Achieve direct electroless plating with high adhesion, reduced lead time, and cost reduction!
We have achieved direct electroless plating without the need for a base film such as vapor deposition or sputtering on film substrates, resulting in high adhesion, reduced lead times, and cost savings. Additionally, we can form patterns through etching after plating upon request. Hōwa Sangyō is prepared to assist in research and development for industries with such applications, accommodating even single prototype requests, so please consult us for prototype development. For more details, please contact us or refer to our catalog.
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basic information
【Features】 ○ Does not require a base film such as vapor deposition or sputtering on the film substrate ○ Direct electroless plating achieves high adhesion, shorter delivery times, and cost reduction ○ Pattern formation through etching after plating is possible upon request ○ Can accommodate even from a single prototype 【Sample Product Specifications】 ○ Film provided by: Arakawa Chemical Industries, Ltd. ○ Substrate: Polamin 25μm ○ Surface treatment: Single-sided electroless plating film patterning Base layer Ni (0.5μmt) Surface layer (0.1μmt) ● For more details, please contact us or refer to the catalog.
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Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.
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