We can handle everything from design to processing with substrate data provision, including measures against soldering issues and bridging.
This is an introduction to the "Dip Carrier Board" handled by Process Lab Micron Co., Ltd.
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basic information
【Features】 ■ Manual masking for connector connection terminals and chip mounting areas can be omitted. ■ Excellent heat resistance and dimensional stability, reducing warping of the substrate during wave soldering, allowing for repeated use. ■ No temperature variation in solder due to heat dissipation like with metal carriers. ■ Reduces thermal stress and the effects of static electricity on electronic components. □ For more details, please refer to the catalog.
Price information
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Price range
P2
Delivery Time
P3
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Applications/Examples of results
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catalog（2）
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Company information
"I always want to be a pioneer." To shape our customers' thoughts into reality, Process Lab Micron is here to help. "Based on a wide range of diverse technologies, we respond precisely to all of our customers' needs." As a top manufacturer of metal masks, our distinguishing feature is that we have continuously developed numerous industry-first technologies with our own hands. Through additive methods and laser processing, we have established new technologies one after another in the world of metal masks, building a technical framework that is "broad and deep." We offer a variety of technical options, from construction methods to support systems, responding precisely to all of our customers' requests. Additionally, to stay closely connected with our customers' sites and incorporate their genuine feedback into product development, we have built a network of bases that covers the entire country.
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