A heat dissipation and thermal diffusion product boasting an astonishing thermal conductivity of 1700 W/mk in the vertical (Z) direction, which was unimaginable for graphite-based heat dissipation materials until now!
CompoRoid Rsn is a composite product made from high thermal conductivity graphite and high heat-resistant epoxy resin. It is the most cost-effective resin composite product in the CompoRoid series, achieving both thinness and strength. It efficiently absorbs heat from heat sources such as ICs, LSIs, CPUs, GPUs, and chipsets sized 20 mm or smaller, providing powerful cooling capabilities.
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basic information
Originally, graphite is prone to flaking and becomes brittle when processed thinly, but we have successfully developed a product that balances thinness and strength by sealing and fixing the graphene layers with resin. The resin achieves a strong bond by thoroughly impregnating the graphite, and it has passed over 1000 temperature cycle tests ranging from -40°C to 150°C.
Price information
3,500 yen The price varies depending on the quantity, so please feel free to contact us.
Price range
P1
Delivery Time
※The delivery time may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
Efficiently absorbs heat from heat sources such as ICs/LSIs/CPUs/GPUs/chipsets of 20□mm size or smaller, achieving powerful cooling capability.
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Company information
The encounter with the miraculous 1700 W/mk ultra-high thermal conductivity graphite, which everyone had almost given up on commercializing, was the reason our company, Thermographics, was established on July 1, 2009. As a result of collaborative research and development with numerous customers, we have been developing a range of composite products made from ultra-high thermal conductivity graphite under our original brand "Comproid" since October 2011. Within two years of its launch, Comproid achieved over 150 prototype results and has garnered attention and support mainly from customers in the automotive, aerospace, medical device, and computer industries, with full-scale mass production starting in March 2012.