Thin substrate and FPC mounting transport fixture, reflow carrier board. Excellent heat resistance allows for repeated use.
This is an introduction to the reflow carrier board that achieves work efficiency in the reflow process. It can also be used as a component tray necessary for aligning parts, in addition to the reflow process. Due to the non-adhesive nature of the customer's materials, the ease of sticking (surface energy) and the ease of bending (rigidity) vary, so it is necessary to propose products with suitable adhesive strength each time.
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basic information
【Features】 ■ Minimal variation in thickness and good flatness ■ Non-stick processing possible for arbitrary shapes ■ The substrate can adhere without the need for tape fixation □ For more details, please refer to the catalog.
Price information
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Price range
P1
Delivery Time
P3
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Applications/Examples of results
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Company information
"I always want to be a pioneer." To shape our customers' thoughts into reality, Process Lab Micron is here to help. "Based on a wide range of diverse technologies, we respond precisely to all of our customers' needs." As a top manufacturer of metal masks, our distinguishing feature is that we have continuously developed numerous industry-first technologies with our own hands. Through additive methods and laser processing, we have established new technologies one after another in the world of metal masks, building a technical framework that is "broad and deep." We offer a variety of technical options, from construction methods to support systems, responding precisely to all of our customers' requests. Additionally, to stay closely connected with our customers' sites and incorporate their genuine feedback into product development, we have built a network of bases that covers the entire country.
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