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  1. Home
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  3. 京浜ラムテック
  4. Announcement of Exhibition at Kansai Metal Japan by Keihin Ramtech
SEMINAR_EVENT
  • Jun 08, 2021
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Jun 08, 2021

Announcement of Exhibition at Kansai Metal Japan by Keihin Ramtech

京浜ラムテック 京浜ラムテック
We sincerely thank you for your continued patronage. We are pleased to announce that, following last October, our company will be exhibiting at Kansai Metal Japan held in Osaka. We will showcase the upgraded technologies and lineup of Ramtech, which have been enhanced to withstand the challenges posed by the new coronavirus. We kindly ask for your consideration in visiting us. We look forward to seeing you there.
The state of the previous exhibition.
The state of the previous exhibition.
Date and time Wednesday, Jun 23, 2021 ~ Friday, Jun 25, 2021
10:00 AM ~ 05:00 PM
We are fully prepared for COVID-19 measures and waiting for you.
Capital Venue: Intex Osaka Booth Number: Hall 6 B2-2 ◆ Train Access 9 minutes on foot from Cosmo Square Station 8 minutes on foot from Trade Center Mae Station 5 minutes on foot from Naka Futo Station
Entry fee Free If you do not have an invitation ticket, it will cost 5000 yen per person.
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Non-melting joining technology 'Friction Stir Welding' [Joining prototype in progress!]

It's not welding; it achieves low distortion and joint strength close to the base material through solid-state bonding! We help improve conventional welding defects and reduce weight!

At Keihin Ramtech, we have introduced Friction Stir Welding (FSW) and have accumulated expertise in joining technology. We also possess multiple lathes and machining centers, allowing us to provide consistent support from machining to assembly. If you have never used FSW, please feel free to consult us for design support compatible with FSW. We are capable of joining for various industries, from pilot production to large-scale mass production. Please consult us for joining prototypes with various materials and shapes. If you need our services, please contact us. 【Features】 ■ Enables joining with minimal heat input and distortion during the process ■ Specializes in joining difficult-to-weld materials and can be applied to various materials ■ Achieves excellent joinability through mechanical processes *For more details, please refer to the PDF document or feel free to contact us.

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RAM Cathode Principle

Solved the conventional issues! Significantly improved the film formation speed while maintaining low damage characteristics.

In conventional planar sputtering, significant damage was inflicted on the substrate, and in opposing sputtering, the film deposition rate was slow, posing practical challenges. Our "RAM Cathode" successfully generates dense plasma near the target surface by surrounding the target on all sides. By having argon ions collide with great force against the target, we have resolved the issues that existed until now. 【Features】 ■ Reduces damage to the substrate by over 60% compared to conventional planar cathodes ■ Achieves a film deposition rate more than three times that of conventional opposing cathodes *For more details, please refer to the PDF document or feel free to contact us.

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Semiconductor shortage, a must-see for companies facing material shortages. "Functional Materials"

We accept repairs for solar cells, LCDs (compatible up to G10.5), semiconductors, as well as sputtering targets, metal parts, and quartz products.

Our company responds to customer needs with a rich lineup, including target materials, heaters, quartz glass, and other consumables. By applying our unique design thermal analysis simulation technology, we achieve high cooling efficiency and more stable sputtering. We offer a wide range of support, from consultations and proposals for various processing and welding to sputtering targets for solar cells, LCDs (up to G10.5), and semiconductors, as well as surface treatments such as plating and blasting, annealing, cleaning of used protective plates, ultrasonic inspection of materials, and tensile testing. Please feel free to consult with us about anything. 【Product Lineup】 ■ Backing plates for FPDs ■ Backing plates for semiconductors ■ Planar targets ■ Quartz processed products ■ Others *For more details, please refer to the PDF materials or feel free to contact us.

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Solve the challenges of conventional sputtering technology with "RAM Force"!

Reduce damage to the substrate by over 60%! Improve film formation speed while maintaining low damage characteristics.

"RAM Force" is a roll-to-roll sputtering device that can perform multilayer film deposition of optical films and metals on plastic films. Not only can it evaluate the performance of RAM cathodes (low-damage cathodes), but it also allows you to test your applications under lab conditions and transition from pilot lines to mass production lines. 【Features】 ■ Patent obtained ■ Reduces damage to substrates by over 60% * Comparison between conventional planar sputtering and RAM cathodes ■ Increases deposition speed by more than three times * Comparison between conventional opposing sputtering and RAM cathodes ■ Unique technology from Keihin Lamtech * For more details, please refer to the PDF materials or feel free to contact us.

