For printed circuit boards. An alternative to the electroless Ni-P/replacement Au plating process is possible.
The 'Electroless Ni-P/Replacement Au plating process with excellent solder wettability' is a plating process that uses 4Ag, which has similar characteristics to Au, making it an alternative to the electroless Ni-P/Replacement Au plating process. The solder wettability is better immediately after plating compared to the electroless Ni-P/Replacement Au plating. For more details, please contact us or download the catalog.
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basic information
【Features】 ○ This is a plating process that uses 4Ag, which has similar properties to Au, allowing for an alternative to the electroless Ni-P/replacement Au plating process. ○ The solder wettability is better immediately after plating compared to the electroless Ni-P/replacement Au plating. ○ Ideal for printed circuit boards. ○ Provides extensive support from research and development to prototyping and mass production. ● For more details, please contact us or download the catalog.
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Applications/Examples of results
【Usage】 ○Printed Circuit Board
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Company information
Sankyo Co., Ltd. takes a solid step forward and delivers the highest quality as a specialist in surface treatment, capable of accurately responding to changes in the times. Through our work in surface treatment, we will continue to actively engage in D (meeting customer delivery requirements), Q (stable product quality), and C (rationalization for cost reduction), providing products that satisfy society (customers) while achieving the prosperity of the company and the improvement of employees' lives.