【Product Introduction Webinar July 10 (Friday) 13:30 - 14:00】Introduction of the Edge AI Inference System AIR Series

Intel Movidius Myriad X VPU onboard

- Intel Movidius Myriad X VPU onboard - Ultra-compact, low power consumption - Hardware acceleration for general DNN (Deep Neural Network) - Scalable for multi-video stream edge inference - 10 times the performance compared to the previous generation - Perfect support with Intel OpenVINO toolkit

• Embedded Board Computers

4x PCIe equipped with Intel Movidius Myriad X VPU Edge AI acceleration module

- 4x/8x Intel Movidius Myriad X VPU onboard - General DNN (Deep Neural Network) hardware acceleration - Scalable for multi-video stream edge inference - 10 times the performance compared to the previous generation - Intel OpenVINO toolkit for inference performance optimization - Edge AI Suite with GUI for rapid evaluation

• Embedded Board Computers

Edge AI module equipped with one m.2 Intel Movidius Myriad X VPU.

- Intel Movidius Myriad X VPU onboard - Ultra-compact, low power consumption - Hardware acceleration for general DNN (Deep Neural Network) - Scalable for multi-video stream edge inference - 10 times the performance compared to the previous generation - Perfect support with Intel OpenVINO toolkit

• Embedded Board Computers

Intel Movidius VPU | 1080p 120fps encoding and decoding | 12~24V | OpenVINO support

Equipped with 2 x Intel Movidius Myriad X VPUs on an Intel Core i5 platform, it meets the needs of high-performance computing for applications such as up to 1080p video encoding and decoding, traffic monitoring, license plate and vehicle type recognition, and object recognition with multi-channel processing. 【Key Features of This Product】 ■ Intel Core i5-6442EQ QC SoC ■ 2x Intel Movidius Myriad X VPU MA2485 built-in ■ Supports Intel OpenVINO toolkit ■ Best-in-class graphics capabilities, supporting up to 1080p/240fps video encoding and decoding ■ Isolated 12-24VDC wide-range power input ■ Expandable diverse communication options, e.g., WLAN, WWAN ■ Vibration and shock resistant certified by MIL-STD-810G (rugged) ■ Certifications for general standards, CE, FCC, CB, UL, CCC, and BSMI ■ Built-in development kit Edge AI Suite

• Image Processing Equipment
• Industrial PCs
• Embedded Board Computers

DIN rail compatible | Versatile industrial edge AI computer focused on practicality

The AIR-101 is equipped with an Intel Atom E3940 Quad Core processor and 2 x Intel Movidius Myriad X VPUs, featuring a DIN rail design and a wide power input range (12V to 28V), making it ideal for applications such as AGVs and factory automation. 【Features】 ■ Equipped with Intel Atom E3940 Quad Core processor ■ Includes 2 x Intel Movidius Myriad X VPUs ■ Supports Intel OpenVINO toolkit ■ Built-in 1x SATA slim 64G SSD ■ Built-in 1x 204-pin SO-DIMM DDR3L 8GB memory ■ DIN rail AI system with I/O ports ■ M.2 2230 (for Wi-Fi or optional VEGA-320 module) ■ Built-in development kit Edge AI Suite with pre-trained AI models

• Industrial PCs

"Accurate facial recognition with AI, an astonishing 99.7%" Features high precision recognition rate. 4K ultra-high-definition digital signage player.

Equipped with an Intel Atom x7-E3950 CPU and 1 x Intel Movidius Myriad X VPU, this product supports multi-4K displays and features facial recognition, making it suitable for interactive kiosks and whiteboards in the retail industry. 【Key Features of This Product】 ■ Equipped with Intel Atom x7-E3950 processor ■ Equipped with Intel Movidius Myriad X VPU MA2485 x1 ■ nVidia GeForce GT 1030 ■ 4 x HDMI 4K resolution ■ GUI development kit Edge AI Suite for rapid evaluation ■ Low power, fanless signage player

• Industrial PCs
• Embedded Board Computers

Powerful edge AI inference system equipped with Intel Xeon E3 and 6th/7th generation Core i series.