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Related catalog(5)

Low Damage Cathode Equipped R to R Sputtering Device

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Low Damage Cathode Equipped Cluster-Type Sputtering Device

Low Damage Cathode Equipped Cluster-Type Sputtering Device

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FSW (Friction Stir Welding)

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RAM CATHODE Principle

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[Co-sponsorship/Exhibition] 2/11~2/13 JANOG57 Meeting in Osaka | ★★★ Experience the latest infrastructure technologies! Check out the trending storage products at JANOG57.

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  • SEMINAR_EVENT

From February 11 (Wednesday) to February 13 (Friday), Mikasa Trading Co., Ltd. will sponsor the technology conference "JANOG57 Meeting in Osaka" held at the Congre Convention Center. This event provides an open platform for field engineers to freely discuss and share the latest network technologies, practical operational know-how, and case studies of failures. This time, we will be exhibiting a booth in collaboration with Western Digital Marketing LLC, showcasing innovative storage solutions such as the "Ultrastar Data60" and HDDs with a maximum capacity of 30TB. The Ultrastar Data60 is recognized for its ability to efficiently accommodate up to 60 high-quality HDDs while achieving large capacity, low cost, and space-saving design. Additionally, we will display mobile label printers made by Brady Japan at our booth. You will have the opportunity to see products that are actively used in infrastructure development and data management up close. Don't miss this chance to experience the technologies that support the future! We look forward to seeing you at the venue.

Feb 06, 2026

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[Seminar] Latest Trends in Transit-Oriented Development and Town Planning Along the Line

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  • SEMINAR_EVENT

[Key Lecture Content] 1. Where is railway town development headed? ~Understanding next-generation urban development through TOD and smart cities~ SOMPO Institute Plus Co., Ltd. Senior Researcher, Public Policy Research Department, Mariko Miyamoto 1. Trends in compact town development 2. What is TOD (Transit-Oriented Development)? 3. Why TOD now? 4. Next-generation urban development through TOD and smart cities 5. Q&A / Business card exchange 2. Latest trends in TOD at TAKANAWA GATEWAY CITY General Incorporated Association Takanawa Gateway Area Management Executive Director, Yoshinari Amano 1. Collaborative town development centered around the Greater Shinagawa area stations 2. Takanawa Gateway What is the "Ekima-chi Smart City Concept"? 3. Collaboration between urban and railway OS ~Concept of data governance~ 4. Sustainable + mobility creating regional public transportation 5. Summary 6. Q&A / Business card exchange

Feb 06, 2026

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UV Printer & Laser Processing Machine Introduction Consultation Meeting

UV Printer & Laser Processing Machine Introduction Consultation Meeting

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  • SEMINAR_EVENT

This is a practical monetization seminar that clearly explains the process of creating acrylic keychains and how to generate profits, with the opportunity to ask questions on the spot. You will also be able to see the movements of the "BD-8" and laser processing machines at the venue. It's perfect for those who want to start a manufacturing business!

Feb 06, 2026

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Olink User Webinar On Demand

[On-Demand Recording] The Cutting Edge of Olink HT Analysis Supporting Large-Scale Cohort Studies

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  • SEMINAR_EVENT

Olink Explore HT is a next-generation proteomics analysis platform that enables the high-sensitivity and high-throughput measurement of numerous proteins from small sample volumes. In this webinar, we will explain the technical features and utilization points of Olink Explore HT and the new product Reveal, based on our analysis experience using actual BioBank Japan samples. We will also introduce the differences from other platforms such as SomaScan and Illumina Protein Prep, from the perspectives of analysis design and data characteristics. This content will provide practical insights for researchers considering options for proteomics analysis in large cohort studies and biomarker discovery. Speaker: Dr. Akinori Kanai (Associate Professor, Center for Life Data Science, Graduate School of Frontier Sciences, The University of Tokyo)

Feb 06, 2026

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Delayed manufacturing industry DX: To succeed in the new era - The choice of "suitable person in a suitable place" ERP as a foundation for strengthening competitiveness.

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  • SEMINAR_EVENT

In this seminar, we will break down "DX" into five elements in relation to the concept of innovation and explain them with examples. The aim is to deepen the understanding of "DX" itself and clarify what steps should be taken first. Additionally, we will introduce the approach of "suitable personnel in suitable places ERP" as a way to select the foundation for promoting "DX." <Program> - Introduction - The lagging DX in manufacturing and how to succeed in the new era - The choice of "suitable personnel in suitable places" ERP as a foundation for strengthening competitiveness <Recommended for> - Those who are exploring what steps to take towards DX - Business owners, managers in the manufacturing industry, and those responsible for management innovation - System personnel interested in the future of core systems *Applications from competing companies may be declined.

Feb 06, 2026

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