We have uploaded TDC YouTube Exhibition part 7!

New proposal for precision nanoimprinting! We have established a polishing technology that allows for processing without fogging or scratches.

The "High Precision Roll" can achieve nano-level surface roughness while precisely managing dimensional and shape accuracy, regardless of the material. We have developed our own roll grinding equipment and established a polishing technology that allows for processing without fogging or scratches. Additionally, the range of compatible materials has increased, and we can now process not only stainless steel, nickel, and glass, but also titanium and pure aluminum. 【Features】 ■ Achieves nano-level surface roughness ■ Established polishing technology that allows processing without fogging or scratches ■ Supports from single items to mass production ■ Handles everything from material procurement to complete processing *For more details, please refer to the PDF document or feel free to contact us.

• others

Pursuing extreme flatness!

◆Flatness: Below 30nm◆ Our unique ultra-precision lapping process achieves extreme flatness. For example, a flatness of 30 nanometers can be achieved in a 50mm area. This technology is particularly useful for semiconductor device components, suction plates, precision stages, and other applications that require high levels of flatness. ex) Flatness: 0.1um (φ100 area)

• Other semiconductors

◆Surface roughness Ra1nm or less◆

At TDC, we achieve the ultimate surface roughness through advanced technologies such as grinding, polishing, and CMP. Surface roughness of Ra 1 nm or less can be achieved with almost all materials!

• Sensors
• Wafer
• Optical Experimental Parts

Compatible with all materials! Our ultra-precision mirror finishing technology achieves various desired accuracies.

At TDC, which engages in the manufacturing and processing of electronic components, we provide comprehensive solutions to meet our customers' needs by combining various machining, lapping, and polishing processes. We accommodate all types of materials, including metals, ceramics, glass, semiconductors, and new materials. Our ultra-precision mirror finishing technology enables us to achieve various desired precision levels. Please feel free to contact us for quotes or inquiries regarding processing. 【Processing Precision】 ■ Surface Roughness: Ra1nm ■ Flatness: 30nm ■ Parallelism: 100nm ■ Dimensional Tolerance: 100nm ■ Angle: ±3 seconds ■ Sphericity: 50nm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Surface roughness around 1 nanometer is possible with most materials! TDC's ultra-precision mirror finishing technology 【Free booklet giveaway】

By adding TDC's ultra-precision mirror finishing to existing processing methods, it is possible to significantly enhance not only the appearance through the mirror finish but also the product's functionality, accuracy, and quality. ＊＊＊＊＊＊＊　Content Overview　＊＊＊＊＊＊＊＊＊＊ 　■ Types of Polishing 　　・Lap Polishing 　　・CMP Polishing 　　・Buff Polishing 　　・Electropolishing 　　・Barrel Polishing 　　・Blast Polishing 　　・Magnetic Polishing 　■ What is Lap Processing? 　■ What is TDC's Ultra-Precision Mirror Finishing? 　　・Compatible with all materials 　　・High-precision processing 　　・Non-flat processing 　　・Metal foils 　　・Mirror-fit spacers 　　・Highly reliable measuring instruments 　■ Applications 　　・Examples of use in MEMS micro-machining technology 　　・Examples from other industries ＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊

• Other machine elements
• plastic
• Ceramics

We realize ultra-precision manufacturing with our unique ultra-precision/wrapping processing technology!

At TDC Corporation, we base our operations on ultra-precision mirror finishing technology, enabling us to achieve sub-nanometer level surface roughness, sub-micron level flatness, parallelism, and dimensional accuracy. Not only do we realize individual precision, but we also excel in achieving complex precision. We accept polishing of not just flat surfaces, but also curved surfaces, spherical surfaces, and both inner and outer diameters. In addition to precise polishing, we are also skilled in general machining processes such as "cutting," "grinding," and "shape processing." With our comprehensive processing equipment and years of accumulated know-how, we are ready to respond to your overall manufacturing inquiries. 【Processing Technologies】 ■ Ultra-precision polishing / Lapping ■ Cutting / Grinding *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Achieved ultra-precise spacers/shims with sub-micron tolerances through precision grinding. This enables high-precision fine adjustments in the assembly of precision equipment and molds.

Ultra-precise assemblies can be achieved with submicron tolerance shims. At TDC, we offer standard shims in sizes ranging from M2 to M8. Additionally, we can manufacture washers, corner plates, and other shapes, sizes, and quantities as per your requirements. Please let us know your specifications. We accept orders starting from one piece. Feel free to request a quote. Furthermore, TDC has developed "Mirror Fit Spacers" with a mirror finish on the surface. Shims finished to a mirror surface have minimal displacement when used in assembly, providing excellent dimensional stability. For more details, please contact our sales representative. For additional information, you can download our catalog, and we also have a web catalog available.

