Tohoku Broadcasting "Charge!" Special Program

New proposal for precision nanoimprinting! We have established a polishing technology that allows for processing without fogging or scratches.

The "High Precision Roll" can achieve nano-level surface roughness while precisely managing dimensional and shape accuracy, regardless of the material. We have developed our own roll grinding equipment and established a polishing technology that allows for processing without fogging or scratches. Additionally, the range of compatible materials has increased, and we can now process not only stainless steel, nickel, and glass, but also titanium and pure aluminum. 【Features】 ■ Achieves nano-level surface roughness ■ Established polishing technology that allows processing without fogging or scratches ■ Supports from single items to mass production ■ Handles everything from material procurement to complete processing *For more details, please refer to the PDF document or feel free to contact us.

• others

Pursuing extreme flatness!

◆Flatness: Below 30nm◆ Our unique ultra-precision lapping process achieves extreme flatness. For example, a flatness of 30 nanometers can be achieved in a 50mm area. This technology is particularly useful for semiconductor device components, suction plates, precision stages, and other applications that require high levels of flatness. ex) Flatness: 0.1um (φ100 area)

• Other semiconductors

◆Surface roughness Ra1nm or less◆

At TDC, we achieve the ultimate surface roughness through advanced technologies such as grinding, polishing, and CMP. Surface roughness of Ra 1 nm or less can be achieved with almost all materials!

• Sensors
• Wafer
• Optical Experimental Parts

Compatible with all materials! Our ultra-precision mirror finishing technology achieves various desired accuracies.

At TDC, which engages in the manufacturing and processing of electronic components, we provide comprehensive solutions to meet our customers' needs by combining various machining, lapping, and polishing processes. We accommodate all types of materials, including metals, ceramics, glass, semiconductors, and new materials. Our ultra-precision mirror finishing technology enables us to achieve various desired precision levels. Please feel free to contact us for quotes or inquiries regarding processing. 【Processing Precision】 ■ Surface Roughness: Ra1nm ■ Flatness: 30nm ■ Parallelism: 100nm ■ Dimensional Tolerance: 100nm ■ Angle: ±3 seconds ■ Sphericity: 50nm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Surface roughness around 1 nanometer is possible with most materials! TDC's ultra-precision mirror finishing technology 【Free booklet giveaway】

By adding TDC's ultra-precision mirror finishing to existing processing methods, it is possible to significantly enhance not only the appearance through the mirror finish but also the product's functionality, accuracy, and quality. ＊＊＊＊＊＊＊　Content Overview　＊＊＊＊＊＊＊＊＊＊ 　■ Types of Polishing 　　・Lap Polishing 　　・CMP Polishing 　　・Buff Polishing 　　・Electropolishing 　　・Barrel Polishing 　　・Blast Polishing 　　・Magnetic Polishing 　■ What is Lap Processing? 　■ What is TDC's Ultra-Precision Mirror Finishing? 　　・Compatible with all materials 　　・High-precision processing 　　・Non-flat processing 　　・Metal foils 　　・Mirror-fit spacers 　　・Highly reliable measuring instruments 　■ Applications 　　・Examples of use in MEMS micro-machining technology 　　・Examples from other industries ＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊

• Other machine elements
• plastic
• Ceramics

Applied to nanoimprinting and high-performance films! Polishing process that eliminates scratches and cloudiness.

The "Precision Mirror Surface Cylindrical Roll/Shaft" can achieve nano-level surface roughness while maintaining dimensional and shape accuracy, thanks to TDC's technology. We have developed our own roll grinding equipment and established polishing technology that allows for processing without fogging or scratches. The range of compatible materials has also increased, and in addition to stainless steel, nickel, and glass, we can now also process titanium and pure aluminum. 【Features】 - Independently developed polishing equipment that automatically polishes the outer diameter of cylindrical shapes - Compatible with outer diameters up to φ500 mm and lengths of L=3,000 mm (3 meters) - Supports from single items to mass production - Handles everything from material procurement to complete processing *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

Establishing innovative grinding technology! Achieving ultimate surface roughness and TTV in a short time and at low cost.

At TDC, which engages in the manufacturing and processing of electronic components, we have established an innovative polishing technology for next-generation power device materials, 'SiC wafers.' SiC is considered a promising material for next-generation power devices due to its excellent material properties, but the cost of the polishing process has been a barrier. In response, we have developed our unique polishing technology in collaboration with the Tohoku University Advanced Molecular Materials Research Institute and under the guidance of the National Institute of Advanced Industrial Science and Technology, successfully achieving wafer quality (roughness and TTV) in a short time and at a low cost. [Features] - Joint research with Tohoku University Advanced Molecular Materials Research Institute - Efficiently achieving high precision in SiC surface roughness and TTV - Short time and low cost - Support from single units to mass production - Comprehensive support from material procurement to all processing *For more details, please refer to the PDF document or feel free to contact us.

