This is a device for measuring the thickness of SiC wafers adhered to a glass plate and the thickness of the adhesive, as well as measuring the thickness of individual SiC wafers.
- The thickness is measured non-contact using an optical probe/sensor. - A porous chuck-type wafer stage is used to uniformly hold thin wafers. - Measurement data is saved in CSV format, in addition to being displayed on the monitor of the accompanying computer. Graphical display is also possible.
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basic information
- Exterior imaging with a camera is possible (optional). - Thickness measurement of Si wafers (including those with tape) is also possible.
Price range
Delivery Time
Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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