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  3. 羽生田鉄工所
  4. We will exhibit at "SAMPE Japan Advanced Materials Technology Exhibition 2019" (September 4 (Wed) - 6 (Fri), 2019 / Pacifico Yokohama).
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  • Aug 19, 2019
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Aug 19, 2019

We will exhibit at "SAMPE Japan Advanced Materials Technology Exhibition 2019" (September 4 (Wed) - 6 (Fri), 2019 / Pacifico Yokohama).

羽生田鉄工所 羽生田鉄工所
We will be exhibiting at the "SAMPE Japan Advanced Materials Technology Exhibition 2019" held at Pacifico Yokohama. We plan to demonstrate actual machines on the day. For more details, please refer to the invitation in the middle of this page. 【Exhibition Information】 Exhibition Name: SAMPE Japan Advanced Materials Technology Exhibition 2019 Date: September 4 (Wed) - 6 (Fri), 2019, 10:00 AM - 5:00 PM Venue/Booth Number: Pacifico Yokohama Hall A / Booth S-22 Admission Fee: 1,000 yen (Free for pre-registered attendees and those with invitation tickets) We hope you will stop by our booth during this opportunity. *If you need an invitation ticket, please contact us through the inquiry form.
Date and time Wednesday, Sep 04, 2019 ~ Friday, Sep 06, 2019
10:00 AM ~ 05:00 PM
Capital 【Exhibition Information】 Exhibition Name: SAMPE Japan Advanced Materials Technology Exhibition 2019 Date: September 4 (Wed) - 6 (Fri), 2019, 10:00 AM - 5:00 PM Venue/Booth Number: Pacifico Yokohama Hall A / Booth S-22 Admission Fee: 1,000 yen (Free for pre-registered attendees and those with invitation tickets)
Entry fee Charge Pre-registered participants and those with invitation tickets are free.
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SAMPE JAPAN 2019 案内状.pdf[646538]

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High Cycle Autoclave for Heating and Forming Composite Materials

Adopting direct heating and cooling methods! It is possible to significantly reduce molding time with efficient autoclave molding!

The Hanyuda Small Autoclave Series is an autoclave suitable for research and development as well as small parts production. Among them, the "High Cycle Autoclave" adopts a direct heating and cooling method, significantly reducing molding time and energy consumption compared to conventional autoclave molding. It was born as a more efficient small autoclave while maintaining the ease of use of the Dandelion. It can be used when many test specimens are needed for heating molding tests of various composite materials such as CFRP, as well as for various pressure evaluation tests. In addition to setting value input via the touch panel on the main unit, it also supports input and data management via PC. 【Features of the High Cycle Autoclave】 ■ Realization of efficient autoclave molding ■ Compatible with a wide range of matrix materials ■ Flexible control program settings ■ Compact size that does not require a specific installation location *For more details, please refer to the catalog or feel free to contact us.

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The birth of the small autoclave "Dandelion Forte"!

Supports composite molding over a wide temperature range with a maximum temperature of 380°C and a maximum pressure of 1.8MPa!

The Hanyuda small autoclave series is suitable for research and development as well as the production of small parts. Among them, the 'DANDELION-FORTE' is a higher model of the Dandelion, capable of molding with a wide range of resins at a maximum temperature of 380°C and a maximum pressure of 1.8MPa, specifically designed for low-temperature to 180°C curing types. It was developed as a more high-performance small autoclave while maintaining the ease of use of the Dandelion. It can be used for heating molding tests of various composite materials such as CFRP and various pressure evaluation tests in high-temperature molding that were not possible with the Dandelion. Additionally, it can be used for the production of small parts for aircraft-related components. In addition to setting value input via the touch panel on the main unit, it also supports input and data management via PC, and comes standard with a small cooling chiller. *For more details, please refer to the catalog or feel free to contact us.*

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羽生田鉄工所
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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

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We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Oct 08, 2026

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Creating an environment that thrives even in extreme heat: Introducing the results of closed-type greenhouse demonstrations and summer cooling methods - Exhibiting at the 14th Agricultural WEEK (commonly known as J-AGRI)

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Yazaki Energy System will be exhibiting at the "14th Agricultural WEEK (commonly known as J-AGRI)" held at Makuhari Messe. In response to challenges surrounding agriculture, such as record heat and soaring energy prices, our company proposes an agricultural system that utilizes surplus solar heat and waste heat from factories during the summer to support stable cultivation throughout the year, from winter heating to summer cooling. ■ Exhibition Details (Booth Number: 25-47) <Closed-type Agricultural House> Results from the second season and initiatives for the third season <Localized Cooling in Solar-Powered Agricultural Houses> Mechanism of substrate cooling, comparison of energy consumption with spatial cooling, growth conditions this summer <Cooling and Heating with Solar Heat> Examples of crown heating and house cooling, utilization of surplus heat in summer <Cooling of Crops and Workers with Well Water> Exhibition of a prototype well water cooler and proposals for the use of cooling jackets When you visit, please be sure to stop by our booth.

Oct 06, 2026

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Information on Autumn/Winter Internships for the Class of 2028

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We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Oct 06, 2026

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Notice of Participation in FOOD Expo 2026 (November 11-13, 2026)

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  • SEMINAR_EVENT

Notice of participation in the "FOOD Expo 2026." 【Date and Time】  November 11 (Wednesday) - 13 (Friday), 2026  Opening hours: 10:00 AM - 5:00 PM 【Venue】  Tokyo Big Sight  East Hall 2, Booth Number B-36 【Exhibits】  Cardboard insulated boxes  Craft cooler cubes  Vacuum insulated panel  Pallet cubes

Oct 06, 2026

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[Seminar] From Generative AI to Physical AI: The Cutting Edge of Market and Industry Structure and Technology Development

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[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange

Oct 06, 2026

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