No contact medium needed! Non-contact thickness measurement of the substrate from the coating.
Ultrasound is generated within the material through electromagnetic induction, so no contact medium is required. Non-contact is possible from the coating film. 【Features】 ◆ SH wave probe adopted ◆ No coupling agent required ◆ Less affected by surface conditions ◆ 2000 data memory ◆ Data can be transferred to a PC via USB ◆ Correlation process analysis of signals is possible
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basic information
Ultrasound is generated within the material through electromagnetic induction, so no contact medium is required. Non-contact is possible from the coating film. 【Features】 ◆ SH wave probe adopted ◆ No coupling agent required ◆ Less affected by surface conditions ◆ 2000 data memory ◆ Data can be transferred to a PC via USB ◆ Correlation process analysis of signals is possible
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Applications/Examples of results
【Usage Examples】 ● Thickness measurement of aluminum plates, pipes, and spheres ● Detection of non-metallic inclusions ● Delamination inspection ● Corrosion and erosion inspection ● Anisotropy inspection ● Inspection of engine parts ● Inspection of bolt connections 【Application Areas】 ■ Aircraft manufacturing plants ■ Aircraft maintenance ■ Pipe factories ■ Chemical and petroleum plants ■ Power plants ■ Maintenance of bridges, tunnels, and ships etc. *For details on specifications, please download and refer to the catalog.
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Company information
We prepare a wide range of inspection methods and devices, providing suitable inspection methods. To achieve inspection objectives, the selection of optimal means is the first necessity. Our company offers various inspection methods such as UT, ET, MT, PT, RFT, RT, AT, LUT, etc., allowing us to respond broadly to various demands. Furthermore, to meet diverse requirements, we constantly seek the latest technology and make efforts in information gathering and product development to equip ourselves with the most advanced devices from around the world. We assist with all aspects of inspection implementation. Another significant feature of our company is that we do not limit ourselves to merely selling hardware; we independently develop applications, starting with the selection of suitable main devices/probes for the purpose, providing advice on inspection processes, and offering software that includes the development and guidance of inspection methods. Through package sales, we strive to enhance our user support system and technical capabilities to achieve objectives quickly and efficiently.
![High-precision non-contact thickness measurement device [for semiconductor wafers]](https://image.mono.ipros.com/public/product/image/1d5/2000611778/IPROS45880960576095588662.png?w=280&h=280)
