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  1. Home
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  3. ヒューブレイン
  4. Notice of Participation in SEMICON Japan 2018 (December 12-14, 2018)
SEMINAR_EVENT
  • Oct 31, 2018
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Oct 31, 2018

Notice of Participation in SEMICON Japan 2018 (December 12-14, 2018)

ヒューブレイン ヒューブレイン
Hubbrain Inc. will be exhibiting at SEMICON Japan 2018, which will be held at Tokyo Big Sight from December 12 (Wednesday) to 14 (Friday). This exhibition is an international trade show for the electronics manufacturing supply chain, covering all processes from the front-end to the back-end of semiconductor manufacturing, as well as SMART applications such as automotive and IoT devices. We will be showcasing compact inspection machines that enable diverse inspections with simple settings, as well as inspection equipment that utilizes a 2-megapixel color camera. <Exhibited Products> ■ Free-Angle Appearance Inspection Machine ■ Upper-Type Simple Inspection Machine ■ Wafer and Chip Appearance Inspection Equipment, etc. <Booth Number> ■ East 2 #2332 We sincerely look forward to your visit.
Date and time Wednesday, Dec 12, 2018 ~ Friday, Dec 14, 2018
10:00 AM ~ 05:00 PM
Capital ■Tokyo Big Sight ■135-0063 Ariake 3-11-1, Koto-ku, Tokyo Get off at "Kokusai Tenjijo" Station on the Rinkai Line, about a 7-minute walk Get off at "Kokusai Tenjijo Seimon" Station on the Yurikamome, about a 3-minute walk
Entry fee Free
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SCJ18_ShowsInfo_for_web.pdf[756579]

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Wafer chip appearance inspection device

Simultaneous inspection of front and back possible! A wafer and chip appearance inspection machine that can perform both macro and micro inspections with one unit. Suitable for LED and semiconductor chips.

The "Wafer Chip Appearance Inspection System HM-256 Series" features a standard 3CMOS 3.2 million pixel color camera, providing excellent detection capabilities and enabling high-speed inspection of chip appearances after wafer and dicing processes. It can inspect appearance defects that occur during the wafer and dicing processes with high speed and precision, allowing for the inspection of various chip patterns. 【Features】 ■ Inspection with variable image resolution (1.5 to 5µ) for each type ■ Inspection at sub-micron resolution possible with an embedded microscope (optional) ■ Defect classification based on complex conditions of image features ■ Inspection using multiple recipes (different image resolutions, lighting, and judgment programs) in a single run *For more details, please download the catalog or feel free to contact us.

  • Visual Inspection Equipment

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High-performance tabletop appearance inspection machine

Tabletop robot specifications! A low-cost, high-functionality tabletop appearance inspection machine.

The "High-Performance Tabletop Appearance Inspection Machine" is a compact tabletop inspection machine that uses a tabletop robot and has a footprint of 900×900 (mm) or less. Using our self-developed high-performance inspection software, it can accommodate various shapes of workpieces. The inspection results are displayed in real-time on a monitor in the form of an NG map, allowing for quick understanding of the product status. Despite its low price, it offers high-performance appearance inspection that is not inferior in quality. 【Features】 ■ Tabletop robot specification ■ Compatible with various shapes of workpieces ■ Easy inspection with a user-friendly interface ■ Inspection results displayed in real-time on a monitor in NG map format ■ Quick understanding of product status *For more details, please refer to the PDF document or feel free to contact us.

  • Other inspection equipment and devices
  • Visual Inspection Equipment

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Free Angle Appearance Inspection Device

Equipped with a 2-axis rotating robot! An appearance inspection device close to visual inspection is realized at a low price!

This product is a "Free Angle Appearance Inspection Device" equipped with a 2-axis rotating robot. The robot hand is equipped with arbitrary angle setting functionality and a rotating mechanism, allowing it to position the workpiece at angles and locations suitable for image inspection. It features a "parallel processing function" that inspects alternately using two hands, and a "full circumference inspection function" that transfers the workpiece from hand 1 to hand 2 for execution. The hand tip can accommodate various shapes such as chuck mechanisms and suction mechanisms, making it compatible with a variety of workpiece shapes. 【Features】 ■ Equipped with a 2-axis rotating robot ■ Lower price than conventional models ■ High-functionality image inspection system ■ Equipped with parallel processing and full circumference inspection functions ■ Compatible with various shapes *For more details, please refer to the PDF document or feel free to contact us.

