Efficient production at each engineering integration!!!
<Features> MLCSP, a dual-side alignment exposure device for C-MOS backside wiring. Equipped with an environment (Foup), compatible with GEM300 and OHT. Spin coater and developer can also be integrated, allowing for fully automated processes from resist coating to exposure and development. Patterning is possible (optional). Automatic reticle exchange (optional).
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basic information
Work size: φ200, 300mm Exposure method: Compatible with vacuum contact, hard contact, and proximity Lamp house: 3.5KW or 5KW Illuminance: 20mW/cm² (3.5KW) Illuminance distribution: Within ±5% Tact: 80-100 sheets/H *Demo equipment available
Price information
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Delivery Time
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Applications/Examples of results
MLCSP、Ｃ-MOSno
Company information
We will challenge the unknown world based on optics. The 21st century is said to be the "age of light," with remarkable advancements in optical technology. In our manufacturing company, we aim to accelerate future-oriented technological capabilities centered around "optical technology," actively tackling the information technology, ultra-fine technology, and scientific technology that the times require, and to be a dynamic company that acts swiftly. At the same time, we are committed to continuously promoting innovations suitable for the new century, striving to create safe and reliable products, and to remain a company that is needed by the world, actively working towards a richer society. We sincerely ask for your continued guidance and support.