Fundamentals of Spattering and Improvement Measures for Equipment - Improving Film Thickness Distribution from Troubleshooting
S12035
What are the methods for improving film thickness distribution, reducing particles, and enhancing step coverage required during the sputtering process?
Instructor To: Mr. [Name], Department Head, Semiconductor Electronics Technology Research Institute, ULVAC, Inc. Target Audience: Engineers, researchers, and beginners interested in sputtering and thin film technology. Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 2 [Tokyo, Nihonbashi] Access: 5 minutes from B4 exit via underground passage from Bakuroyokoyama Station on the Toei Shinjuku Line (Directions 2) 5 minutes from C1 exit via East Exit ticket gate from Bakurocho Station on the JR Sobu Rapid Line (Directions 3) and others. Date and Time: December 16, 2011 (Friday) 13:30-16:30 Capacity: 20 people. *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 participants from one company. *Limited to Tech-Zone members who apply by December 2. Membership registration is free. *After December 2, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 participants from one company.
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basic information
**Lecture Summary** This presentation will explain the fundamentals of the sputtering method, a thin film formation technology, focusing on key terms. Additionally, it will introduce the characteristics and application developments of various sputtering methods from the perspective of the equipment, as well as examples of improvements and troubleshooting cases.
Price range
P2
Delivery Time
P2
Applications/Examples of results
1. Basics of Sputtering 2. Sputtering Equipment - Basic configuration of sputtering equipment - Improvements and evolution of sputtering equipment - Introduction of equipment for various applications 3. Improvement of Film Thickness Distribution - Factors determining film thickness distribution - Evaporation source and TS distance - Film thickness distribution based on TS distance - Magnetic circuit and its movement - Results of erosion due to plasma movement - Radiation and scattering - Sputtering rate - Incident angle and emission angle - Scattering angle - Sputtering of alloys - Variations in film thickness distribution due to target usage 4. Reduction and Improvement of Particles - Causes of particles - Improvement of mechanical particles - Surface treatment of shields - Particles due to abnormal discharge - Measurement of particles 5. Improvement of Step Coverage - Requirements for improving step coverage - Reasons for the need for coverage - Improvements in sputtering methods - Normal sputtering - Directional sputtering - Collimator sputtering - Long slow sputtering - Bias sputtering - Next-generation sputtering methods
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