Thickness measurement of various types of wafers below φ4"
This machine is a device that manually measures the thickness of various materials' wafers with a diameter of 4 inches or less. The thickness measurement is performed using a confocal chromatic aberration sensor, measuring the difference between a block gauge or reference wafer and the target wafer in a one-sided measurement.
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basic information
- The manual handle and scale allow for measurement at a designated position. - The wafer is fixed on the stage by vacuum suction, preventing scratches and other damage during measurement. - The measured data is saved in an EXCEL file on the accompanying computer, where the measurement results are displayed clearly.
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Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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