★What are the optimal conditions to achieve ideal properties such as moisture resistance and heat resistance!? ★Understand the curing mechanism and process to eliminate defects and flaws!!
Speaker Part 1: Shigeki Inatomi, Technical Advisor at Asahi Organic Chemicals Industry Co., Ltd. (Former Asahi Organic Fellow) Part 2: Masahiko Yamanaka, Group Leader, Technology Development Department, Research and Development Division, Shin Nippon Rika Co., Ltd. Part 3: Tsuneo Kobayashi, Analysis Center, Research Institute, DIC Corporation Target Audience: Engineers and researchers involved in the development and manufacturing of epoxy resins Venue: 【Tokyo, Chuo Ward】Kyouka Square 2F, High-Tech Center, Conference Room 1 1 minute walk from Exit A3 of Hachobori Station (Tokyo Metro Hibiya Line/JR Keiyo Line) 5 minutes walk from Exits A1 and A2 of Takaracho Station (Toei Asakusa Line) Date and Time: February 23, 2012 (Thursday) 11:00 AM - 4:00 PM Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: 【Early Bird Discount Price】52,500 yen (tax included, including text costs) for 2 participants from one company *Limited to Tech-Zone members who apply by February 9. Membership registration is free. *After February 9, the regular price will be 55,650 yen (tax included, including text costs) for 2 participants from one company.
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basic information
**Lecture 1: Purpose of the Course** Phenolic resin-based epoxy resin hardeners are used in electrical and electronic materials applications due to their excellent heat resistance. They are particularly used in semiconductor encapsulants when combined with epoxy resins that also have a phenolic backbone. This presentation will touch on original products developed by the speaker, focusing on phenolic resins and their derivatives as epoxy resin precursors and hardeners. **Lecture 2: Purpose of the Course** An overview will be provided on the types and characteristics of acid anhydrides used as epoxy hardeners, as well as the optimization of formulation ratios and curing conditions. Recent development products will be introduced as case studies. **Lecture 3: Purpose of the Course** This lecture will focus on actual analysis examples being conducted. It will outline the analytical methods for epoxy resins and provide explanations of actual analysis cases for epoxy-based adhesives. The analysis methods for the curing process and cured products will also be explained based on actual analysis examples.
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P2
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P2
Applications/Examples of results
Part 1: Synthesis Technology of Phenolic Resin-Based Hardeners and Improvement of Heat Resistance, Moisture Resistance, and Flame Retardancy 1. Reaction of Epoxy Groups and Phenolic Hydroxyl Groups 2. Applications of Epoxy Resins Using Phenolic Resin-Based Hardeners 3. Required Properties of Phenolic Resin-Based Hardeners 4. Ortho-Cresol Novolac Epoxy Resin / General Purpose IC Encapsulant Using Phenolic Novolac Resin Hardener 5. Phenolic Resins with Special Linkages Used in Advanced IC Encapsulants 6. Methods to Achieve Both Heat Resistance and Moisture Absorption/Flame Retardancy in IC Encapsulants 7. Application of Molecular Weight Narrow Distribution Phenolic Novolac Resin PAPS Series in the Field of Epoxy Resins 8. Effects of Molecular Weight Distribution Ratio on Curing Properties and Physical Properties of Cured Products 9. Effects of Linkage Position Ratio (Ortho/Para) of Hardener Resins on Curing Properties and Physical Properties of Cured Products 10. Phenolic Resins for Epoxy Hardeners Using Special Phenolic Monomers Part 2: Effective Use of Acid Anhydride-Based Epoxy Hardeners According to Purpose 1. Overview of Acid Anhydride-Based Epoxy Hardeners 2. Application Examples and Epoxy Curing Characteristics Part 3: Analysis Techniques for Epoxy Resins and Cured Products 1. Analysis of Epoxy Resins 2. Composition Analysis of Epoxy-Based Adhesives 3. Analysis of Curing Processes and Cured Products
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