A server-grade computer with multiple I/O options, compatible with Intel Xeon E3 / 6th/7th generation Core i series processors and PCIe x16 slots, capable of high-performance graphics cards, enabling fast AI inference and on-premise training for applications such as robotic AOI optical inspection systems. 【Key Features of This Product】 ■ Equipped with Intel Xeon / 6th & 7th Gen. Core i3/i5/i7 processors ■ Dual display: VGA + HDMI ■ Supports up to 32 GB of DDR4 SO-DIMM memory ■ 850W power supply bundled output ■ Drive bay options for two 2.5-inch hard drives ■ Supports high-output GPU cards with up to 260W PCIe x16

• Image Processing Equipment
• Industrial PCs

Schunk will showcase the Schunk DuraPower graphite separator at the International Hydrogen and Fuel Cell Expo (FC EXPO) 2023. We invite you to learn about our attractive product lineup and the latest technologies (such as hydrophilic surface treatment for high-output fuel cell stacks and core thickness < 250 micrometers) and to utilize them in your company. The International Hydrogen and Fuel Cell Expo (FC EXPO) 2023 will be held at Tokyo Big Sight from March 15 (Wednesday) to March 17 (Friday). We will be exhibiting at the German Pavilion in West Hall 1, booths 3-6, so please come visit us! [Exhibited Product: Features of the Graphite Separator] ■ Excellent corrosion resistance ■ High conductivity ■ Extremely good mechanical strength ■ Very high design flexibility compared to other materials and manufacturing methods ■ Gas sealing properties ■ In-house mold design and manufacturing

YOMURA JAPAN will exhibit at "Medtec Japan 2026," one of the largest specialized exhibitions in Japan focused on the development and manufacturing of medical devices and healthcare products. Experience our one-stop service for medical device manufacturing, from development support using cutting-edge 3D printing technology to mass production at our ISO 13485 and US FDA certified factory in Taiwan. We also welcome inquiries about material selection and certification consulting at our booth.

We will be exhibiting at the 2026 Osaka Bioplastics Exhibition and Business Meeting. Manack will introduce wood powder composite resins and examples of their molding. Please be sure to check the texture of the molded products at the venue. Dates: March 12, 2026 (Thursday) 12:30 PM - 5:00 PM March 13, 2026 (Friday) 9:30 AM - 4:00 PM Location: MyDome Osaka, 1st Floor Exhibition Hall We will also be presenting at a mini-seminar at the same venue on the following dates and times: March 12, 2026 (Thursday) 2:15 PM - 2:20 PM March 13, 2026 (Friday) 11:15 AM - 11:20 AM

We will be exhibiting at OPIE 26' held at Pacifico Yokohama from April 22 to 24. Our booth will be L-37 (Light and Imaging Sensor & Imaging EXPO). We plan to showcase the 3D line sensor CLS2, a single-point thickness sensor, a distance sensor, and Enovasense, which can measure the thickness of opaque objects.

The semiconductor fundamentals course by Nisshinbo Micro Devices has received positive feedback with numerous participants each time. This time, we will hold a session titled "Teaching AFE (Basics)" – Understanding the Principles of ADC and How to Read AFE Data Sheets. Many people encounter situations where they have questions about how to read data sheets when using AFE. In this webinar, we will introduce how to read the AFE data sheets from Nisshinbo Micro Devices, assisting users in selecting the appropriate AFE. The difficulty level is beginner to intermediate, making it suitable for those who want to learn the basics of ADC, those who are unsure about selecting an AFE, and those who have questions. With recorded presentations and live chat Q&A with our engineers, even busy engineers can learn efficiently. ● Target Participants - Those who want to learn the basics of ADC - Those who have never used AFE - Those who are unsure about selecting an AFE - Those who want to know how to read AFE data sheets ● Agenda 1. Principles of ADC 2. Overview of AFE 3. How to Read AFE Data Sheets 4. Summary We look forward to your participation.