Discharge machining technology using multi-wire and other methods for SiC wafer slicing.
S11012
★What is the promising discharge slicing technology for SiC wafer slicing!? ★You can learn the basics of discharge machining!!
Target Audience: Engineers, researchers, departments, and beginners interested in discharge machining basics and promising discharge slicing technology for SiC wafer slicing. Venue: Kawasaki City Educational and Cultural Center, Room 1【Kanagawa, Kawasaki】 Access: 12-minute walk from JR or Keikyu Line Kawasaki Station Date and Time: October 31, 2011 (Monday) 13:30-16:30 Capacity: 30 participants. *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 people per company. *Limited to Tech-Zone members who apply by October 17. Membership registration is free. *After October 17, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 people per company.
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basic information
Lecturer Yasunori Okamoto, Okayama University, Faculty of Engineering, Special Processing Laboratory
Price range
P2
Delivery Time
P2
Applications/Examples of results
1. Background of Development 2. Principle of Electric Discharge Machining History of Electric Discharge Machining Discharge Phenomenon and Material Removal Action Classification of Electric Discharge Machining Processing Characteristics and Electrical Conditions 3. Slicing with Commercial Wire Electric Discharge Machining Machines 4. Development of Special Electric Discharge Slicing Equipment Evaluation of Contamination Electric Discharge Machinability of High Resistance Materials TTV and Warp 5. Development of Multi-Wire Electric Discharge Slicing Equipment Electric Discharge Pulse Supply Method Processing Fluid Supply Method Influence of Wire Travel Speed Efficiency of Multi-Processing 6. Development of Multi-Wire Electric Discharge Slicing Equipment with Special Electric Discharge Power Supply Characteristics of Special Electric Discharge Power Supply Influence of Wire Travel Conditions on Processing Characteristics Adaptation to High Resistance Materials Influence of Processing Fluid Resistivity on Processing Characteristics 7. Future Directions Thinning and Stabilization of Wire Electrodes High-Tension Wire Electrodes Slicing of SiC Application of Track-Shaped Cross-Section Wire Electrodes Pulse Share System 8. Summary [Q&A and Business Card Exchange]
Company information
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