We have uploaded TDC YouTube Exhibition part 7!

New proposal for precision nanoimprinting! We have established a polishing technology that allows for processing without fogging or scratches.

The "High Precision Roll" can achieve nano-level surface roughness while precisely managing dimensional and shape accuracy, regardless of the material. We have developed our own roll grinding equipment and established a polishing technology that allows for processing without fogging or scratches. Additionally, the range of compatible materials has increased, and we can now process not only stainless steel, nickel, and glass, but also titanium and pure aluminum. 【Features】 ■ Achieves nano-level surface roughness ■ Established polishing technology that allows processing without fogging or scratches ■ Supports from single items to mass production ■ Handles everything from material procurement to complete processing *For more details, please refer to the PDF document or feel free to contact us.

• others

Pursuing extreme flatness!

◆Flatness: Below 30nm◆ Our unique ultra-precision lapping process achieves extreme flatness. For example, a flatness of 30 nanometers can be achieved in a 50mm area. This technology is particularly useful for semiconductor device components, suction plates, precision stages, and other applications that require high levels of flatness. ex) Flatness: 0.1um (φ100 area)

• Other semiconductors

◆Surface roughness Ra1nm or less◆

At TDC, we achieve the ultimate surface roughness through advanced technologies such as grinding, polishing, and CMP. Surface roughness of Ra 1 nm or less can be achieved with almost all materials!

• Sensors
• Wafer
• Optical Experimental Parts

Compatible with all materials! Our ultra-precision mirror finishing technology achieves various desired accuracies.

At TDC, which engages in the manufacturing and processing of electronic components, we provide comprehensive solutions to meet our customers' needs by combining various machining, lapping, and polishing processes. We accommodate all types of materials, including metals, ceramics, glass, semiconductors, and new materials. Our ultra-precision mirror finishing technology enables us to achieve various desired precision levels. Please feel free to contact us for quotes or inquiries regarding processing. 【Processing Precision】 ■ Surface Roughness: Ra1nm ■ Flatness: 30nm ■ Parallelism: 100nm ■ Dimensional Tolerance: 100nm ■ Angle: ±3 seconds ■ Sphericity: 50nm *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Surface roughness around 1 nanometer is possible with most materials! TDC's ultra-precision mirror finishing technology 【Free booklet giveaway】

By adding TDC's ultra-precision mirror finishing to existing processing methods, it is possible to significantly enhance not only the appearance through the mirror finish but also the product's functionality, accuracy, and quality. ＊＊＊＊＊＊＊　Content Overview　＊＊＊＊＊＊＊＊＊＊ 　■ Types of Polishing 　　・Lap Polishing 　　・CMP Polishing 　　・Buff Polishing 　　・Electropolishing 　　・Barrel Polishing 　　・Blast Polishing 　　・Magnetic Polishing 　■ What is Lap Processing? 　■ What is TDC's Ultra-Precision Mirror Finishing? 　　・Compatible with all materials 　　・High-precision processing 　　・Non-flat processing 　　・Metal foils 　　・Mirror-fit spacers 　　・Highly reliable measuring instruments 　■ Applications 　　・Examples of use in MEMS micro-machining technology 　　・Examples from other industries ＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊

• Other machine elements
• plastic
• Ceramics

We realize ultra-precision manufacturing with our unique ultra-precision/wrapping processing technology!

At TDC Corporation, we base our operations on ultra-precision mirror finishing technology, enabling us to achieve sub-nanometer level surface roughness, sub-micron level flatness, parallelism, and dimensional accuracy. Not only do we realize individual precision, but we also excel in achieving complex precision. We accept polishing of not just flat surfaces, but also curved surfaces, spherical surfaces, and both inner and outer diameters. In addition to precise polishing, we are also skilled in general machining processes such as "cutting," "grinding," and "shape processing." With our comprehensive processing equipment and years of accumulated know-how, we are ready to respond to your overall manufacturing inquiries. 【Processing Technologies】 ■ Ultra-precision polishing / Lapping ■ Cutting / Grinding *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Achieved ultra-precise spacers/shims with sub-micron tolerances through precision grinding. This enables high-precision fine adjustments in the assembly of precision equipment and molds.

Ultra-precise assemblies can be achieved with submicron tolerance shims. At TDC, we offer standard shims in sizes ranging from M2 to M8. Additionally, we can manufacture washers, corner plates, and other shapes, sizes, and quantities as per your requirements. Please let us know your specifications. We accept orders starting from one piece. Feel free to request a quote. Furthermore, TDC has developed "Mirror Fit Spacers" with a mirror finish on the surface. Shims finished to a mirror surface have minimal displacement when used in assembly, providing excellent dimensional stability. For more details, please contact our sales representative. For additional information, you can download our catalog, and we also have a web catalog available.

• stainless

It is possible to produce metal foil with a surface roughness at the single nanometer level in the form of a hoop-shaped roll extending up to 100 meters.

