Case study: Package thermal resistance measurement technology in product environment.

Added to bookmarks
Bookmarks list

Bookmark has been removed
Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.
Free membership registration

last updated：Dec 26, 2019

Wave Technology

Official site

Are you able to measure the thermal resistance of semiconductors correctly? By collaborating with thermal simulation technology, we can solve this!

If you do not understand the characteristics of diodes (PN junctions), which are often used as measurement elements, you may not be able to measure accurately. To correctly determine the package thermal resistance in a product environment, a technology that can evaluate thermal resistance analysis using actual devices with high precision is required. If a consistent model between actual measurements and thermal simulations can be created in the localized heating model, the thermal resistance during arbitrary heating can be solved through simulation. Our company possesses the technology to uniquely design thermal resistance testing equipment, along with a comprehensive contract service from actual measurement to simulation. For more details, please download the catalog or contact us.

Related Link - https://www.wti.jp/contents/simulation.htm/?lfcpid…

Inquire About This Product

basic information

【Conventional Issues】 ○ I want to use a heat source that can reliably identify the operating area, even if it is not the entire chip. ○ I want to supply power while keeping the applied current low to avoid the effects of Joule heating. 【Solution】 ○ Clamp the high-voltage area and generate heat with low current and high voltage. ○ AVCC is expected to have high-voltage clamping. → A breakdown voltage of over 10V is desirable. 【Measurement Effects When Using Clamp Breakdown Voltage】 ○ During clamp heating, the breakdown voltage shifts positively with temperature. → This allows for maintaining a uniform temperature in the relevant area. ○ Current flows through the areas with lower breakdown voltage, raising the temperature. → As the temperature rises, the breakdown voltage drifts positively, resulting in the entire relevant area being automatically controlled to have uniform breakdown voltage and uniform temperature. ● For more details, please download the catalog or contact us.