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[Seminar] Initiatives for the Construction of Automated Logistics Roads

  • NEW
  • SEMINAR_EVENT

[Speaker] Ministry of Land, Infrastructure, Transport and Tourism, Road Bureau, Planning Division, Road Economic Research Office Planning Specialist Yuki Endo [Key Lecture Content] The Ministry of Land, Infrastructure, Transport and Tourism is advancing discussions on the realization of automated logistics roads as a new form of logistics in response to recommendations from the "Interim Summary on the State of High-Standard Road Networks," addressing logistics crises and carbon neutrality. This lecture will introduce the final summary on the state of automated logistics roads published in July of the 7th year of Reiwa, as well as the demonstration experiments planned for the 7th year of Reiwa. [Lecture Items] 1. Final summary on automated logistics roads 2. Demonstration experiments for the 7th year of Reiwa 3. Q&A / Business card exchange

Mar 18, 2026

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[Seminar] The Core of Connectivity Supporting SDV

  • NEW
  • SEMINAR_EVENT

[Speaker] NTT Docomo Business Inc. 5G & IoT Services Department Director in charge of Global Connected Cars, Yuji Tamai [Key Lecture Content] The value of SDV lies in continuously cycling 'updates × data × cloud', and connectivity is a prerequisite for this. In this presentation, we will organize the barriers of quality, cost, and regulation faced in global expansion, and explain the design principles and operational models from roaming enhancement, eSIM/RSP (SGP.32), integrated management (CMP), NTN, to Network API. Additionally, we will delve into security aspects related to connectivity, introducing phenomena observed in actual service operations and their countermeasures, as well as exploring other operational updates (staged delivery, avoiding simultaneous activation, monitoring/observability). [Lecture Items] 1. Positioning of connectivity in SDV 2. Barriers to global connectivity 3. Designing to "strengthen" roaming 4. eSIM/RSP and SGP.32 5. Integrated connectivity management (CMP) and operations 6. Further connectivity - NTN and Network API 7. Security and update operations 8. Q&A

Mar 18, 2026

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Graduating from a workplace that doesn't move unless you say so. How to change the field with a system.

  • NEW
  • SEMINAR_EVENT

"Even though I'm communicating, nothing changes." "When I give a warning, the atmosphere gets worse." — Are you trying to solve these problems just by changing how you interact? What you need is not to move people, but to create a workplace that is easy to navigate. I will explain based on numerous examples of on-site improvements that I have supported. Held on May 27 (Wednesday). Please check the LP for more details. ▼ For more information and registration (free), see below.

Mar 18, 2026

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Free Dry Fog Humidification System Demo Experience Event

  • NEW
  • SEMINAR_EVENT

At the Dry Fog Humidification System Free Demo Experience, you will have the opportunity to actually experience our Dry Fog, as well as our single-fluid and dual-fluid humidifiers. We will explain the differences from conventional humidifiers and the effects of implementation. In addition to introducing the latest case studies, we will also provide time for you to consult directly with our specialized staff. Please select a convenient venue and date from the application page and apply. * The "morning session" and "afternoon session" contain the same content. Please participate at a time that suits you. * This event is intended for users only. Participation from trading companies, other companies in the same industry, or for sales purposes to our company is not permitted. Venues: ■ Yamagata Venue: 3/12 (Wed) at Yamagata International Exchange Plaza 3/13 (Thu) at Sakata Chamber of Commerce and Industry ■ Sendai Venue: 3/14 (Fri) at Kiri no Ikeuchi Sendai Branch ■ Tokyo Venue & Osaka Venue: 3/18 (Tue), 3/19 (Wed), 3/21 (Fri) at Kiri no Ikeuchi Tokyo Sales Office & Kiri no Ikeuchi Osaka Headquarters ■ Nagoya Venue & Fukuoka Venue: 4/9 (Wed), 4/10 (Thu), 4/11 (Fri) at Kiri no Ikeuchi Nagoya Sales Office & Kiri no Ikeuchi Fukuoka Sales Office

Mar 18, 2026

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A Thorough Explanation of How to Proceed with AS/400 Rewrite through Q&A! - The Path to Project Success Revealed through On-Site Questions -

  • NEW
  • SEMINAR_EVENT

In recent years, as many companies are considering modernization, exploring methods for system renewal has become an important issue. This seminar will focus on "Rewrite," one of the solutions to such challenges, and will explain questions and issues encountered during project promotion in a Q&A format. <Program> - Opening - How to advance system renewal through "Rewrite" and key points for problem-solving - Introduction of unique tools to support migration <Recommended for> - Those who are struggling with specific methods for system renewal - Those who are concerned about the continuity of maintenance for existing systems and a shortage of personnel - Companies that own IBM i (AS/400) *We may refuse applications from competing companies or those not eligible to participate.

Mar 18, 2026

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