This device measures the thickness of wafers fixed to ceramic plates without contact, using optical probes/sensors.
The measured data can be saved and displayed graphically on the accompanying PC. This device measures the thickness of the wafer attached to the plate and allows you to check the grinding condition before and after grinding while the wafer is attached to the plate.
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basic information
- It is a simple measuring device where the operator sets and removes the workpiece. - Measurement data can be saved in CSV format and displayed graphically on the included computer.
Price range
Delivery Time
Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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