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  1. Home
  2. Electronic Components and Semiconductors
  3. 寺田
  4. [Product Introduction] High-frequency device compatible double-sided wiring process formation technology using transparent substrate.
PRODUCT
  • Dec 01, 2021
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Dec 01, 2021

[Product Introduction] High-frequency device compatible double-sided wiring process formation technology using transparent substrate.

寺田 寺田
The "Dual-Sided Wiring Process Formation Technology" is a manufacturing method developed by our company that reduces materials, processes, energy, and waste in conventional methods, contributing to the protection of the global environment through decarbonization. In our country, research and development is progressing towards the full-scale adoption of 5G, which realizes "ultra-high speed," "ultra-low latency," and "mass simultaneous connections." Compared to the current 4G, 5G requires approximately 100 times the communication capacity and necessitates handling electrical signals in the high-frequency range, but increasing frequency comes with the drawback of increased transmission loss. Currently used materials for transmission substrates, such as polyimide resin, have low dielectric properties, and simply improving wiring technology cannot meet the low transmission loss required in the high-frequency range for 5G. Therefore, the use of materials with superior dielectric properties has become a challenge. This new technology makes it possible to not only create antennas for 5G but also to make transparent millimeter-wave radar antennas that are essential for collision avoidance in autonomous driving, significantly easing the restrictions on antenna installation locations. More detailed information is available in related products and catalogs.
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High-frequency device-compatible double-sided wiring process formation technology using transparent substrates.

[In Development] This is a manufacturing method that reduces materials, processes, energy, and waste in conventional construction methods, contributing to environmental protection through decarbonization.

In our country, research and development is progressing towards the full-scale adoption of 5G, which realizes "ultra-high speed," "ultra-low latency," and "massive simultaneous connections." Compared to the current 4G, 5G requires approximately 100 times the communication capacity and needs to handle electrical signals in the high-frequency range; however, increasing frequency comes with the drawback of increased transmission loss. Currently used transmission substrates, such as polyimide resin, which are commonly employed, have low dielectric properties, and simply improving wiring technology cannot meet the low transmission loss required in the high-frequency range for 5G. Therefore, the use of materials with superior dielectric properties has become a challenge. This new technology will not only make antennas for 5G transparent but also enable the transparency of millimeter-wave radar antennas used for collision avoidance, which is essential for autonomous driving, significantly easing the restrictions on antenna installation locations.

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Related catalog(1)

[Under Development] Development of a Double-Sided Wiring Process Technology for High-Frequency Devices Using Transparent Substrates

[Under Development] Development of a Double-Sided Wiring Process Technology for High-Frequency Devices Using Transparent Substrates

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Electronic Components and Semiconductors
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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

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Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Jun 25, 2026

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AAEON Embedded Compact Fanless PC equipped with Intel Processor N150【UP SQUARED TWL EDGE】

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Features: ● Equipped with Intel Processor N150 ● Onboard memory LPDDR5 8GB ● Onboard storage eMMC 64GB ● GbE RJ-45 x 2 ● USB 3.2 Type-A x 3 ● DP 1.2 / HDMI 2.0b / eDP 1.3 ● RS232/422/485 x 2 ● M.2 2230 E-Key x 1 (PCIe x1, USB2.0 x1) ● M.2 2280 M-Key x 1 (PCIe x2) ● TPM 2.0 ● 12V DC input ● Operating temperature of 0℃ to 60℃ (AC adapter supports 0 to 40℃) * This model does not come with an OS.

Jun 25, 2026

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AAEON Embedded Compact Fanless PC equipped with Intel Processor N150【UP TWLS EDGE】

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Features: ● Equipped with Intel Processor N150 ● Onboard memory LPDDR5 8GB ● Onboard storage eMMC 64GB ● 1 GbE LAN x 1 ● HDMI 1.4b x 1 ● USB 3.2 Gen 2 (Type-A) x 3 ● 12V DC input ● TPM 2.0 ● M.2 2230 E-Key (PCIe[x1], USB2.0 x 1) ● GPIO x 8, COM x 1 ● Operating temperature of the main unit: -20℃ to 60℃ (AC adapter supports 0 to 40℃) * This model does not come with an OS.

Jun 25, 2026

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AAEON Embedded Compact Fanless PC equipped with Intel Processor N150 【UP TWL EDGE】

  • NEW
  • PRODUCT

Features: ● Equipped with Intel Processor N150 ● Onboard memory LPDDR5 8GB ● Onboard storage eMMC 64GB ● 1 GbE LAN x 1 ● HDMI 1.4b x 1 ● USB 3.2 Gen 2 (Type-A) x 3 ● 12V DC input ● TPM 2.0 ● Operating temperature of the main unit: -20℃ to 70℃ (AC adapter supports 0 to 40℃) * This model does not include an operating system.

Jun 25, 2026

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Hyper CLT flooring panel

Make civil engineering sites easier to handle with lightweight mats | Hyper CLT Mats_Civil Engineering_Civil Use

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In civil engineering, there are many situations where temporary roads, workspaces for heavy machinery, access routes, and pedestrian walkways use ground boards. Traditional steel plates are common, but they are heavy and pose challenges in terms of transportation, installation, and removal. Therefore, the "Hyper CLT Ground Board," which utilizes wooden CLT, has garnered attention as a lightweight alternative. The Hyper CLT Ground Board weighs approximately 230 kg for a 5×10 panel and about 460 kg for a 5×20 panel. It is easier to handle compared to steel plates and can be installed easily even with small machinery. It contributes to labor-saving in civil engineering sites by improving efficiency in transportation, reducing movement work on-site, and shortening construction time. Its ease of use in narrow sites or locations where large machinery is difficult to access is a notable feature. Additionally, since it is made of wood, it helps reduce heat reflection in summer, lowers noise levels, and promotes environmental considerations. It can be used for a wide range of applications, including temporary roads, material storage areas, heavy machinery scaffolding, and pedestrian pathways, making it an effective proposal material for creativity and safety measures in public works. The Hyper CLT Ground Board is registered with the Ministry of Land, Infrastructure, Transport and Tourism under the NETIS technology "TH-250021-A." It is recommended as a new alternative to steel plates for sites looking for lightweight ground boards and civil engineering materials. It is also suitable for consideration of introduction.

Jun 25, 2026

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