【Demo unit available for loan!】Wafer High-Pressure Jet Scrubber HPC-8654-H
It is a method for cleaning the wafer surface with a high-pressure jet of pure water in a non-contact manner. 【Features】 ◯ Removal of particles ◯ Removal of particulate contamination ◯ Removal of burrs from the wafer surface
Inquire About This Product
basic information
It is a method for cleaning the wafer surface with a high-pressure jet of pure water in a non-contact manner. 【Features】 ◯ Removal of particles ◯ Removal of particulate contamination ◯ Removal of burrs from the wafer surface ● For more details, please contact us or download the catalog.
Price information
-
Delivery Time
Applications/Examples of results
Removal of burrs from probe needle marks after inspection Cleaning after CVD and sputtering Removal of carbonized resist after high-dose ion implantation Removal of surface protrusions after aluminum deposition Removal of solder debris after solder bumping
catalog（1）
Download All Catalogs
Company information
Japan Create has been challenging cutting-edge technologies to respond to the diversification of the semiconductor industry with high precision, labor-saving, and miniaturization. We seek infinite possibilities in high technology and create reliable know-how that matches user needs with our uniqueness. We will continue to strive towards high-level technology.
![[Manufacturing Example] Same Diameter Quick Fastener](https://image.mono.ipros.com/public/product/image/1cb/2000729134/IPROS31273192197640802452.png?w=280&h=280)
![[Process Analysis Instrument Technical Documentation] Online Analysis of TMAH in Developer Solution](https://image.mono.ipros.com/public/product/image/b99/2000810602/IPROS39134235426098024041.jpeg?w=280&h=280)
