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  1. Home
  2. Industrial Electrical Equipment
  3. ビームセンス
  4. Starting from October 1, 2020, we began offering contracted services for wiring pattern photography and CAD data conversion of images.
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  • Dec 04, 2020
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Dec 04, 2020

Starting from October 1, 2020, we began offering contracted services for wiring pattern photography and CAD data conversion of images.

ビームセンス ビームセンス
To analyze the wiring and metal patterns of multilayer substrates, printed circuit boards were cut layer by layer and visually inspected (using visible light). This method destroys the printed circuit boards, making it difficult to analyze valuable substrates, and non-destructive testing is desired. On the other hand, conventional non-destructive X-ray CT imaging faced challenges in layer separation of multilayer printed circuit boards due to limitations in resolution and density resolution. We have now developed a new X-ray CT system that allows for high-resolution CT imaging of multilayer circuit boards, enabling layer separation. Additionally, we have adopted new CAD software to visualize the wiring patterns layer by layer in CAD format for our clients. *Please note that we will not be exhibiting at "SEMICON Japan 2020," which we have participated in every year. If you would like more details, please feel free to contact us.
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Start of contracted service for wiring pattern photography and CAD data conversion of images.

X-ray CT enables the separation and extraction of wiring patterns on multilayer circuit boards! *CT imaging case study collection available.

To analyze the wiring and metal patterns of multilayer printed circuit boards, we used to cut the printed circuit boards layer by layer and conduct visual (visible light) inspections. This method destroys the printed circuit boards, making it difficult to analyze valuable boards, and non-destructive inspection is desired. On the other hand, conventional non-destructive X-ray CT imaging faced challenges in layer separation of multilayer printed circuit boards due to limitations in resolution and density resolution. We have now developed a new X-ray CT system that allows for high-resolution CT imaging of multilayer circuit boards, enabling layer separation. Additionally, we have adopted new CAD software to provide wiring patterns visualized in CAD format layer by layer. [Features] ■ Separation and extraction of wiring patterns of multilayer boards using X-ray CT ■ Provision of wiring patterns visualized in CAD format layer by layer ■ Conversion of images of circuit board wiring patterns into CAD data *For more details, please refer to the PDF document or feel free to contact us.

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Related catalog(4)

[CT Imaging Case] Separation and CAD Conversion of 8-Layer Substrate Copper Foil Pattern

[CT Imaging Case] Separation and CAD Conversion of 8-Layer Substrate Copper Foil Pattern

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Start of contracted service for wiring pattern photography and CAD data conversion of images.

Start of contracted service for wiring pattern photography and CAD data conversion of images.

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[CT Imaging Example] Separation of 20-layer substrate copper foil pattern

[CT Imaging Example] Separation of 20-layer substrate copper foil pattern

TECHNICAL
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[CT Imaging Case] Separation of Copper Foil Patterns on a 6-Layer Substrate

[CT Imaging Case] Separation of Copper Foil Patterns on a 6-Layer Substrate

TECHNICAL
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CCS3 product photo

The new product "Vehicle Count Sensor CCS3" enables efficient occupancy management of large parking lots.

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Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily understandable at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

Oct 22, 2026

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Footwear measures to reduce the risk of slipping on rainy days | Hyper CLT flooring

  • NEW
  • PRODUCT

When it rains, the pathways at construction sites quickly become muddy, and puddles and ruts also form. The risk of workers tripping or slipping increases as they walk on the mud. Hyper CLT boards are lightweight wooden boards that utilize CLT. By laying them down in worker pathways, access routes, and material storage areas, the area where workers walk directly on the muddy ground can be reduced, providing a solution for foot safety during rainy weather. The 5×10 board weighs about 230 kg, making it relatively lightweight, and depending on site conditions, it can be easily installed, removed, or relocated. It can also be considered for repositioning as needed based on construction progress and weather conditions. However, laying wooden boards does not guarantee that they will be slip-resistant. It is important to check for slopes, puddles, mud, seams, and shifts, and to perform necessary measures such as securing, draining, and cleaning as needed. The Hyper CLT board is a registered technology under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS program, designated as "TH-250021-A." With NETIS, civil engineering, CLT, and lightweight wooden boards as new options, it supports the creation of safe work sites on rainy days.

Oct 22, 2026

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AAEON UP Series Board for Embedded Applications with Intel Core Processor (Series 3) [UP WCL]

  • NEW
  • PRODUCT

Features: ● Equipped with Intel Core Processor (Series 3) ● Onboard LPDDR5 memory: up to 24GB ● Onboard UFS storage: up to 256GB ● 2.5GbE (2.5 Gigabit Ethernet): 1 port ● HDMI 2.1 (TMDS): 1 port ● USB 3.2 Type-A: 3 ports ● 10-pin GPIO: 1 port ● Power input: 12V DC * This model does not include an operating system.

Oct 22, 2026

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AAEON Intel Core Series 3 equipped UP Series Edge Ultra-Compact Edge PC [BOXER-6619-TWL]

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Features: ● Equipped with Intel Core Processor (Series 3) ● Onboard LPDDR5 memory: up to 48GB ● Onboard UFS storage: up to 256GB ● 2.5GbE (Intel Ethernet Controller I226-IT): 2 ports ● USB 3.2 Type-A: 2 ports ● USB 3.2 Gen 2x2 Type-C: 1 port ● 40-pin GPIO: 1 port ● HDMI 2.1 (TMDS): 2 ports ● DisplayPort 1.4a: via USB Type-C ×1 ● RS-232/422/485 serial ports: 2 ports ● M.2 2230 E-Key: 1 slot ● M.2 2280 M-Key: 1 slot ● M.2 2242 M-Key: 1 slot ● Equipped with TPM 2.0 (Trusted Platform Module) ● Input power: DC 12–24V * This model does not come with an operating system.

Oct 22, 2026

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AAEON Intel Core Series 3 Equipped UP Series Ultra-Compact Edge PC [UP WCL Edge]

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  • PRODUCT

Features: ● Equipped with Intel Core Processor (Series 3) ● Onboard LPDDR5 memory: up to 24GB ● Onboard UFS storage: up to 256GB ● 2.5GbE LAN port ×1 ● HDMI 2.1 (TMDS) ×1 ● USB 3.2 Type-A ports ×3 ● DC input: 12V / 5A ● M.2 2230 E-Key slot ×1 ● 10-pin GPIO ×1 * This model does not come with an operating system.

Oct 22, 2026

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