• stainless

It is possible to produce metal foil with a surface roughness at the single nanometer level in the form of a hoop-shaped roll extending up to 100 meters.

We perform mirror finishing on various metal foils (such as SUS304, copper, aluminum, brass, nickel, molybdenum, tungsten foil, etc.) using our unique wrapping processing technology. We have independently developed an automatic mirror finishing device that continuously supplies, polishes, and rolls up long tape-like metal foils. In addition to long strips, we also accept mirror polishing of metal foils in desired shapes (from a thickness of 0.001mm). For long strips, we can accommodate thicknesses starting from 0.01mm (depending on the material) and sizes up to 300mm (based on past performance). 【Supported Materials】 SUS304, copper, aluminum, brass, nickel, molybdenum, tungsten foil, etc., with plans for gradual expansion. For more details, please contact us.

• Processing Contract

Applied to nanoimprinting and high-performance films! Polishing process that eliminates scratches and cloudiness.

The "Precision Mirror Surface Cylindrical Roll/Shaft" can achieve nano-level surface roughness while maintaining dimensional and shape accuracy, thanks to TDC's technology. We have developed our own roll grinding equipment and established polishing technology that allows for processing without fogging or scratches. The range of compatible materials has also increased, and in addition to stainless steel, nickel, and glass, we can now also process titanium and pure aluminum. 【Features】 - Independently developed polishing equipment that automatically polishes the outer diameter of cylindrical shapes - Compatible with outer diameters up to φ500 mm and lengths of L=3,000 mm (3 meters) - Supports from single items to mass production - Handles everything from material procurement to complete processing *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

Establishing innovative grinding technology! Achieving ultimate surface roughness and TTV in a short time and at low cost.

At TDC, which engages in the manufacturing and processing of electronic components, we have established an innovative polishing technology for next-generation power device materials, 'SiC wafers.' SiC is considered a promising material for next-generation power devices due to its excellent material properties, but the cost of the polishing process has been a barrier. In response, we have developed our unique polishing technology in collaboration with the Tohoku University Advanced Molecular Materials Research Institute and under the guidance of the National Institute of Advanced Industrial Science and Technology, successfully achieving wafer quality (roughness and TTV) in a short time and at a low cost. [Features] - Joint research with Tohoku University Advanced Molecular Materials Research Institute - Efficiently achieving high precision in SiC surface roughness and TTV - Short time and low cost - Support from single units to mass production - Comprehensive support from material procurement to all processing *For more details, please refer to the PDF document or feel free to contact us.

• Wafer
• Wafer processing/polishing equipment

● The production time for casting prototypes can be shortened! Since model making is not required, the production time for prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly creating sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or variations in dimensions, can be created in a single molding process. This allows for the verification of multiple types in a short period.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without affecting the base material with heat. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

This time, the ACS-5000 is available as a facial recognition terminal compatible with FaceMe Security's add-on feature "Face Terminal," enabling access control management that combines "advanced anti-spoofing features" with high-speed facial recognition powered by edge AI. ■ Main Features 1. Accelerated Authentication Processing FaceMe Security is optimized for the MediaTek Genio 700's NPU, achieving faster facial recognition processing and reduced CPU load compared to processing solely on the CPU. It ensures stable authentication without delays even during peak times such as clocking in and out, contributing to alleviating congestion. 2. Advanced "Anti-Spoofing" Optimized for the IR + RGB camera mounted on the ACS-5000, it can quickly detect fraudulent authentication using photos, videos, or 3D masks within 0.6 seconds, ensuring reliable identity verification. 3. Door Control Without Additional Equipment FaceMe Security can directly control the digital I/O of the ACS-5000, allowing for the construction of an access control management system without the need for additional equipment. This simplifies system configuration and reduces implementation costs.

This is an air leak tester for battery cases of electric vehicles (EVs). The battery case has the characteristic of being "large with a significant internal volume, and its structure may deform due to internal pressure." As a result, air leak testing generates "noise caused by its large size and capacity" and "noise caused by expansion or deformation due to internal pressurization." To mitigate this noise, this device features a newly developed smoothing function and a linear fitting correction function used in combination during measurement. Additionally, to achieve low-pressure control that is difficult to manage and to expand flow for large volumes, we provide a bypass box (CBU-600) equipped with an electro-pneumatic regulator for precise pressure control and a pressurization valve with a large effective diameter to supply high flow rates. Measurement methods: Work-Work comparison, Work-Master comparison, Fixed Master comparison Measurement pressure range: 10 kPa, 20 kPa, 50 kPa (depending on specifications) Gauge pressure sensor accuracy: ±2% F.S. Differential pressure sensor accuracy: ±0.5% F.S. Group settings: 0 to 31 groups Power supply voltage / Power consumption: AC100 to 240 V / 100 VA

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!