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  3. NITTA DuPont Incorporated
  4. [Technical Information] Groove Processing of CMP Polishing Pads 2
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  • Mar 07, 2019
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Mar 07, 2019

[Technical Information] Groove Processing of CMP Polishing Pads 2

NITTA DuPont Incorporated NITTA DuPont Incorporated
Last time, we explained how the groove processing on the surface of polishing pads affects the diffusion of slurry. Here, we will introduce examples that visually verify the diffusion effect of slurry due to grooves. We prepared six different types of groove processing as samples on the polishing pad "IC1000," which has become the de facto standard for semiconductor use. - Circular Groove - Perforated Groove - Radial Groove - Spiral Groove - XY Groove - Arc Groove When a blue-colored liquid is dripped under the same conditions, it becomes clear that the diffusion of the liquid varies depending on the groove processing. It can be confirmed that the circular grooves and spiral grooves have high slurry retention, while the radial grooves and arc grooves excel in slurry discharge. Thus, even with the same polishing pad, the diffusion of slurry differs due to groove processing, which affects the action of slurry intervening with the workpieces such as wafers. Therefore, the selection of groove processing is very important. Our company can assist you in selecting groove processing while considering your process conditions and targets, so please feel free to consult with us.
Slurry diffusion effect due to pad groove processing
Slurry diffusion effect due to pad groove processing
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IC1000(TM)画像.jpg

Foam Polyurethane Pad "IC1000(TM)"

The de facto standard for polishing pads in the CMP process. World market share No. 1!

There have been numerous successful adoptions to date, and we continue to maintain a high market share. The IC1000(TM) is designed based on special materials, manufacturing, and processing technologies, as well as advanced application evaluation techniques, ensuring optimal performance.

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EXTERION(TM)画像.jpg

Foam Polyurethane Pad "EXTERION(TM)"

Polishing pads optimal for primary polishing in mirror surface finishing.

The EXTERION(TM) series is a polyurethane foam pad created from advanced foam control technology. It is used for primary polishing of silicon wafers and compound substrates, providing a high-quality finish and reliable polishing performance. Additionally, its special processing technology demonstrates excellent thickness precision and startup performance.

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不織布パッド『SUBA』.JPG

Non-woven fabric pad "Suba(TM)"

A non-woven fabric-based polishing pad that responds well to various applications.

"Suba(TM)" is a polishing pad made from polyester fibers, with polyurethane impregnated into a non-woven fabric formed by a dry process. It demonstrates excellent performance primarily for primary and secondary polishing of silicon wafers, sapphire wafers, and oxide wafers. It can also be used for edge polishing and notch polishing, and offers a wide range of products tailored to each process. 【Features】 ■ High polishing rate ■ Low defect rate ■ High flatness *For more details, please refer to the catalog or feel free to contact us.

  • Wafer processing/polishing equipment
  • Hand polishing and filing
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H1000画像.png

Soft Pad "H1000"

Polishing pad for achieving defect-free finishes

The H1000 series pad was developed as a pad for final polishing of silicon wafers. Its unique resin design demonstrates excellent scratch performance, and the straight pore structure achieves high stability and long life.

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Related catalog(1)

Nitta Dupont Co., Ltd. "CMP Polishing Pad" Product Catalog

Nitta Dupont Co., Ltd. "CMP Polishing Pad" Product Catalog

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Handling of WINSTAR's TFT LCD modules | For display sections of measuring instruments and industrial equipment | We accept inquiries and estimates regarding size and interface.

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We handle TFT LCD modules from WINSTAR for use in display sections of devices. 【We receive inquiries in the following situations】 - Wanting to update the display section of measuring instruments or control panels - Looking for LCDs to incorporate into industrial equipment - Searching for a supplier that can accommodate small quantities 【We can assist with】 - Selecting sizes and interfaces that meet application and enclosure conditions - Confirming pin assignments and arranging samples - Developing custom products and embedded systems - Selling in small lots We also handle OLED (organic EL) modules from the same WINSTAR company. Please consider these as well for devices that want to take advantage of their thinness, low power consumption, and wide viewing angles. Please check the specific specifications in the manufacturer's datasheet. We also accept requests for quotes only.

Oct 12, 2026

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Hyper CLT flooring panel

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Oct 12, 2026

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Metal Crack Repair: MS Method for Repairing Cracks and Fractures in Machinery Equipment

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Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding methods for repairs can cause changes in the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

Oct 12, 2026

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Hyper CLT flooring panel

Quickly resolve your questions | We have added a Q&A page for Hyper CLT flooring.

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We have newly added a **"Frequently Asked Questions Q&A"** section to the Hyper CLT sheet website. It clearly summarizes many questions frequently asked by those considering the introduction of the product, such as "What types of civil engineering sites can it be used on?", "Can it be used on rainy days?", "Is it compatible with large machinery?", and "What is NETIS?". The Hyper CLT sheet is a lightweight wooden sheet utilizing wood CLT, suitable for a wide range of applications including temporary roads, access routes, and heavy machinery work yards. It is also registered as a **Ministry of Land, Infrastructure, Transport and Tourism NETIS registered technology "TH-250021-A"**. Since it is a new material, we will not leave any uncertainties unaddressed. We aim to create a website that makes it easy to resolve questions before introduction, including information on wood, NETIS, civil engineering, and CLT, and we will continue to enhance the Q&A section.

Oct 11, 2026

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Hyper CLT flooring panel

Added a glossary to the website to make technical terms easier to understand.

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We have added a new **"Glossary"** to the Hyper CLT sheet website. In the civil engineering and construction industries, there are many specialized terms such as "CLT," "NETIS," "temporary roads," and "wooden lightweight sheets." Therefore, we have introduced related terms in an easy-to-understand manner so that those who are encountering Hyper CLT sheets for the first time can understand the products and technologies. Hyper CLT sheets are wooden lightweight sheets for civil engineering that utilize wood CLT and are registered under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS technology as **"TH-250021-A."** We hope that by not only conveying the features of the product but also sharing the underlying technologies and terminology, users will feel a closer connection to Hyper CLT sheets. We will continue to enhance our website and provide clear information related to wood, NETIS, civil engineering, and CLT.

Oct 10, 2026

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