We perform mirror finishing on various metal foils (such as SUS304, copper, aluminum, brass, nickel, molybdenum, tungsten foil, etc.) using our unique wrapping processing technology. We have independently developed an automatic mirror finishing device that continuously supplies, polishes, and rolls up long tape-like metal foils. In addition to long strips, we also accept mirror polishing of metal foils in desired shapes (from a thickness of 0.001mm). For long strips, we can accommodate thicknesses starting from 0.01mm (depending on the material) and sizes up to 300mm (based on past performance). 【Supported Materials】 SUS304, copper, aluminum, brass, nickel, molybdenum, tungsten foil, etc., with plans for gradual expansion. For more details, please contact us.

• Processing Contract

Applied to nanoimprinting and high-performance films! Polishing process that eliminates scratches and cloudiness.

The "Precision Mirror Surface Cylindrical Roll/Shaft" can achieve nano-level surface roughness while maintaining dimensional and shape accuracy, thanks to TDC's technology. We have developed our own roll grinding equipment and established polishing technology that allows for processing without fogging or scratches. The range of compatible materials has also increased, and in addition to stainless steel, nickel, and glass, we can now also process titanium and pure aluminum. 【Features】 - Independently developed polishing equipment that automatically polishes the outer diameter of cylindrical shapes - Compatible with outer diameters up to φ500 mm and lengths of L=3,000 mm (3 meters) - Supports from single items to mass production - Handles everything from material procurement to complete processing *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

Establishing innovative grinding technology! Achieving ultimate surface roughness and TTV in a short time and at low cost.

At TDC, which engages in the manufacturing and processing of electronic components, we have established an innovative polishing technology for next-generation power device materials, 'SiC wafers.' SiC is considered a promising material for next-generation power devices due to its excellent material properties, but the cost of the polishing process has been a barrier. In response, we have developed our unique polishing technology in collaboration with the Tohoku University Advanced Molecular Materials Research Institute and under the guidance of the National Institute of Advanced Industrial Science and Technology, successfully achieving wafer quality (roughness and TTV) in a short time and at a low cost. [Features] - Joint research with Tohoku University Advanced Molecular Materials Research Institute - Efficiently achieving high precision in SiC surface roughness and TTV - Short time and low cost - Support from single units to mass production - Comprehensive support from material procurement to all processing *For more details, please refer to the PDF document or feel free to contact us.

• Wafer
• Wafer processing/polishing equipment

Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily understandable at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

The wooden lightweight sheet "Hyper CLT Sheet," utilizing CLT (Cross Laminated Timber), is a sponsor of the Masters Koshien (Okayama). The Masters Koshien is where those who have experienced high school baseball come together across generations to pursue their goals once again. We resonate with their "attitude of continuing to challenge" and support their activities from Okayama. The Hyper CLT Sheet is a product created to provide a new option in civil engineering sites, which have primarily relied on steel sheets until now. It is lightweight, easy to handle, and features the environmental value unique to wood. Furthermore, it is registered as a **Ministry of Land, Infrastructure, Transport and Tourism NETIS technology "TH-250021-A,"** aiming for widespread adoption in various sites, starting with public works. Wood, NETIS, civil engineering, CLT, wooden lightweight sheets. We will continue to support challenges in both the field and sports from Okayama. Masters Koshien (Okayama) https://masters-okayama.com/

Features: ● Intel Core Ultra (Series 2) processor LGA 1851 socket (CPU sold separately) ● DDR5 6400MT/s dual-channel support, CU/U-DIMM x2 (up to 128GB) (memory sold separately) ● M.2 M-Key x1, E-Key x1 ● USB 3.2 x4, USB 2.0 x8 ● Intel Ethernet Controller I226-V (2.5GbE) x2 ● SATA 6Gb/s x2 (supports RAID 0 / 1 / 5) ● PCI Express Gen5 x16 x1, PCI Express Gen4 x4 x1, PCI Express Gen4 x1 x1 * This model does not include memory, storage, or OS.

Features: ● Intel Core Ultra 200S series processor LGA 1851 socket (up to 125W) (CPU sold separately) ● DDR5 6400MT/s dual-channel compatible, CU-DIMM/U-DIMM x4 (up to 256GB) (sold separately) ● M.2 M-Key x2, E-Key x1, B-Key x1 ● USB 3.2 x8, USB 2.0 x6 ● 2.5GbE LAN x3 ● SATA 6Gb/s x2 (supports RAID 0 / 1 / 5) ● PCIe Gen5 x16 x1, PCIe Gen4 x4 x2, PCIe Gen4 x1 x1 ● Compatible with ATX power supply * This model does not include memory, storage, or OS.

Features: ● Supports Intel Core Ultra 200S series processors with Intel H810 chipset and LGA1851 socket (up to 125W) (CPU sold separately) ● DDR5 CSO-DIMM x2 (up to 128GB) (memory sold separately) ● 2.5GbE LAN x2 ● HDMI x2, DisplayPort x1, LVDS/eDP x1 (supports simultaneous output of up to 3 screens) ● SATA 6Gb/s x4, M.2 M-Key x1, M.2 E-Key x1, M.2 B-Key x1, PCI Express Gen5 x16 x1 ● USB 3.2 Gen2 x2, USB 2.0 x8, RS-232/422/485 x1, RS-232 x5 ● Compatible with ATX power supply * This model does not include memory, storage, or OS.