【Demo unit available for loan!】Wafer High-Pressure Jet Scrubber HPC-8654-H
It is a method for cleaning the wafer surface with a high-pressure jet of pure water in a non-contact manner. 【Features】 ◯ Removal of particles ◯ Removal of particulate contamination ◯ Removal of burrs from the wafer surface
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basic information
It is a method for cleaning the wafer surface with a high-pressure jet of pure water in a non-contact manner. 【Features】 ◯ Removal of particles ◯ Removal of particulate contamination ◯ Removal of burrs from the wafer surface ● For more details, please contact us or download the catalog.
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Applications/Examples of results
Removal of burrs from probe needle marks after inspection Cleaning after CVD and sputtering Removal of carbonized resist after high-dose ion implantation Removal of surface protrusions after aluminum deposition Removal of solder debris after solder bumping
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Company information
Japan Create has been challenging cutting-edge technologies to respond to the diversification of the semiconductor industry with high precision, labor-saving, and miniaturization. We seek infinite possibilities in high technology and create reliable know-how that matches user needs with our uniqueness. We will continue to strive towards high-level technology.