We have uploaded TDC YouTube Exhibition part 7!

New proposal for precision nanoimprinting! We have established a polishing technology that allows for processing without fogging or scratches.

The "High Precision Roll" can achieve nano-level surface roughness while precisely managing dimensional and shape accuracy, regardless of the material. We have developed our own roll grinding equipment and established a polishing technology that allows for processing without fogging or scratches. Additionally, the range of compatible materials has increased, and we can now process not only stainless steel, nickel, and glass, but also titanium and pure aluminum. 【Features】 ■ Achieves nano-level surface roughness ■ Established polishing technology that allows processing without fogging or scratches ■ Supports from single items to mass production ■ Handles everything from material procurement to complete processing *For more details, please refer to the PDF document or feel free to contact us.

• others

Pursuing extreme flatness!

◆Flatness: Below 30nm◆ Our unique ultra-precision lapping process achieves extreme flatness. For example, a flatness of 30 nanometers can be achieved in a 50mm area. This technology is particularly useful for semiconductor device components, suction plates, precision stages, and other applications that require high levels of flatness. ex) Flatness: 0.1um (φ100 area)

• Other semiconductors

◆Surface roughness Ra1nm or less◆

At TDC, we achieve the ultimate surface roughness through advanced technologies such as grinding, polishing, and CMP. Surface roughness of Ra 1 nm or less can be achieved with almost all materials!

• Sensors
• Wafer
• Optical Experimental Parts

Compatible with all materials! Our ultra-precision mirror finishing technology achieves various desired accuracies.

At TDC, which engages in the manufacturing and processing of electronic components, we provide comprehensive solutions to meet our customers' needs by combining various machining, lapping, and polishing processes. We accommodate all types of materials, including metals, ceramics, glass, semiconductors, and new materials. Our ultra-precision mirror finishing technology enables us to achieve various desired precision levels. Please feel free to contact us for quotes or inquiries regarding processing. 【Processing Precision】 ■ Surface Roughness: Ra1nm ■ Flatness: 30nm ■ Parallelism: 100nm ■ Dimensional Tolerance: 100nm ■ Angle: ±3 seconds ■ Sphericity: 50nm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Surface roughness around 1 nanometer is possible with most materials! TDC's ultra-precision mirror finishing technology 【Free booklet giveaway】

By adding TDC's ultra-precision mirror finishing to existing processing methods, it is possible to significantly enhance not only the appearance through the mirror finish but also the product's functionality, accuracy, and quality. ＊＊＊＊＊＊＊　Content Overview　＊＊＊＊＊＊＊＊＊＊ 　■ Types of Polishing 　　・Lap Polishing 　　・CMP Polishing 　　・Buff Polishing 　　・Electropolishing 　　・Barrel Polishing 　　・Blast Polishing 　　・Magnetic Polishing 　■ What is Lap Processing? 　■ What is TDC's Ultra-Precision Mirror Finishing? 　　・Compatible with all materials 　　・High-precision processing 　　・Non-flat processing 　　・Metal foils 　　・Mirror-fit spacers 　　・Highly reliable measuring instruments 　■ Applications 　　・Examples of use in MEMS micro-machining technology 　　・Examples from other industries ＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊

• Other machine elements
• plastic
• Ceramics

We realize ultra-precision manufacturing with our unique ultra-precision/wrapping processing technology!

At TDC Corporation, we base our operations on ultra-precision mirror finishing technology, enabling us to achieve sub-nanometer level surface roughness, sub-micron level flatness, parallelism, and dimensional accuracy. Not only do we realize individual precision, but we also excel in achieving complex precision. We accept polishing of not just flat surfaces, but also curved surfaces, spherical surfaces, and both inner and outer diameters. In addition to precise polishing, we are also skilled in general machining processes such as "cutting," "grinding," and "shape processing." With our comprehensive processing equipment and years of accumulated know-how, we are ready to respond to your overall manufacturing inquiries. 【Processing Technologies】 ■ Ultra-precision polishing / Lapping ■ Cutting / Grinding *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Achieved ultra-precise spacers/shims with sub-micron tolerances through precision grinding. This enables high-precision fine adjustments in the assembly of precision equipment and molds.

Ultra-precise assemblies can be achieved with submicron tolerance shims. At TDC, we offer standard shims in sizes ranging from M2 to M8. Additionally, we can manufacture washers, corner plates, and other shapes, sizes, and quantities as per your requirements. Please let us know your specifications. We accept orders starting from one piece. Feel free to request a quote. Furthermore, TDC has developed "Mirror Fit Spacers" with a mirror finish on the surface. Shims finished to a mirror surface have minimal displacement when used in assembly, providing excellent dimensional stability. For more details, please contact our sales representative. For additional information, you can download our catalog, and we also have a web catalog available.

• stainless

It is possible to produce metal foil with a surface roughness at the single nanometer level in the form of a hoop-shaped roll extending up to 100 meters.

We perform mirror finishing on various metal foils (such as SUS304, copper, aluminum, brass, nickel, molybdenum, tungsten foil, etc.) using our unique wrapping processing technology. We have independently developed an automatic mirror finishing device that continuously supplies, polishes, and rolls up long tape-like metal foils. In addition to long strips, we also accept mirror polishing of metal foils in desired shapes (from a thickness of 0.001mm). For long strips, we can accommodate thicknesses starting from 0.01mm (depending on the material) and sizes up to 300mm (based on past performance). 【Supported Materials】 SUS304, copper, aluminum, brass, nickel, molybdenum, tungsten foil, etc., with plans for gradual expansion. For more details, please contact us.

