Webinar (2/25): "Visualization Solutions for Mold Interiors" in Semiconductor Resin Encapsulation and IoT Technology
In this webinar, we will use CG videos to quantify the internal state of molds, which can be considered a black box, using the semiconductor encapsulation process as an example. We will provide detailed insights into improving major molding defects and enhancing production processes. Kistler's piezoelectric pressure sensors are highly advantageous and optimal for the conditions of semiconductor encapsulation. We will also propose sensing technologies to improve major molding defects using piezoelectric sensors effective for low-pressure measurements, such as epoxy transfer molding.
Please check the details through the link below and register using the registration form.
https://info.kistler.com/ja-webinar-sealed-molding
Additionally, it may be helpful to review the technical explanation page below in advance for better understanding.
https://info.kistler.com/sealed-molding-ja
The webinar will be held twice, but both dates will cover the same content. Please choose a date that is convenient for you. We look forward to the participation of many attendees.

| Date and time | Thursday, Feb 25, 2021 10:30 AM ~ 11:30 AM |
|---|---|
| Entry fee | Free |
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