This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.
Set the carrier, and it will automatically measure the pre-set measurement position by operating the [Start] switch. The measurement data will be recorded on the included computer.
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basic information
- Automatic multi-point thickness measurement is possible. - Contact and non-contact methods are selectable. - Please consult us regarding measurement locations, number of measurement points, carrier size, material, etc.
Price range
Delivery Time
Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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