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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. Grinding technology "SiC wafer"

Grinding technology "SiC wafer"

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last updated:Apr 17, 2018

ティ・ディ・シー
ティ・ディ・シー
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Establishing innovative grinding technology! Achieving ultimate surface roughness and TTV in a short time and at low cost.

At TDC, which engages in the manufacturing and processing of electronic components, we have established an innovative polishing technology for next-generation power device materials, 'SiC wafers.' SiC is considered a promising material for next-generation power devices due to its excellent material properties, but the cost of the polishing process has been a barrier. In response, we have developed our unique polishing technology in collaboration with the Tohoku University Advanced Molecular Materials Research Institute and under the guidance of the National Institute of Advanced Industrial Science and Technology, successfully achieving wafer quality (roughness and TTV) in a short time and at a low cost. [Features] - Joint research with Tohoku University Advanced Molecular Materials Research Institute - Efficiently achieving high precision in SiC surface roughness and TTV - Short time and low cost - Support from single units to mass production - Comprehensive support from material procurement to all processing *For more details, please refer to the PDF document or feel free to contact us.

    WaferWafer processing/polishing equipment
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Grinding technology "SiC wafer"

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  • Related Link - http://mirror-polish.com/wafer/

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basic information

For more details, please refer to the PDF document or feel free to contact us.

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P5

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Grinding technology "SiC wafer"

Grinding technology "SiC wafer"

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We have won the Miyagi Grand Prix in Fuk Prefecture!

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We have been awarded the 9th "Miyagi Prefecture Grand Prix" from Miyagi Prefecture. I am very honored to receive this award, which is given to those recognized for their significant contributions to the development of the prefecture's industries and the revitalization of the local economy. We will continue to move forward, using this as motivation.

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Tohoku Broadcasting "Charge!" Special Program

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On February 1st, our company was introduced on the Tohoku Broadcasting program "Charge!" in a segment titled "Infiltration! Company." You can see the appearance of our field engineers and the inside of our factory, which are not usually visible. It has also been uploaded to YouTube, so please take a look. You can view it through the related links below.

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We have uploaded TDC YouTube Exhibition part 7!

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Title: "Introduction of TDC Original Products" This time, we would like to introduce the TDC original product, the mirror paperweight. At first glance, it seems like an ordinary mirror, but we, the employees, call it "the mirror that reflects inconvenient truths." Since there is absolutely no distortion, it clearly shows unwanted pores and blemishes compared to commercially available mirrors. Additionally, this mirror can also be used as a paperweight. As a lucky paperweight, we create each one with the sentiment of "no problem, it's okay, let's overcome it." If you are interested, please feel free to contact us. You can view it through the related links below.

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ティ・ディ・シー

ティ・ディ・シー

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We specialize particularly in ultra-precision mirror surface processing, with a maximum size capability of φ1500 for single-sided machines. We excel in improving flatness, parallelism, and surface roughness for precision stages and suction plates. For suction plates around φ300*10t, we produce with flatness of 0.001, parallelism of 0.001, and Ra below 0.01 (for SUS material). For φ100*5t (materials such as SUS, Ni, Ti, Mo, Ta, W, ceramics, Si, etc.), we can manufacture plates with precision of less than 0.001 in flatness and around Ra 0.001, which are used as ultra-high precision jigs and molds. ◆ Selected as one of the 300 vibrant small and medium-sized manufacturing companies in 2007. ◆ ◆ Chosen as one of the "Global Niche Top 100 Companies" by the Ministry of Economy, Trade and Industry in 2014. ◆ Selected as a "Regional Future Leading Company" by the Ministry of Economy, Trade and Industry in 2018.

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