Thickness measurement of Si, SiC, and other wafers with a diameter of φ100mm to φ150mm.
This machine is a device for manually measuring the thickness of wafers such as Si and SiC with diameters ranging from φ100mm to φ150mm. The thickness measurement is performed using a high-precision contact digital sensor and is conducted on one side.
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basic information
- This device prevents variations caused by operators measuring with micrometers and allows for high-precision and stable measurements. - It is a tabletop model that can be easily installed. It can be used in a way where the main unit is placed on a desk and the control panel is installed on the floor. - The operation of the device and data storage are performed on a computer. It features user-friendly software that runs on Windows.
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Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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