Thickness measurement of compound semiconductor wafers in sizes φ2”, φ4” or φ6”.
This machine is a device for manually measuring the thickness of compound semiconductor wafers in sizes of φ2”, φ4”, or φ6”. Thickness measurements are performed using an optical sensor, with standalone wafers measured by clamping and wafers attached to a flat plate measured from one side. To conduct each type of measurement, two types of measurement stages are prepared, and the sensors are swapped out for the measurements.
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basic information
Compatible with φ2”, φ4” or φ6” sizes.
Price range
Delivery Time
Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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