Establishing innovative grinding technology! Achieving ultimate surface roughness and TTV in a short time and at low cost.
At TDC, which engages in the manufacturing and processing of electronic components, we have established an innovative polishing technology for next-generation power device materials, 'SiC wafers.' SiC is considered a promising material for next-generation power devices due to its excellent material properties, but the cost of the polishing process has been a barrier. In response, we have developed our unique polishing technology in collaboration with the Tohoku University Advanced Molecular Materials Research Institute and under the guidance of the National Institute of Advanced Industrial Science and Technology, successfully achieving wafer quality (roughness and TTV) in a short time and at a low cost. [Features] - Joint research with Tohoku University Advanced Molecular Materials Research Institute - Efficiently achieving high precision in SiC surface roughness and TTV - Short time and low cost - Support from single units to mass production - Comprehensive support from material procurement to all processing *For more details, please refer to the PDF document or feel free to contact us.
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We specialize particularly in ultra-precision mirror surface processing, with a maximum size capability of φ1500 for single-sided machines. We excel in improving flatness, parallelism, and surface roughness for precision stages and suction plates. For suction plates around φ300*10t, we produce with flatness of 0.001, parallelism of 0.001, and Ra below 0.01 (for SUS material). For φ100*5t (materials such as SUS, Ni, Ti, Mo, Ta, W, ceramics, Si, etc.), we can manufacture plates with precision of less than 0.001 in flatness and around Ra 0.001, which are used as ultra-high precision jigs and molds. ◆ Selected as one of the 300 vibrant small and medium-sized manufacturing companies in 2007. ◆ ◆ Chosen as one of the "Global Niche Top 100 Companies" by the Ministry of Economy, Trade and Industry in 2014. ◆ Selected as a "Regional Future Leading Company" by the Ministry of Economy, Trade and Industry in 2018.