• Processing Contract

Applied to nanoimprinting and high-performance films! Polishing process that eliminates scratches and cloudiness.

The "Precision Mirror Surface Cylindrical Roll/Shaft" can achieve nano-level surface roughness while maintaining dimensional and shape accuracy, thanks to TDC's technology. We have developed our own roll grinding equipment and established polishing technology that allows for processing without fogging or scratches. The range of compatible materials has also increased, and in addition to stainless steel, nickel, and glass, we can now also process titanium and pure aluminum. 【Features】 - Independently developed polishing equipment that automatically polishes the outer diameter of cylindrical shapes - Compatible with outer diameters up to φ500 mm and lengths of L=3,000 mm (3 meters) - Supports from single items to mass production - Handles everything from material procurement to complete processing *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

Establishing innovative grinding technology! Achieving ultimate surface roughness and TTV in a short time and at low cost.

At TDC, which engages in the manufacturing and processing of electronic components, we have established an innovative polishing technology for next-generation power device materials, 'SiC wafers.' SiC is considered a promising material for next-generation power devices due to its excellent material properties, but the cost of the polishing process has been a barrier. In response, we have developed our unique polishing technology in collaboration with the Tohoku University Advanced Molecular Materials Research Institute and under the guidance of the National Institute of Advanced Industrial Science and Technology, successfully achieving wafer quality (roughness and TTV) in a short time and at a low cost. [Features] - Joint research with Tohoku University Advanced Molecular Materials Research Institute - Efficiently achieving high precision in SiC surface roughness and TTV - Short time and low cost - Support from single units to mass production - Comprehensive support from material procurement to all processing *For more details, please refer to the PDF document or feel free to contact us.

• Wafer
• Wafer processing/polishing equipment

Features: ● Equipped with Intel Core Ultra 5 125H/Ultra 7 155H・155U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● LVDS x1, eDP x1, DP x1, HDMI x1 ● LAN x3, SATA 6Gb/s x1, 8-bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● M.2 2280 M-Key x1 (PCIe 4.0 [x4]/SATA), M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heat spreader and fan-equipped heat sink sold separately GENE-MTH6-FAN: Fan-equipped heat sink GENE-MTH6-HSP: Heat spreader * Memory, storage, and OS are sold separately.

Features: ● Equipped with Intel Core i3-N305 / Processor N97 ● DDR5 4800MHz SO-DIMM x1 slot (up to 16GB) (sold separately) ● LVDS Dual Channel 18/24 bit x1, VGA x1, HDMI x1 ● Intel 2.5GbE x2, SATA 6Gb/s x1, 8bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● Full size mPCIe/mSATA ● M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heatsink included * Memory, storage, and OS sold separately

Features: ● Equipped with Intel Core Ultra 5 225H/7 255H (Arrow Lake) ● DDR5 6400MHz dual-channel SODIMM x 2 (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-key x 1, M.2 3052 B-key x 1, M.2 2230 E-key x 1 ● Supports DC input of 9 to 36V ● Fan-equipped heat sink available separately GENE-MTH6-FAN: Heat sink with fan GENE-MTH6-HSP: Heat spreader (requires heat dissipation in the enclosure) * This model does not include OS/memory/storage.

The non-contact beam touch sensor "HA-T401/HA-T520" has a compact detection range, making it an ideal automatic door sensor for installation on automatic doors facing narrow corridors or busy streets. Depending on the application and installation location, you can choose between "non-vision mounting type" and "non-vision built-in type." 【Features】 ● With the beam touch sensor, you can open and close the automatic door simply by bringing your hand close without touching it, ensuring hygiene. ● Depending on the installation environment, such as single sliding or bi-parting doors, the detection range can be set in four ways: left, center, right, with 4 spots and 12 spots settings. ● Two types of activation row settings are available to reduce unnecessary opening and closing of the automatic door due to cross traffic, contributing to energy-saving effects. ● The touch switch and infrared sensor are integrated, allowing for a switch between beam touch and infrared sensor modes with a single model. 【Recommended for such places!】 ☑ Entrances facing busy corridors ☑ Counters or signs near the door ☑ Buildings facing narrow corridors ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors ◎ For more details, please download the materials or contact us.

Japan is among the top 10 countries in the world with frequent earthquakes. The 2020 White Paper on Land, Infrastructure, Transport and Tourism has also reported an increase in the probability of significant earthquakes occurring. For the Nankai Trough earthquake, the probability of an earthquake with a magnitude of 8 to 9 occurring within the next 30 years is estimated to be 70 to 80%. At Hotron, we recommend the introduction of seismic devices for earthquake measures in buildings and equipment. The seismic device 'HK-2' is a product that automatically performs various controls that have been pre-set when it detects strong shaking equivalent to a seismic intensity of 5 lower or higher. For example, it can automatically execute actions such as: "Open automatic doors and gates to secure evacuation routes and access for emergency vehicles" "Transmit signals to the control room and stop facility equipment" "Unlock the keys to locked lockers" "Automatically play voice guidance" ◎ For more details, please download the materials or contact us.