Small thin plate etching device FBE40
【Process】Input → Air Knife → Etching → Air Knife → Recirculating Water Wash → Direct Water Wash → Air Knife → Extraction 【Board Size】Min. W50×L50mm Thickness 0.03〜2.0mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1445×L2010×H1230mm - Ideal for material development and testing - Supports from research to small-scale production - Capable of etching PCBs and LCDs
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basic information
◆ The 0.03t FPC can be transported sheet by sheet without jigs due to its unique transport method. ◆ There is no damage from transport rollers even with thin substrates. ◆ The liquid cutting method for thin plates prevents workpiece bending and wrinkling. ◆ Small workpieces (such as ceramic substrates) as small as 2 inches square can be processed. ◆ Being a standard machine, it has a short delivery time. ◆ Customization is possible according to specifications. ◆ Compatible with various etching solutions.
Price information
5.5 million to 6 million yen (price of the equipment itself)
Price range
P6
Delivery Time
※2.5 to 3.5 months
Applications/Examples of results
◆Conditions before setting up the mass production line ◆Evaluation and research of materials and chemicals ◆Basic research and development ◆Quality control ◆Small-scale production
Company information
◆Development, etching, stripping devices/cleaning devices for FPC ◆Development, etching, stripping devices/cleaning devices for COF ◆Development, etching, stripping devices/cleaning devices for FPD (TFT/PDP) ◆Cleaning devices for solar cells ◎Fine technology Fine results cannot be reproduced without a comprehensive design that combines nozzle arrangement, nozzle characteristics, oscillation, pressure adjustment, etc. ◎Thin plate transport technology Experience and proven results are essential for transporting thin plates without damage. The Ninomiya system has incorporated creativity and ingenuity to achieve reliable transport. ◎High reliability Devices designed to achieve a higher level can be used with confidence by our customers. The Ninomiya system does not compromise on device manufacturing.
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