★Aim for a defect rate of less than 1 ppm in domestic and overseas manufacturing sites! ★Thoroughly analyze and implement countermeasures for defects on-site to prevent the same defects from recurring!
Instructor Mr. Kazuo Kawai, Special Technical Advisor for Small and Medium Enterprises in Kyoto Prefecture / Implementation Technology Advisor Target Audience: Managers and instructors related to lead-free solder technology Venue: Tekuno Kawasaki, 5th Floor, Room 5 [Kanagawa, Kawasaki City] 8 minutes on foot from the East Exit of Tokyu Mizonokuchi Station, 8 minutes on foot from the North Exit of JR Musashi-Mizonokuchi Station Date and Time: November 22, 2011 (Tuesday) 13:00-16:30 Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 people per company *Limited to Tech-Zone members who apply by November 8. Membership registration is free. *After November 8, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 people per company.
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basic information
【Course Purpose】 In recent mass production environments, the standardization of processes has led to a hollowing out of technology, and there is a shortage of skilled personnel due to expansion overseas, resulting in a tendency for a large number of recalls in the market. Additionally, with intense cost competition from overseas products, there is a demand for improvements in production efficiency and costs, yet the same defects continue to occur repeatedly. This time, we will introduce case studies that achieved a defect rate of less than 1 ppm using defect analysis, countermeasures, and verification experiment methods in the field.
Price range
P2
Delivery Time
P2
Applications/Examples of results
【Program】 1. Reflow 1. Role of Flux 1-1 Evaluation Methods for Flux Characteristics 1-2 Selection of Flux (Examples of Defects Caused by Thermal Characteristics of Flux) 2. Temperature Profile 2-1 Creation of Temperature Profile Far Infrared + Air Oven Air Reflow Oven 2-2 Pros and Cons of Preheat 3. Examples of Defect Countermeasures Corresponding to Temperature Profile 3-1 Causes and Countermeasures for Void Formation 3-2 Causes and Countermeasures for Side Ball Formation 3-3 Soldering of Large Components 3-4 Soldering of Low Thermal Resistance Components 3-5 Component Mounting 4. Reflow of Discrete Components 4-1 Connectors 4-2 Soldering of Low Thermal Resistance Components 5. Soldering of Special Components 5-1 High-Temperature Solder 5-2 Soldering of Fine Components (e.g., 0402 Chips) 5-3 Soldering of Heat Dissipation Substrates (Aluminum Substrates, Copper Substrates) 6. Other Substrates 6-1 BGA, QFN, etc. 7. Efficiency Improvement in Switching During Multi-Model Mounting 8. Methods for Determining Quality on Site 2. Flow 3. Retrofitting Modifications 【Q&A, Business Card Exchange】
Company information
Our company has developed its business from "seminar planning" to various forms such as "lecturer dispatch," "publishing planning," "technical consultant dispatch," "trend research," "business matching," and "business development consulting," in order to support clients in a wide range of fields including chemistry, electronics, automotive, energy, medical devices, food, and building materials. By doing so, we have advanced our company and opened up new markets. AndTech promises to continue listening to our clients' voices, entering the business areas and markets they desire, and to remain a company that is loved by our clients, as we share their challenges, think together, and forge new paths.
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