We accept the development and production of ultrasonic transducers and ultrasonic oscillators tailored to your needs.
This is a notification from UC Japan Co., Ltd. regarding the "Custom Specification Special Order Transducer Dual Frequency Ultrasonic Transducer." 【Features】 - A unique ultrasonic transducer that allows the use of two resonant frequencies, 65kHz and 135kHz, with a single unit, pioneering in the industry. - It enables instantaneous switching between bonding in the 60kHz range, which typically requires the replacement of the ultrasonic transducer, and bonding in the 130kHz range (high frequency) without needing to replace the transducer. - It can accommodate a variety of applications, such as bonding at 130kHz for the 1ST and bonding at 60kHz for the 2ND. For more details, please contact us or download the catalog.
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.