studies on data quality verification using the Contamination Index and Simple Western.