• Wafer
• Wafer processing/polishing equipment

We realize ultra-precision manufacturing with our unique ultra-precision/wrapping processing technology!

At TDC Corporation, we base our operations on ultra-precision mirror finishing technology, enabling us to achieve sub-nanometer level surface roughness, sub-micron level flatness, parallelism, and dimensional accuracy. Not only do we realize individual precision, but we also excel in achieving complex precision. We accept polishing of not just flat surfaces, but also curved surfaces, spherical surfaces, and both inner and outer diameters. In addition to precise polishing, we are also skilled in general machining processes such as "cutting," "grinding," and "shape processing." With our comprehensive processing equipment and years of accumulated know-how, we are ready to respond to your overall manufacturing inquiries. 【Processing Technologies】 ■ Ultra-precision polishing / Lapping ■ Cutting / Grinding *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Achieved ultra-precise spacers/shims with sub-micron tolerances through precision grinding. This enables high-precision fine adjustments in the assembly of precision equipment and molds.

Ultra-precise assemblies can be achieved with submicron tolerance shims. At TDC, we offer standard shims in sizes ranging from M2 to M8. Additionally, we can manufacture washers, corner plates, and other shapes, sizes, and quantities as per your requirements. Please let us know your specifications. We accept orders starting from one piece. Feel free to request a quote. Furthermore, TDC has developed "Mirror Fit Spacers" with a mirror finish on the surface. Shims finished to a mirror surface have minimal displacement when used in assembly, providing excellent dimensional stability. For more details, please contact our sales representative. For additional information, you can download our catalog, and we also have a web catalog available.

• stainless

Fukuda Co., Ltd., which develops, manufactures, and sells leak testing equipment to inspect airtightness and sealing performance, provides a technical document that clearly explains the methods and theories of airtight testing, titled "Technical Manual." We are offering it as a PDF file. Please take this opportunity to download and view it!

● What is a packaging container air leak test device? It is a leak testing device that identifies the peeling, tearing, and presence of pinholes in packaging containers for pharmaceuticals and other products, conducting a Container Closure Integrity Test (CCIT). It can be applied to a wide variety of packaging containers, including flexible packaging, bottle containers, and glass containers, primarily in pharmaceutical packaging. The measurement method employs the <sealed chamber method (pressure change leak testing method 1)>. A sample is placed in the chamber, and by applying pressure or vacuum and measuring the pressure change within the chamber, quantitative inspection is performed. It can be used in various scenarios, including offline manufacturing, inline manufacturing, CMC laboratories, quality control laboratories, and stability testing. * The containers subject to inspection are referred to as "work" or "samples." Here, specific samples are referred to as "samples" to differentiate the terminology.

The pinhole inspection for packaging engineering is fully automated, eliminating packaging defects based on certain quality standards. The judgment results and operational status can be managed via a monitor screen. - Quantitative management of quality standards for the pinhole inspection process - Ensuring the quality of the product's shelf life - Establishing evaluation criteria for the manufacturing process, achieving quantitative quality assurance - Slim and space-saving design that can be connected to existing production lines - Quick changeover for product variety switching can be handled in a short time by exchanging chambers - Fully domestically produced, allowing for rapid maintenance and troubleshooting - Example target works: pillow packaging, packaged rice (packaged cooked rice), etc. *Please consult us regarding the use of this product for pharmaceuticals.

In construction work, it is important not only to focus on the building itself but also to create a safe environment for construction vehicles and workers to move around. The Hyper CLT plywood is a lightweight wooden board that utilizes CLT. It can be used as temporary materials to support temporary roads, material delivery routes, heavy machinery work yards, material storage areas, and worker pathways, rather than as structural materials for buildings. The 5×10 board weighs approximately 230 kg, making it relatively lightweight and easy to install, remove, or relocate depending on site conditions. This allows for the boards to be moved in accordance with the progress of the construction, making it easier to effectively utilize limited space. Additionally, the natural texture of the wood blends well with construction sites in residential areas and around public facilities, contributing to considerations for metal noise and summer heat reflection. The Hyper CLT plywood is a registered technology under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS system, designated as "TH-250021-A." It can be incorporated into highly public construction projects and exterior and earthworks, promoting the use of new technologies and environmental considerations. Wooden plywood, NETIS, civil engineering, CLT, lightweight wooden boards. A new option for temporary materials using wood is available for construction sites.

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or variations in dimensions, can be molded at the same time in a single molding process. This allows for the verification of multiple types in a short period.