Easy operation. High-precision measurement of the outer shape inspection of small glass substrates and panels.
The inspection device "Glass Substrate Outline Inspection Device (PSI-50)" is capable of measuring outer dimensions (maximum width), detecting burrs, detecting chips, inspecting cutting misalignment, and measuring the dimensions of the glass pouring section. It also features a measurement MAP display function and image storage, among others. Additionally, with the automatic angle correction function for the panel, there is no need to precisely align the angle when placing the workpiece on the inspection stage. Once installed, it automatically corrects the angle. If the placed angle is too large, it will affect measurement accuracy, and an alarm will be displayed. For more details, please download the catalog.
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basic information
【Features】 ○ High-precision measurement of the outer shape inspection of small glass substrates and panels ○ Equipped with measurement MAP display function, image saving, etc. ○ Capable of measuring outer dimensions (maximum width), burr detection, chip detection, cutting misalignment inspection, and dimensions of the glass pouring area ○ Automatic angle correction function eliminates the need to precisely align the angle when placing the workpiece on the inspection stage ○ Allows observation of enlarged images of specified areas ● For more details, please contact us or download the catalog.
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Company information
Since our company's establishment in 1986, we have long been engaged in semiconductor-related businesses that support Japan's cutting-edge technology. On the hardware side, we have developed construction and manufacturing environments, including clean rooms. On the human resources side, we have focused on training semiconductor engineers and establishing a service system that can promptly respond to customer needs. Last year, we participated in SEMICON Japan for the first time, and by directly interacting with many industry stakeholders, we were able to learn again what is currently needed and what services should be created. At the same time, the morale within the company has been rising, and we are actively conducting sales activities. It is said that the Japanese economy is finally showing signs of recovery. However, even just looking at the semiconductor industry, the entry of overseas manufacturers and the significant improvement in technology and services are remarkable, so we aim to enhance our international competitiveness in our sales expansion. Not only domestically but also in response to the era of globalization, our role as a hub connecting North America and Asia, especially given our excellent airport access, will further increase.
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